TWI305932B - - Google Patents

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Publication number
TWI305932B
TWI305932B TW095134342A TW95134342A TWI305932B TW I305932 B TWI305932 B TW I305932B TW 095134342 A TW095134342 A TW 095134342A TW 95134342 A TW95134342 A TW 95134342A TW I305932 B TWI305932 B TW I305932B
Authority
TW
Taiwan
Prior art keywords
pattern
heat treatment
substrate
target
state
Prior art date
Application number
TW095134342A
Other languages
English (en)
Chinese (zh)
Other versions
TW200729280A (en
Inventor
Kunie Ogata
Michio Tanaka
Hiroshi Tomita
Ryoichi Uemura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200729280A publication Critical patent/TW200729280A/zh
Application granted granted Critical
Publication of TWI305932B publication Critical patent/TWI305932B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3071—Process control means, e.g. for replenishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW095134342A 2005-09-15 2006-09-15 Substrate treating apparatus, method and program, and computer-readable recording medium for recording the program TW200729280A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005268192 2005-09-15
JP2006179726A JP4570164B2 (ja) 2005-09-15 2006-06-29 基板処理装置、基板処理方法、基板処理プログラム、及びそのプログラムを記録したコンピュータ読み取り可能な記録媒体

Publications (2)

Publication Number Publication Date
TW200729280A TW200729280A (en) 2007-08-01
TWI305932B true TWI305932B (enExample) 2009-02-01

Family

ID=37864964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134342A TW200729280A (en) 2005-09-15 2006-09-15 Substrate treating apparatus, method and program, and computer-readable recording medium for recording the program

Country Status (5)

Country Link
US (1) US7867673B2 (enExample)
JP (1) JP4570164B2 (enExample)
KR (1) KR101072282B1 (enExample)
TW (1) TW200729280A (enExample)
WO (1) WO2007032372A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI490936B (zh) * 2010-05-31 2015-07-01 東京威力科創股份有限公司 A substrate processing apparatus, a substrate processing method, and a recording medium on which a computer program for carrying out the substrate processing method is recorded

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4891139B2 (ja) 2007-04-20 2012-03-07 東京エレクトロン株式会社 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体
JP4969304B2 (ja) * 2007-04-20 2012-07-04 東京エレクトロン株式会社 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体
US8688254B2 (en) * 2007-06-15 2014-04-01 Taiwan Semiconductor Manufacturing Company, Ltd. Multiple tools using a single data processing unit
JP5258082B2 (ja) 2007-07-12 2013-08-07 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR20090069603A (ko) * 2007-12-26 2009-07-01 주식회사 동부하이텍 반도체 장치의 작업 파일 제어 방법
JP5160920B2 (ja) * 2008-02-22 2013-03-13 ルネサスエレクトロニクス株式会社 半導体装置の製造方法、半導体装置の製造装置、及び製造プログラム
JP2014003164A (ja) * 2012-06-19 2014-01-09 Tokyo Electron Ltd 半導体装置の製造方法及び半導体装置並びに半導体装置の製造システム
US10409171B2 (en) 2017-01-25 2019-09-10 Kla-Tencor Corporation Overlay control with non-zero offset prediction
JP7515323B2 (ja) * 2020-07-09 2024-07-12 東京エレクトロン株式会社 検査装置及び基板搬送方法
JP7645139B2 (ja) 2021-06-22 2025-03-13 東京エレクトロン株式会社 検査方法及び検査システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211630A (ja) * 1994-01-26 1995-08-11 Sony Corp パターン形成方法及びその装置
JPH07311630A (ja) * 1994-05-18 1995-11-28 Fujitsu Ltd クロック切り替え回路および本回路を有するプリンタ装置
JP3644315B2 (ja) * 1999-07-30 2005-04-27 ダイキン工業株式会社 インバータ装置
JP2001143850A (ja) * 1999-09-03 2001-05-25 Tokyo Electron Ltd 基板の加熱処理装置，基板の加熱処理方法，基板処理装置及び基板処理方法
US6402509B1 (en) * 1999-09-03 2002-06-11 Tokyo Electron, Limited Substrate processing apparatus and substrate processing method
KR100811964B1 (ko) * 2000-09-28 2008-03-10 동경 엘렉트론 주식회사 레지스트 패턴 형성장치 및 그 방법
JP2002324744A (ja) * 2001-04-25 2002-11-08 Hitachi Ltd 半導体装置の製造方法
EP1273973A1 (en) * 2001-07-03 2003-01-08 Infineon Technologies SC300 GmbH & Co. KG Method for adjusting a temperature in a resist process
JP4127664B2 (ja) * 2003-06-30 2008-07-30 株式会社東芝 現像処理装置の調整方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI490936B (zh) * 2010-05-31 2015-07-01 東京威力科創股份有限公司 A substrate processing apparatus, a substrate processing method, and a recording medium on which a computer program for carrying out the substrate processing method is recorded

Also Published As

Publication number Publication date
TW200729280A (en) 2007-08-01
JP2007110079A (ja) 2007-04-26
KR101072282B1 (ko) 2011-10-11
US7867673B2 (en) 2011-01-11
JP4570164B2 (ja) 2010-10-27
KR20080049017A (ko) 2008-06-03
US20090162759A1 (en) 2009-06-25
WO2007032372A1 (ja) 2007-03-22

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