JP4302527B2 - 流体スロットをレーザー加工する方法 - Google Patents

流体スロットをレーザー加工する方法 Download PDF

Info

Publication number
JP4302527B2
JP4302527B2 JP2003554378A JP2003554378A JP4302527B2 JP 4302527 B2 JP4302527 B2 JP 4302527B2 JP 2003554378 A JP2003554378 A JP 2003554378A JP 2003554378 A JP2003554378 A JP 2003554378A JP 4302527 B2 JP4302527 B2 JP 4302527B2
Authority
JP
Japan
Prior art keywords
substrate
slot
laser
laser beam
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003554378A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005512848A5 (https=
JP2005512848A (ja
Inventor
ケイヒル，デイヴィッド
ポラード，ジェフリー・アール
オライリー，デクラン・ジョン
スコット，グレアム
マクローリン，ノエル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2005512848A publication Critical patent/JP2005512848A/ja
Publication of JP2005512848A5 publication Critical patent/JP2005512848A5/ja
Application granted granted Critical
Publication of JP4302527B2 publication Critical patent/JP4302527B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Laser Beam Processing (AREA)
JP2003554378A 2001-12-20 2002-06-21 流体スロットをレーザー加工する方法 Expired - Fee Related JP4302527B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US34347601P 2001-12-20 2001-12-20
US10/138,594 US7357486B2 (en) 2001-12-20 2002-05-02 Method of laser machining a fluid slot
PCT/US2002/019752 WO2003053627A1 (en) 2001-12-20 2002-06-21 Method of laser machining a fluid slot

Publications (3)

Publication Number Publication Date
JP2005512848A JP2005512848A (ja) 2005-05-12
JP2005512848A5 JP2005512848A5 (https=) 2006-01-05
JP4302527B2 true JP4302527B2 (ja) 2009-07-29

Family

ID=26836344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003554378A Expired - Fee Related JP4302527B2 (ja) 2001-12-20 2002-06-21 流体スロットをレーザー加工する方法

Country Status (7)

Country Link
US (1) US7357486B2 (https=)
EP (1) EP1455986B1 (https=)
JP (1) JP4302527B2 (https=)
CN (1) CN1738693B (https=)
AU (1) AU2002318383A1 (https=)
DE (1) DE60217172T2 (https=)
WO (1) WO2003053627A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030155328A1 (en) * 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
US6958106B2 (en) * 2003-04-09 2005-10-25 Endicott International Technologies, Inc. Material separation to form segmented product
US7893386B2 (en) * 2003-11-14 2011-02-22 Hewlett-Packard Development Company, L.P. Laser micromachining and methods of same
GB2410465A (en) * 2004-01-29 2005-08-03 Hewlett Packard Development Co Method of making an inkjet printhead
US20050219327A1 (en) * 2004-03-31 2005-10-06 Clarke Leo C Features in substrates and methods of forming
US7268315B2 (en) 2005-07-13 2007-09-11 Hewlett-Packard Development Company, L.P. Monitoring slot formation in substrates
US20080308884A1 (en) * 2005-10-13 2008-12-18 Silex Microsystems Ab Fabrication of Inlet and Outlet Connections for Microfluidic Chips
FR2909297B1 (fr) * 2006-11-30 2010-03-05 Snecma Procede de percage laser d'une piece en materiau composite a matrice ceramique, trou obtenu par ce procede, piece en materiau composite a matrice ceramique le comportant, turboreacteur comportant une telle piece.
US7855151B2 (en) * 2007-08-21 2010-12-21 Hewlett-Packard Development Company, L.P. Formation of a slot in a silicon substrate
JP5405859B2 (ja) * 2009-03-12 2014-02-05 株式会社ディスコ インクジェットプリンタヘッドのインク溜めの加工方法
DE102010011508B4 (de) * 2010-03-15 2015-12-10 Ewag Ag Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung
EP2452775A1 (de) * 2010-11-16 2012-05-16 Siemens Aktiengesellschaft Verkürztes Bohrverfahren eines Lochs
JP5857548B2 (ja) * 2011-09-02 2016-02-10 株式会社リコー 薄膜製造方法、電気機械変換素子の製造方法及び液体吐出ヘッドの製造方法
EP2794276B1 (en) * 2011-12-21 2018-07-25 Hewlett-Packard Development Company, L.P. Fluid dispenser
CN102769083A (zh) * 2012-07-16 2012-11-07 江苏扬景光电有限公司 倒装焊氮化物发光二极管及其透光衬底和制造方法
US9991090B2 (en) * 2012-11-15 2018-06-05 Fei Company Dual laser beam system used with an electron microscope and FIB
KR20150097475A (ko) * 2012-12-20 2015-08-26 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 미세기계가공에 의한 이미지 형성 방법
CN103240526B (zh) * 2013-05-10 2015-06-10 中国电子科技集团公司第五十四研究所 基于纳米级粒子流的激光打孔方法
US10357848B2 (en) 2015-01-19 2019-07-23 General Electric Company Laser machining systems and methods
US10580725B2 (en) * 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
CN109352185B (zh) * 2018-10-23 2021-03-09 深圳赛意法微电子有限公司 碳化硅基晶圆的分束激光切割方法
CN116194240A (zh) * 2020-08-01 2023-05-30 雅芳股份公司 用于将精密微孔机加工至厚陶瓷衬底中的方法和系统
WO2026015152A1 (en) * 2024-07-12 2026-01-15 Hewlett-Packard Development Company, L.P. Fluidic devices with slots

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL67599A (en) * 1982-12-31 1986-09-30 Laser Ind Ltd Control apparatus particularly useful for controlling a laser
US4746935A (en) 1985-11-22 1988-05-24 Hewlett-Packard Company Multitone ink jet printer and method of operation
US4719477A (en) * 1986-01-17 1988-01-12 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
JPS62234687A (ja) 1986-04-03 1987-10-14 Inoue Japax Res Inc ダイス製作方法
US4915981A (en) 1988-08-12 1990-04-10 Rogers Corporation Method of laser drilling fluoropolymer materials
DE3934587C2 (de) * 1989-10-17 1998-11-19 Bosch Gmbh Robert Verfahren zum Herstellen von mittels Laserstrahlung erzeugter, hochpräziser Durchgangsbohrungen in Werkstücken
US5362450A (en) 1990-03-29 1994-11-08 The United States Of America As Represented By The Secretary Of The Navy Laser controlled decomposition of chlorofluorocarbons
US5385633A (en) 1990-03-29 1995-01-31 The United States Of America As Represented By The Secretary Of The Navy Method for laser-assisted silicon etching using halocarbon ambients
US5688715A (en) * 1990-03-29 1997-11-18 The United States Of America As Represented By The Secretary Of The Navy Excimer laser dopant activation of backside illuminated CCD's
US5266532A (en) 1990-03-29 1993-11-30 The United States Of America As Represented By The Secretary Of The Navy Method for laser-assisted silicon etching using halocarbon ambients
US5354420A (en) 1990-03-29 1994-10-11 The United States Of America As Represented By The Secretary Of The Navy Method for laser-assisted etching of III-V and II-VI semiconductor compounds using chlorofluorocarbon ambients
US5493445A (en) 1990-03-29 1996-02-20 The United States Of America As Represented By The Secretary Of The Navy Laser textured surface absorber and emitter
US5322988A (en) 1990-03-29 1994-06-21 The United States Of America As Represented By The Secretary Of The Navy Laser texturing
US5469199A (en) 1990-08-16 1995-11-21 Hewlett-Packard Company Wide inkjet printhead
US5293025A (en) 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
US5397863A (en) * 1991-09-13 1995-03-14 International Business Machines Corporation Fluorinated carbon polymer composites
JPH05144978A (ja) 1991-11-20 1993-06-11 Fujitsu Ltd シリコン基板ビアホール形成方法およびマルチチツプモジユール製造方法
JPH05147223A (ja) * 1991-12-02 1993-06-15 Matsushita Electric Ind Co Ltd インクジエツトヘツド
US5211806A (en) * 1991-12-24 1993-05-18 Xerox Corporation Monolithic inkjet printhead
US5317346A (en) * 1992-03-04 1994-05-31 Hewlett-Packard Company Compound ink feed slot
US5297331A (en) * 1992-04-03 1994-03-29 Hewlett-Packard Company Method for aligning a substrate with respect to orifices in an inkjet printhead
JP3290495B2 (ja) * 1992-04-21 2002-06-10 キヤノン株式会社 インクジェット記録ヘッドの製造方法
JP3127570B2 (ja) 1992-05-25 2001-01-29 セイコーエプソン株式会社 インクジェットヘッドの製造方法
JPH0679486A (ja) 1992-08-25 1994-03-22 Rohm Co Ltd インクジェットヘッドの加工方法
KR0127666B1 (ko) 1992-11-25 1997-12-30 모리시다 요이찌 세라믹전자부품 및 그 제조방법
DE4241045C1 (de) * 1992-12-05 1994-05-26 Bosch Gmbh Robert Verfahren zum anisotropen Ätzen von Silicium
US5387314A (en) * 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
AU5066996A (en) 1995-04-14 1996-10-24 Canon Kabushiki Kaisha Method for producing liquid ejecting head and liquid ejecting head obtained by the same method
JPH08300667A (ja) 1995-05-11 1996-11-19 Brother Ind Ltd インクジェットヘッドの製造方法
DE19534590A1 (de) * 1995-09-11 1997-03-13 Laser & Med Tech Gmbh Scanning Ablation von keramischen Werkstoffen, Kunststoffen und biologischen Hydroxylapatitmaterialien, insbesondere Zahnhartsubstanz
US6162589A (en) * 1998-03-02 2000-12-19 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
GB2311953A (en) 1996-03-23 1997-10-15 British Aerospace Laser beam drilling
AU5084998A (en) 1996-11-08 1998-05-29 W.L. Gore & Associates, Inc. Method for using photoabsorptive coatings to enhance both blind and through micro-via entrance quality
JPH10163136A (ja) 1996-12-04 1998-06-19 Unisia Jecs Corp シリコンウエハの加工方法
US5835513A (en) * 1997-01-08 1998-11-10 Spectra Physics, Inc. Q-switched laser system providing UV light
US6624382B2 (en) * 1997-01-30 2003-09-23 Anvik Corporation Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure
US5870421A (en) * 1997-05-12 1999-02-09 Dahm; Jonathan S. Short pulsewidth, high pulse repetition frequency laser system
JPH118222A (ja) 1997-06-16 1999-01-12 Seiko Epson Corp シリコン基板の加工方法
DE19736370C2 (de) * 1997-08-21 2001-12-06 Bosch Gmbh Robert Verfahren zum anisotropen Ätzen von Silizium
JP2000246475A (ja) 1999-02-25 2000-09-12 Seiko Epson Corp レーザ光による加工方法
WO2000050198A1 (en) 1999-02-25 2000-08-31 Seiko Epson Corporation Method for machining work by laser beam
IT1310099B1 (it) 1999-07-12 2002-02-11 Olivetti Lexikon Spa Testina di stampa monolitica e relativo processo di fabbricazione.
JP2003506216A (ja) 1999-08-03 2003-02-18 イクシィル・テクノロジー・リミテッド 回路シンギュレーションシステム及び方法
US6310701B1 (en) * 1999-10-08 2001-10-30 Nanovia Lp Method and apparatus for ablating high-density array of vias or indentation in surface of object
CN2399865Y (zh) * 1999-10-18 2000-10-04 福建华科光电有限公司 微片激光器
US6472125B1 (en) 1999-11-30 2002-10-29 Canon Kabushiki Kaisha Method for manufacturing ink jet recording head and ink jet recording head manufactured by such method of manufacture
IT1309735B1 (it) 1999-12-27 2002-01-30 Olivetti Lexikon Spa Testina a canali multipli di alimentazione dell'inchiostro
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
US6586707B2 (en) 2000-10-26 2003-07-01 Xsil Technology Limited Control of laser machining
JP2004515365A (ja) 2000-12-15 2004-05-27 エグシル テクノロジー リミテッド 半導体材料のレーザー加工
US6481832B2 (en) * 2001-01-29 2002-11-19 Hewlett-Packard Company Fluid-jet ejection device
EP1404481B1 (en) 2001-03-22 2006-04-19 Xsil Technology Limited A laser machining system and method
ATE537558T1 (de) 2001-10-01 2011-12-15 Electro Scient Ind Inc Bearbeiten von substraten, insbesondere von halbleitersubstraten

Also Published As

Publication number Publication date
DE60217172T2 (de) 2007-10-11
CN1738693B (zh) 2010-06-16
WO2003053627A1 (en) 2003-07-03
US20030117449A1 (en) 2003-06-26
DE60217172D1 (de) 2007-02-08
EP1455986A1 (en) 2004-09-15
AU2002318383A1 (en) 2003-07-09
CN1738693A (zh) 2006-02-22
US7357486B2 (en) 2008-04-15
EP1455986B1 (en) 2006-12-27
JP2005512848A (ja) 2005-05-12

Similar Documents

Publication Publication Date Title
JP4302527B2 (ja) 流体スロットをレーザー加工する方法
CN1274453C (zh) 激光铣削方法
US6749285B2 (en) Method of milling repeatable exit holes in ink-jet nozzles
KR100388182B1 (ko) 레이저 가공 방법, 그 방법을 이용한 잉크 제트 기록 헤드제조 방법 및 그 방법에 의해 제조된 잉크 제트 기록 헤드
JP2006051820A (ja) プリントヘッド部品内に特徴部を形成すること
KR100340271B1 (ko) 레이저 가공 방법, 그 방법을 이용하는 잉크 제트 기록헤드의 제조 방법, 및 그 방법에 의해 제조된 잉크 제트기록 헤드
JP2005526623A (ja) 超短パルスレーザ光を用いたレーザ加工方法
US7302309B2 (en) Laser micromachining methods and systems
JP3229521B2 (ja) レーザ加工装置およびレーザ加工方法
EP1769872A2 (en) Method of laser machining a fluid slot
EP1525070A1 (en) Inkjet nozzle and process of laser drilling a hole for use in inkjet nozzles
CN109195804B (zh) 热喷墨打印头和热喷墨打印头的制造方法
US7923658B2 (en) Laser micromachining methods and systems
JP2001219282A (ja) レーザ加工方法、該レーザ加工方法を用いたインクジェット記録ヘッドの製造方法、該製造方法で製造されたインクジェット記録ヘッド
JP6991760B2 (ja) シリコン基板の加工方法
CA3022350C (en) Thermal inkjet print head and method of manufacturing of a thermal inkjet print head
JP2007203650A (ja) 液滴吐出ヘッドの製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050617

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050617

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080204

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080212

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080512

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080519

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080812

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080912

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20081210

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20081217

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090312

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090410

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090422

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120501

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120501

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130501

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130501

Year of fee payment: 4

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130501

Year of fee payment: 4

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130501

Year of fee payment: 4

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130501

Year of fee payment: 4

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees