CN100452294C - 基板处理装置的控制方法以及基板处理装置 - Google Patents

基板处理装置的控制方法以及基板处理装置 Download PDF

Info

Publication number
CN100452294C
CN100452294C CNB2004800364962A CN200480036496A CN100452294C CN 100452294 C CN100452294 C CN 100452294C CN B2004800364962 A CNB2004800364962 A CN B2004800364962A CN 200480036496 A CN200480036496 A CN 200480036496A CN 100452294 C CN100452294 C CN 100452294C
Authority
CN
China
Prior art keywords
substrate
inspection
flow process
processing
batch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2004800364962A
Other languages
English (en)
Chinese (zh)
Other versions
CN1890780A (zh
Inventor
筱塚真一
和田荣希
山下刚秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1890780A publication Critical patent/CN1890780A/zh
Application granted granted Critical
Publication of CN100452294C publication Critical patent/CN100452294C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
CNB2004800364962A 2003-12-09 2004-11-30 基板处理装置的控制方法以及基板处理装置 Expired - Lifetime CN100452294C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003410105A JP4342921B2 (ja) 2003-12-09 2003-12-09 基板処理装置の制御方法及び基板処理装置
JP410105/2003 2003-12-09

Publications (2)

Publication Number Publication Date
CN1890780A CN1890780A (zh) 2007-01-03
CN100452294C true CN100452294C (zh) 2009-01-14

Family

ID=34674920

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800364962A Expired - Lifetime CN100452294C (zh) 2003-12-09 2004-11-30 基板处理装置的控制方法以及基板处理装置

Country Status (7)

Country Link
US (1) US7529595B2 (enExample)
EP (1) EP1693886A4 (enExample)
JP (1) JP4342921B2 (enExample)
KR (1) KR20060120687A (enExample)
CN (1) CN100452294C (enExample)
TW (1) TW200526494A (enExample)
WO (1) WO2005057633A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4734002B2 (ja) 2005-03-16 2011-07-27 株式会社東芝 検査システム及び半導体装置の製造方法
US20070250202A1 (en) 2006-04-17 2007-10-25 Tokyo Electron Limited Coating and developing system, method of controlling coating and developing system and storage medium
JP4560022B2 (ja) * 2006-09-12 2010-10-13 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP5058744B2 (ja) * 2006-10-12 2012-10-24 東京エレクトロン株式会社 基板の測定方法、プログラム、プログラムを記録したコンピュータ読み取り可能な記録媒体及び基板の処理システム
CN100465797C (zh) * 2007-01-24 2009-03-04 友达光电股份有限公司 具有宏观检测的显影装置
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4957426B2 (ja) 2007-07-19 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4983724B2 (ja) * 2008-05-27 2012-07-25 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法並びに記憶媒体
JP5744382B2 (ja) * 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法
JP4770938B2 (ja) * 2009-02-10 2011-09-14 東京エレクトロン株式会社 基板処理装置
JP2011211218A (ja) * 2011-06-02 2011-10-20 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
CN104267708A (zh) * 2014-10-20 2015-01-07 宜宾丝丽雅股份有限公司 短纤磺化流量信号丢失的检测方法
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10172902A (ja) * 1996-12-13 1998-06-26 Nikon Corp 重ね合わせ検査方法
CN1219757A (zh) * 1997-12-08 1999-06-16 三菱电机株式会社 半导体衬底处理装置及其控制方法
JP2001167996A (ja) * 1999-12-10 2001-06-22 Tokyo Electron Ltd 基板処理装置
CN1333552A (zh) * 2000-07-12 2002-01-30 东京毅力科创株式会社 基板处理装置及基板处理方法
JP2002064075A (ja) * 2000-06-05 2002-02-28 Tokyo Electron Ltd 液処理装置および液処理方法
US20020170671A1 (en) * 2001-05-21 2002-11-21 Minoru Matsushita Processing apparatus, transferring apparatus and transferring method
JP2003037043A (ja) * 2001-07-24 2003-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP2003045776A (ja) * 2001-07-30 2003-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
US20030060917A1 (en) * 2001-09-25 2003-03-27 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus control system and substrate processing apparatus
JP2003100610A (ja) * 2001-09-26 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置制御システムおよび基板処理装置
JP2003115426A (ja) * 2001-07-30 2003-04-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP2003151878A (ja) * 2001-11-09 2003-05-23 Tokyo Electron Ltd 基板処理装置
JP2003158050A (ja) * 2001-11-21 2003-05-30 Dainippon Screen Mfg Co Ltd 基板処理システム及び基板検査システム
CN1451174A (zh) * 2000-07-04 2003-10-22 东京毅力科创株式会社 处理装置运转的监视方法
US20030201256A1 (en) * 2002-04-26 2003-10-30 Susumu Tauchi Plasma processing method and plasma processing apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3455458B2 (ja) 1999-02-01 2003-10-14 東京エレクトロン株式会社 塗布、現像装置及び塗布現像処理における基板再生システム
US6954716B2 (en) * 2000-07-07 2005-10-11 Tokyo Electron Limited Method of automatically resetting processing apparatus
KR100811964B1 (ko) * 2000-09-28 2008-03-10 동경 엘렉트론 주식회사 레지스트 패턴 형성장치 및 그 방법

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10172902A (ja) * 1996-12-13 1998-06-26 Nikon Corp 重ね合わせ検査方法
CN1219757A (zh) * 1997-12-08 1999-06-16 三菱电机株式会社 半导体衬底处理装置及其控制方法
JP2001167996A (ja) * 1999-12-10 2001-06-22 Tokyo Electron Ltd 基板処理装置
JP2002064075A (ja) * 2000-06-05 2002-02-28 Tokyo Electron Ltd 液処理装置および液処理方法
CN1451174A (zh) * 2000-07-04 2003-10-22 东京毅力科创株式会社 处理装置运转的监视方法
CN1333552A (zh) * 2000-07-12 2002-01-30 东京毅力科创株式会社 基板处理装置及基板处理方法
US20020170671A1 (en) * 2001-05-21 2002-11-21 Minoru Matsushita Processing apparatus, transferring apparatus and transferring method
JP2003037043A (ja) * 2001-07-24 2003-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP2003115426A (ja) * 2001-07-30 2003-04-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP2003045776A (ja) * 2001-07-30 2003-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
US20030060917A1 (en) * 2001-09-25 2003-03-27 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus control system and substrate processing apparatus
JP2003100610A (ja) * 2001-09-26 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置制御システムおよび基板処理装置
JP2003151878A (ja) * 2001-11-09 2003-05-23 Tokyo Electron Ltd 基板処理装置
JP2003158050A (ja) * 2001-11-21 2003-05-30 Dainippon Screen Mfg Co Ltd 基板処理システム及び基板検査システム
US20030201256A1 (en) * 2002-04-26 2003-10-30 Susumu Tauchi Plasma processing method and plasma processing apparatus

Also Published As

Publication number Publication date
WO2005057633A1 (ja) 2005-06-23
KR20060120687A (ko) 2006-11-27
TW200526494A (en) 2005-08-16
TWI293938B (enExample) 2008-03-01
CN1890780A (zh) 2007-01-03
US7529595B2 (en) 2009-05-05
EP1693886A1 (en) 2006-08-23
JP4342921B2 (ja) 2009-10-14
JP2005175052A (ja) 2005-06-30
EP1693886A4 (en) 2011-08-17
US20070088450A1 (en) 2007-04-19

Similar Documents

Publication Publication Date Title
KR100937083B1 (ko) 기판처리장치 및 기판처리방법
US8408158B2 (en) Coating/developing device and method
CN100452294C (zh) 基板处理装置的控制方法以及基板处理装置
KR101070342B1 (ko) 도포막 형성 장치 및 도포막 형성 방법
US8888387B2 (en) Coating and developing apparatus and method
US6790286B2 (en) Substrate processing apparatus
KR101443420B1 (ko) 기판의 처리 방법 및 기판의 처리 시스템
EP1184895A2 (en) Substrate processing apparatus and substrate inspection method
KR20020006469A (ko) 기판처리장치 및 기판처리방법
KR100919084B1 (ko) 기판처리장치 및 기판반송방법
TWI579898B (zh) 基板處理系統、基板運送方法、程式及電腦記憶媒體
JP3801849B2 (ja) 基板処理装置及びその方法
TWI545674B (zh) A substrate processing apparatus, a substrate processing method, and a substrate processing system
TW201515137A (zh) 基板處理裝置、基板處理方法、暨基板處理系統
US7676296B2 (en) Substrate processing system, substrate processing method and computer-readable storage medium storing verification program
JP4422000B2 (ja) 基板処理方法、制御プログラム、およびコンピューター記憶媒体
KR20060048322A (ko) 작은 랏 크기 리소그래피 베이
JP5005720B2 (ja) 基板処理装置の制御方法及び基板処理装置
KR100478499B1 (ko) 반도체 웨이퍼의 검사장치
TW202516284A (zh) 基板處理設備、基板處理方法及物品製造方法
KR20030094903A (ko) 반도체 제조용 포토설비의 웨이퍼 이송장치
KR20060074402A (ko) 레티클 관리 방법
KR20060076081A (ko) 오버레이 측정 장비의 동작 제어 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20090114

CX01 Expiry of patent term