JP2005512848A5 - - Google Patents

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Publication number
JP2005512848A5
JP2005512848A5 JP2003554378A JP2003554378A JP2005512848A5 JP 2005512848 A5 JP2005512848 A5 JP 2005512848A5 JP 2003554378 A JP2003554378 A JP 2003554378A JP 2003554378 A JP2003554378 A JP 2003554378A JP 2005512848 A5 JP2005512848 A5 JP 2005512848A5
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JP
Japan
Prior art keywords
slot
fluid
substrate
laser beam
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003554378A
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English (en)
Japanese (ja)
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JP2005512848A (ja
JP4302527B2 (ja
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Publication date
Priority claimed from US10/138,594 external-priority patent/US7357486B2/en
Application filed filed Critical
Publication of JP2005512848A publication Critical patent/JP2005512848A/ja
Publication of JP2005512848A5 publication Critical patent/JP2005512848A5/ja
Application granted granted Critical
Publication of JP4302527B2 publication Critical patent/JP4302527B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003554378A 2001-12-20 2002-06-21 流体スロットをレーザー加工する方法 Expired - Fee Related JP4302527B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US34347601P 2001-12-20 2001-12-20
US10/138,594 US7357486B2 (en) 2001-12-20 2002-05-02 Method of laser machining a fluid slot
PCT/US2002/019752 WO2003053627A1 (en) 2001-12-20 2002-06-21 Method of laser machining a fluid slot

Publications (3)

Publication Number Publication Date
JP2005512848A JP2005512848A (ja) 2005-05-12
JP2005512848A5 true JP2005512848A5 (https=) 2006-01-05
JP4302527B2 JP4302527B2 (ja) 2009-07-29

Family

ID=26836344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003554378A Expired - Fee Related JP4302527B2 (ja) 2001-12-20 2002-06-21 流体スロットをレーザー加工する方法

Country Status (7)

Country Link
US (1) US7357486B2 (https=)
EP (1) EP1455986B1 (https=)
JP (1) JP4302527B2 (https=)
CN (1) CN1738693B (https=)
AU (1) AU2002318383A1 (https=)
DE (1) DE60217172T2 (https=)
WO (1) WO2003053627A1 (https=)

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CN103240526B (zh) * 2013-05-10 2015-06-10 中国电子科技集团公司第五十四研究所 基于纳米级粒子流的激光打孔方法
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US10580725B2 (en) * 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
CN109352185B (zh) * 2018-10-23 2021-03-09 深圳赛意法微电子有限公司 碳化硅基晶圆的分束激光切割方法
KR20230043207A (ko) * 2020-08-01 2023-03-30 아보니시스 아게 두꺼운 세라믹 기판들로 정밀한 마이크로 홀들을 머시닝하기 위한 방법들 및 시스템들
WO2026015152A1 (en) * 2024-07-12 2026-01-15 Hewlett-Packard Development Company, L.P. Fluidic devices with slots

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