JP4338150B2 - 発泡ポリウレタンおよびその製造方法 - Google Patents

発泡ポリウレタンおよびその製造方法 Download PDF

Info

Publication number
JP4338150B2
JP4338150B2 JP2003357387A JP2003357387A JP4338150B2 JP 4338150 B2 JP4338150 B2 JP 4338150B2 JP 2003357387 A JP2003357387 A JP 2003357387A JP 2003357387 A JP2003357387 A JP 2003357387A JP 4338150 B2 JP4338150 B2 JP 4338150B2
Authority
JP
Japan
Prior art keywords
polishing
raw material
polyol
foamed polyurethane
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003357387A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005120253A5 (https=
JP2005120253A (ja
Inventor
和彦 橋阪
雅巳 太田
邦恭 城
正一郎 河野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Chemical Industries Ltd
Toray Industries Inc
Original Assignee
Sanyo Chemical Industries Ltd
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Chemical Industries Ltd, Toray Industries Inc filed Critical Sanyo Chemical Industries Ltd
Priority to JP2003357387A priority Critical patent/JP4338150B2/ja
Publication of JP2005120253A publication Critical patent/JP2005120253A/ja
Publication of JP2005120253A5 publication Critical patent/JP2005120253A5/ja
Application granted granted Critical
Publication of JP4338150B2 publication Critical patent/JP4338150B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2003357387A 2003-10-17 2003-10-17 発泡ポリウレタンおよびその製造方法 Expired - Fee Related JP4338150B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003357387A JP4338150B2 (ja) 2003-10-17 2003-10-17 発泡ポリウレタンおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003357387A JP4338150B2 (ja) 2003-10-17 2003-10-17 発泡ポリウレタンおよびその製造方法

Publications (3)

Publication Number Publication Date
JP2005120253A JP2005120253A (ja) 2005-05-12
JP2005120253A5 JP2005120253A5 (https=) 2006-09-14
JP4338150B2 true JP4338150B2 (ja) 2009-10-07

Family

ID=34614289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003357387A Expired - Fee Related JP4338150B2 (ja) 2003-10-17 2003-10-17 発泡ポリウレタンおよびその製造方法

Country Status (1)

Country Link
JP (1) JP4338150B2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012141328A1 (ja) 2011-04-15 2012-10-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
WO2012141327A1 (ja) 2011-04-15 2012-10-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
WO2012141329A1 (ja) 2011-04-15 2012-10-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
WO2013058183A1 (ja) 2011-10-18 2013-04-25 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
KR101779546B1 (ko) * 2016-06-22 2017-09-18 에스케이씨 주식회사 연마패드 및 이의 제조방법

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007044858A (ja) * 2005-08-12 2007-02-22 Nitta Haas Inc 研磨布の製造方法および研磨布
JP5145683B2 (ja) * 2006-07-20 2013-02-20 東レ株式会社 研磨方法、研磨パッド、研磨パッドの製造方法
WO2008012909A1 (fr) 2006-07-28 2008-01-31 Toray Industries, Inc. Structure de réseaux polymères interpénétrés et tampon de polissage et procédés permettant de les fabriquer
JP5371251B2 (ja) * 2007-01-30 2013-12-18 東レ株式会社 研磨パッド
JP5184200B2 (ja) * 2007-07-06 2013-04-17 東洋ゴム工業株式会社 研磨パッド
JP5100241B2 (ja) * 2007-08-01 2012-12-19 東洋ゴム工業株式会社 研磨パッド及びその製造方法
DE102007049811B4 (de) * 2007-10-17 2016-07-28 Peter Wolters Gmbh Läuferscheibe, Verfahren zur Beschichtung einer Läuferscheibe sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
JP5251877B2 (ja) 2008-01-30 2013-07-31 旭硝子株式会社 磁気ディスク用ガラス基板の製造方法
JP5233621B2 (ja) 2008-12-02 2013-07-10 旭硝子株式会社 磁気ディスク用ガラス基板及びその製造方法。
JP5521243B2 (ja) * 2009-07-03 2014-06-11 日本発條株式会社 研磨保持用パッド
KR101485073B1 (ko) * 2010-09-15 2015-01-22 주식회사 엘지화학 지지 패드용 폴리우레탄 수지 조성물 및 이를 이용한 폴리우레탄 지지 패드
WO2019131886A1 (ja) * 2017-12-27 2019-07-04 ニッタ・ハース株式会社 研磨パッド
JP6971839B2 (ja) * 2017-12-27 2021-11-24 ニッタ・デュポン株式会社 研磨パッド
JP7734485B2 (ja) * 2020-12-24 2025-09-05 ニッタ・デュポン株式会社 研磨布
JP7813053B2 (ja) * 2021-08-04 2026-02-12 ユニヴァーサル フォトニクス ファーイースト インク 研磨パッド

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012141328A1 (ja) 2011-04-15 2012-10-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
WO2012141327A1 (ja) 2011-04-15 2012-10-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
WO2012141329A1 (ja) 2011-04-15 2012-10-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
KR20140035375A (ko) 2011-04-15 2014-03-21 후지보홀딩스가부시끼가이샤 연마 패드 및 그의 제조 방법
KR20140035374A (ko) 2011-04-15 2014-03-21 후지보홀딩스가부시끼가이샤 연마 패드 및 그의 제조 방법
US9011212B2 (en) 2011-04-15 2015-04-21 Fujibo Holdings, Inc. Polishing pad and manufacturing method therefor
US9381612B2 (en) 2011-04-15 2016-07-05 Fujibo Holdings, Inc. Polishing pad and manufacturing method therefor
US10065286B2 (en) 2011-04-15 2018-09-04 Fujibo Holdings, Inc. Polishing pad and manufacturing method therefor
WO2013058183A1 (ja) 2011-10-18 2013-04-25 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
KR20140075795A (ko) 2011-10-18 2014-06-19 후지보홀딩스가부시끼가이샤 연마 패드 및 그의 제조 방법
US9149905B2 (en) 2011-10-18 2015-10-06 Fujibo Holdings, Inc. Polishing pad and method for producing same
KR101779546B1 (ko) * 2016-06-22 2017-09-18 에스케이씨 주식회사 연마패드 및 이의 제조방법

Also Published As

Publication number Publication date
JP2005120253A (ja) 2005-05-12

Similar Documents

Publication Publication Date Title
JP4338150B2 (ja) 発泡ポリウレタンおよびその製造方法
KR101455218B1 (ko) 연마 패드
US7470170B2 (en) Polishing pad and method for manufacture of semiconductor device using the same
JP4261586B2 (ja) 研磨パッドの製造方法
JP5254729B2 (ja) 研磨パッド
TWI222390B (en) Polishing pad and its production method
CN100551626C (zh) 研磨垫及其制造方法
TW201130871A (en) Pad for chemical mechanical polishing and method of chemical mechanical polishing using same
WO2012077592A1 (ja) 化学機械研磨パッドおよびそれを用いた化学機械研磨方法
JP4986129B2 (ja) 研磨パッド
CN102883857B (zh) 研磨垫以及玻璃基板的制造方法
JP5528169B2 (ja) 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
JP4775898B2 (ja) 積層シート
JP2022154128A (ja) 研磨パッド及び研磨加工物の製造方法
CN116887946B (zh) 研磨垫及研磨垫的制造方法
JP4701066B2 (ja) ポリウレタンフォームおよびその製造方法
JP2023049879A (ja) 研磨パッド
JP2010253665A (ja) 研磨シートおよび研磨パッドの製造方法
WO2022071383A1 (ja) 研磨パッド
JP7756531B2 (ja) 研磨パッド
JP2020075306A (ja) 研磨パッド
JP2007238788A (ja) ポリウレタンフォームの製造方法
JP2022155532A (ja) 研磨パッド及び研磨加工物の製造方法
WO2022210676A1 (ja) 研磨パッド及び研磨パッドの製造方法
JP2024039241A (ja) 研磨パッド及び研磨パッドの製造方法

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20050801

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20050801

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050829

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20050801

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20050829

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060801

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060801

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080929

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081007

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090312

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090407

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090513

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090609

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090627

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120710

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120710

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130710

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees