TWI293938B - - Google Patents

Download PDF

Info

Publication number
TWI293938B
TWI293938B TW093136741A TW93136741A TWI293938B TW I293938 B TWI293938 B TW I293938B TW 093136741 A TW093136741 A TW 093136741A TW 93136741 A TW93136741 A TW 93136741A TW I293938 B TWI293938 B TW I293938B
Authority
TW
Taiwan
Prior art keywords
substrate
inspection
unit
processing apparatus
processing
Prior art date
Application number
TW093136741A
Other languages
English (en)
Chinese (zh)
Other versions
TW200526494A (en
Inventor
Shinichi Shinozuka
Shigeki Wada
Masami Yamashita
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200526494A publication Critical patent/TW200526494A/zh
Application granted granted Critical
Publication of TWI293938B publication Critical patent/TWI293938B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
TW093136741A 2003-12-09 2004-11-29 Substrate treatment device control method and substrate treatment device TW200526494A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003410105A JP4342921B2 (ja) 2003-12-09 2003-12-09 基板処理装置の制御方法及び基板処理装置

Publications (2)

Publication Number Publication Date
TW200526494A TW200526494A (en) 2005-08-16
TWI293938B true TWI293938B (enExample) 2008-03-01

Family

ID=34674920

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136741A TW200526494A (en) 2003-12-09 2004-11-29 Substrate treatment device control method and substrate treatment device

Country Status (7)

Country Link
US (1) US7529595B2 (enExample)
EP (1) EP1693886A4 (enExample)
JP (1) JP4342921B2 (enExample)
KR (1) KR20060120687A (enExample)
CN (1) CN100452294C (enExample)
TW (1) TW200526494A (enExample)
WO (1) WO2005057633A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4734002B2 (ja) 2005-03-16 2011-07-27 株式会社東芝 検査システム及び半導体装置の製造方法
US20070250202A1 (en) 2006-04-17 2007-10-25 Tokyo Electron Limited Coating and developing system, method of controlling coating and developing system and storage medium
JP4560022B2 (ja) * 2006-09-12 2010-10-13 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP5058744B2 (ja) * 2006-10-12 2012-10-24 東京エレクトロン株式会社 基板の測定方法、プログラム、プログラムを記録したコンピュータ読み取り可能な記録媒体及び基板の処理システム
CN100465797C (zh) * 2007-01-24 2009-03-04 友达光电股份有限公司 具有宏观检测的显影装置
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4957426B2 (ja) 2007-07-19 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4983724B2 (ja) * 2008-05-27 2012-07-25 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法並びに記憶媒体
JP5744382B2 (ja) * 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法
JP4770938B2 (ja) * 2009-02-10 2011-09-14 東京エレクトロン株式会社 基板処理装置
JP2011211218A (ja) * 2011-06-02 2011-10-20 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
CN104267708A (zh) * 2014-10-20 2015-01-07 宜宾丝丽雅股份有限公司 短纤磺化流量信号丢失的检测方法
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10172902A (ja) 1996-12-13 1998-06-26 Nikon Corp 重ね合わせ検査方法
JPH11176912A (ja) * 1997-12-08 1999-07-02 Mitsubishi Electric Corp 半導体基板処理装置及びその制御方法
JP3455458B2 (ja) 1999-02-01 2003-10-14 東京エレクトロン株式会社 塗布、現像装置及び塗布現像処理における基板再生システム
JP2001167996A (ja) * 1999-12-10 2001-06-22 Tokyo Electron Ltd 基板処理装置
JP4069236B2 (ja) * 2000-06-05 2008-04-02 東京エレクトロン株式会社 液処理装置
US7054786B2 (en) * 2000-07-04 2006-05-30 Tokyo Electron Limited Operation monitoring method for treatment apparatus
US6954716B2 (en) * 2000-07-07 2005-10-11 Tokyo Electron Limited Method of automatically resetting processing apparatus
SG94851A1 (en) * 2000-07-12 2003-03-18 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
KR100811964B1 (ko) * 2000-09-28 2008-03-10 동경 엘렉트론 주식회사 레지스트 패턴 형성장치 및 그 방법
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
JP2003037043A (ja) 2001-07-24 2003-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP2003115426A (ja) 2001-07-30 2003-04-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP2003045776A (ja) 2001-07-30 2003-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003100610A (ja) * 2001-09-26 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置制御システムおよび基板処理装置
KR20030026862A (ko) * 2001-09-25 2003-04-03 다이닛뽕스크린 세이조오 가부시키가이샤 기판 처리장치 제어 시스템 및 기판 처리장치
JP3761081B2 (ja) * 2001-11-09 2006-03-29 東京エレクトロン株式会社 基板処理装置
JP2003158050A (ja) * 2001-11-21 2003-05-30 Dainippon Screen Mfg Co Ltd 基板処理システム及び基板検査システム
US6700090B2 (en) * 2002-04-26 2004-03-02 Hitachi High-Technologies Corporation Plasma processing method and plasma processing apparatus

Also Published As

Publication number Publication date
WO2005057633A1 (ja) 2005-06-23
KR20060120687A (ko) 2006-11-27
TW200526494A (en) 2005-08-16
CN1890780A (zh) 2007-01-03
US7529595B2 (en) 2009-05-05
EP1693886A1 (en) 2006-08-23
JP4342921B2 (ja) 2009-10-14
JP2005175052A (ja) 2005-06-30
EP1693886A4 (en) 2011-08-17
US20070088450A1 (en) 2007-04-19
CN100452294C (zh) 2009-01-14

Similar Documents

Publication Publication Date Title
TWI293938B (enExample)
EP1308783B1 (en) Resist coating-developing apparatus
KR100937083B1 (ko) 기판처리장치 및 기판처리방법
CN101517703B (zh) 涂敷、显影装置和涂敷、显影装置的控制方法
WO2008023693A1 (fr) Machine de développement de revêtement, dispositif de formation de motif de réserve, procédé de développement de revêtement, procédé de formation de motif de réserve, et support de stockage
CN103854974B (zh) 用于处理基板的设备和方法
TW201230226A (en) Heat treatment method, recording medium having recorded program for executing heat treatment method, and heat treatment apparatus
KR20080076713A (ko) 기판 처리 방법 및 기판 처리 장치
TW201222626A (en) Heat treatment method, recording medium having recorded program for executing heat treatment method, and heat treatment apparatus
JP3801849B2 (ja) 基板処理装置及びその方法
US20160320713A1 (en) Substrate treatment system, substrate transfer method, and computer storage medium
JP4983724B2 (ja) 塗布、現像装置及び塗布、現像方法並びに記憶媒体
TW200525678A (en) Line width measuring method, substrate processing method, substrate processing apparatus and substrate cooling processing unit
JP5258082B2 (ja) 基板処理装置及び基板処理方法
TW200913118A (en) Coating/developing device, operation method of coating/developing device, and storage medium
TWI305932B (enExample)
JP4422000B2 (ja) 基板処理方法、制御プログラム、およびコンピューター記憶媒体
TWI305934B (enExample)
US7822574B2 (en) Substrate measuring method, computer-readable recording medium recording program thereon, and substrate processing system
JP5005720B2 (ja) 基板処理装置の制御方法及び基板処理装置
JP2011211218A (ja) 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
KR20050076116A (ko) 기판 처리 방법

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent