JP4315187B2 - 携帯電子機器 - Google Patents

携帯電子機器 Download PDF

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Publication number
JP4315187B2
JP4315187B2 JP2006312666A JP2006312666A JP4315187B2 JP 4315187 B2 JP4315187 B2 JP 4315187B2 JP 2006312666 A JP2006312666 A JP 2006312666A JP 2006312666 A JP2006312666 A JP 2006312666A JP 4315187 B2 JP4315187 B2 JP 4315187B2
Authority
JP
Japan
Prior art keywords
housing
casing
radiation film
portable electronic
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006312666A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008130729A (ja
Inventor
元気 遠藤
修 中村
雅治 塩谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP2006312666A priority Critical patent/JP4315187B2/ja
Priority to CNA2007101596996A priority patent/CN101188924A/zh
Priority to US11/942,830 priority patent/US20080117599A1/en
Publication of JP2008130729A publication Critical patent/JP2008130729A/ja
Priority to JP2009060494A priority patent/JP4894873B2/ja
Application granted granted Critical
Publication of JP4315187B2 publication Critical patent/JP4315187B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Fuel Cell (AREA)
  • Secondary Cells (AREA)
  • Studio Devices (AREA)
  • Telephone Set Structure (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
JP2006312666A 2006-11-20 2006-11-20 携帯電子機器 Expired - Fee Related JP4315187B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006312666A JP4315187B2 (ja) 2006-11-20 2006-11-20 携帯電子機器
CNA2007101596996A CN101188924A (zh) 2006-11-20 2007-11-20 便携电子设备
US11/942,830 US20080117599A1 (en) 2006-11-20 2007-11-20 Portable electronic device
JP2009060494A JP4894873B2 (ja) 2006-11-20 2009-03-13 携帯電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006312666A JP4315187B2 (ja) 2006-11-20 2006-11-20 携帯電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009060494A Division JP4894873B2 (ja) 2006-11-20 2009-03-13 携帯電子機器

Publications (2)

Publication Number Publication Date
JP2008130729A JP2008130729A (ja) 2008-06-05
JP4315187B2 true JP4315187B2 (ja) 2009-08-19

Family

ID=39416713

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006312666A Expired - Fee Related JP4315187B2 (ja) 2006-11-20 2006-11-20 携帯電子機器
JP2009060494A Expired - Fee Related JP4894873B2 (ja) 2006-11-20 2009-03-13 携帯電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009060494A Expired - Fee Related JP4894873B2 (ja) 2006-11-20 2009-03-13 携帯電子機器

Country Status (3)

Country Link
US (1) US20080117599A1 (enExample)
JP (2) JP4315187B2 (enExample)
CN (1) CN101188924A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4450070B2 (ja) * 2007-12-28 2010-04-14 ソニー株式会社 電子機器
JP2010020119A (ja) * 2008-07-11 2010-01-28 Hitachi Ltd 平面型表示機器
JP5408528B2 (ja) * 2009-01-19 2014-02-05 日本電気株式会社 電子機器
JP2010198927A (ja) * 2009-02-25 2010-09-09 Ssec Kk Ｌｅｄランプ
JP5712657B2 (ja) * 2011-02-16 2015-05-07 日産自動車株式会社 電池ケースおよび電池ケースの取付け構造
JP2012174767A (ja) * 2011-02-18 2012-09-10 Kyoshin Kogyo Co Ltd ヒートシンク及びヒートシンクの製造方法
EP2554935B1 (en) * 2011-08-01 2014-02-26 Continental Automotive GmbH Apparatus for passive cooling
US9329647B2 (en) * 2014-05-19 2016-05-03 Microsoft Technology Licensing, Llc Computing device having a spectrally selective radiation emission device
EP2982941B1 (en) * 2014-08-07 2019-02-27 Conti Temic microelectronic GmbH Sensor device housing
JP6406216B2 (ja) * 2015-11-09 2018-10-17 トヨタ自動車株式会社 金属製の筐体の製造方法
JP6528741B2 (ja) * 2016-08-24 2019-06-12 トヨタ自動車株式会社 ヒートシンクの製造方法
CN206930887U (zh) * 2017-05-27 2018-01-26 深圳市光峰光电技术有限公司 一种投影设备
CN107566565A (zh) * 2017-08-29 2018-01-09 努比亚技术有限公司 摄像头散热组件、移动终端及散热控制方法
US20190263330A1 (en) * 2018-02-26 2019-08-29 Trw Automotive U.S. Llc Driver assist system
JP7131439B2 (ja) * 2019-03-07 2022-09-06 株式会社オートネットワーク技術研究所 外装部材及びワイヤハーネス

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0484496A (ja) * 1990-07-27 1992-03-17 Nippon Light Metal Co Ltd 電子機器用筺体
US5473511A (en) * 1994-05-05 1995-12-05 Ford Motor Company Printed circuit board with high heat dissipation
JPH0944269A (ja) * 1995-07-25 1997-02-14 Fujitsu Ltd 電子機器および電子機器用筐体並びに筐体の製造方法
FR2810845B1 (fr) * 2000-06-23 2002-08-23 Alstom Module de puissance a composants electroniques de puissance et procede de fabrication d'un tel module
JP2002344178A (ja) * 2001-05-17 2002-11-29 Denso Corp 電子装置
JP3910112B2 (ja) * 2002-06-21 2007-04-25 シャープ株式会社 カメラ付携帯電話機
JP2004140031A (ja) * 2002-10-15 2004-05-13 Matsushita Electric Works Ltd 電子回路モジュール
JP2004200199A (ja) * 2002-12-16 2004-07-15 Oki Electric Ind Co Ltd 放熱シート
JP4044003B2 (ja) * 2003-06-19 2008-02-06 株式会社東芝 携帯用情報機器
JP2005317742A (ja) * 2004-04-28 2005-11-10 Ceramission Kk 密閉構造体用放熱装置
JP4237723B2 (ja) * 2005-03-30 2009-03-11 株式会社東芝 燃料電池を用いた通信端末及びその電源管理システム並びに燃料貯蔵器購入の課金方法

Also Published As

Publication number Publication date
CN101188924A (zh) 2008-05-28
JP2009152631A (ja) 2009-07-09
JP4894873B2 (ja) 2012-03-14
US20080117599A1 (en) 2008-05-22
JP2008130729A (ja) 2008-06-05

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