CN1738693B - 激光加工一种流体槽的方法 - Google Patents

激光加工一种流体槽的方法 Download PDF

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Publication number
CN1738693B
CN1738693B CN028258568A CN02825856A CN1738693B CN 1738693 B CN1738693 B CN 1738693B CN 028258568 A CN028258568 A CN 028258568A CN 02825856 A CN02825856 A CN 02825856A CN 1738693 B CN1738693 B CN 1738693B
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CN
China
Prior art keywords
laser beam
substrate
laser
groove
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN028258568A
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English (en)
Chinese (zh)
Other versions
CN1738693A (zh
Inventor
D·卡希尔
J·R·波拉
D·J·奥赖利
G·斯科特
N·麦克罗林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
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Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of CN1738693A publication Critical patent/CN1738693A/zh
Application granted granted Critical
Publication of CN1738693B publication Critical patent/CN1738693B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Laser Beam Processing (AREA)
CN028258568A 2001-12-20 2002-06-21 激光加工一种流体槽的方法 Expired - Fee Related CN1738693B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34347601P 2001-12-20 2001-12-20
US60/343,476 2001-12-20
US10/138,594 2002-05-02
US10/138,594 US7357486B2 (en) 2001-12-20 2002-05-02 Method of laser machining a fluid slot
PCT/US2002/019752 WO2003053627A1 (en) 2001-12-20 2002-06-21 Method of laser machining a fluid slot

Publications (2)

Publication Number Publication Date
CN1738693A CN1738693A (zh) 2006-02-22
CN1738693B true CN1738693B (zh) 2010-06-16

Family

ID=26836344

Family Applications (1)

Application Number Title Priority Date Filing Date
CN028258568A Expired - Fee Related CN1738693B (zh) 2001-12-20 2002-06-21 激光加工一种流体槽的方法

Country Status (7)

Country Link
US (1) US7357486B2 (https=)
EP (1) EP1455986B1 (https=)
JP (1) JP4302527B2 (https=)
CN (1) CN1738693B (https=)
AU (1) AU2002318383A1 (https=)
DE (1) DE60217172T2 (https=)
WO (1) WO2003053627A1 (https=)

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US7893386B2 (en) * 2003-11-14 2011-02-22 Hewlett-Packard Development Company, L.P. Laser micromachining and methods of same
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US20050219327A1 (en) * 2004-03-31 2005-10-06 Clarke Leo C Features in substrates and methods of forming
US7268315B2 (en) 2005-07-13 2007-09-11 Hewlett-Packard Development Company, L.P. Monitoring slot formation in substrates
US20080308884A1 (en) * 2005-10-13 2008-12-18 Silex Microsystems Ab Fabrication of Inlet and Outlet Connections for Microfluidic Chips
FR2909297B1 (fr) * 2006-11-30 2010-03-05 Snecma Procede de percage laser d'une piece en materiau composite a matrice ceramique, trou obtenu par ce procede, piece en materiau composite a matrice ceramique le comportant, turboreacteur comportant une telle piece.
US7855151B2 (en) * 2007-08-21 2010-12-21 Hewlett-Packard Development Company, L.P. Formation of a slot in a silicon substrate
JP5405859B2 (ja) * 2009-03-12 2014-02-05 株式会社ディスコ インクジェットプリンタヘッドのインク溜めの加工方法
DE102010011508B4 (de) * 2010-03-15 2015-12-10 Ewag Ag Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung
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CN102769083A (zh) * 2012-07-16 2012-11-07 江苏扬景光电有限公司 倒装焊氮化物发光二极管及其透光衬底和制造方法
US9991090B2 (en) * 2012-11-15 2018-06-05 Fei Company Dual laser beam system used with an electron microscope and FIB
KR20150097475A (ko) * 2012-12-20 2015-08-26 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 미세기계가공에 의한 이미지 형성 방법
CN103240526B (zh) * 2013-05-10 2015-06-10 中国电子科技集团公司第五十四研究所 基于纳米级粒子流的激光打孔方法
US10357848B2 (en) 2015-01-19 2019-07-23 General Electric Company Laser machining systems and methods
US10580725B2 (en) * 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
CN109352185B (zh) * 2018-10-23 2021-03-09 深圳赛意法微电子有限公司 碳化硅基晶圆的分束激光切割方法
CN116194240A (zh) * 2020-08-01 2023-05-30 雅芳股份公司 用于将精密微孔机加工至厚陶瓷衬底中的方法和系统
WO2026015152A1 (en) * 2024-07-12 2026-01-15 Hewlett-Packard Development Company, L.P. Fluidic devices with slots

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Also Published As

Publication number Publication date
DE60217172T2 (de) 2007-10-11
WO2003053627A1 (en) 2003-07-03
US20030117449A1 (en) 2003-06-26
DE60217172D1 (de) 2007-02-08
EP1455986A1 (en) 2004-09-15
AU2002318383A1 (en) 2003-07-09
CN1738693A (zh) 2006-02-22
JP4302527B2 (ja) 2009-07-29
US7357486B2 (en) 2008-04-15
EP1455986B1 (en) 2006-12-27
JP2005512848A (ja) 2005-05-12

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