JP4298665B2 - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法 Download PDF

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Publication number
JP4298665B2
JP4298665B2 JP2005031701A JP2005031701A JP4298665B2 JP 4298665 B2 JP4298665 B2 JP 4298665B2 JP 2005031701 A JP2005031701 A JP 2005031701A JP 2005031701 A JP2005031701 A JP 2005031701A JP 4298665 B2 JP4298665 B2 JP 4298665B2
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JP
Japan
Prior art keywords
wire
bonding
capillary
bump
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005031701A
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English (en)
Japanese (ja)
Other versions
JP2006222128A (ja
Inventor
竜成 三井
俊彦 富山
森介 鄭
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Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2005031701A priority Critical patent/JP4298665B2/ja
Priority to TW094142037A priority patent/TW200629447A/zh
Priority to KR1020050121554A priority patent/KR100765376B1/ko
Priority to US11/347,479 priority patent/US20060175383A1/en
Publication of JP2006222128A publication Critical patent/JP2006222128A/ja
Priority to US12/384,643 priority patent/US7934634B2/en
Application granted granted Critical
Publication of JP4298665B2 publication Critical patent/JP4298665B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H10W72/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5434—
    • H10W72/547—
    • H10W72/951—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2005031701A 2005-02-08 2005-02-08 ワイヤボンディング方法 Expired - Fee Related JP4298665B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005031701A JP4298665B2 (ja) 2005-02-08 2005-02-08 ワイヤボンディング方法
TW094142037A TW200629447A (en) 2005-02-08 2005-11-30 Wire bonding method
KR1020050121554A KR100765376B1 (ko) 2005-02-08 2005-12-12 와이어 본딩 방법
US11/347,479 US20060175383A1 (en) 2005-02-08 2006-02-03 Wire bonding method
US12/384,643 US7934634B2 (en) 2005-02-08 2009-04-07 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005031701A JP4298665B2 (ja) 2005-02-08 2005-02-08 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JP2006222128A JP2006222128A (ja) 2006-08-24
JP4298665B2 true JP4298665B2 (ja) 2009-07-22

Family

ID=36778943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005031701A Expired - Fee Related JP4298665B2 (ja) 2005-02-08 2005-02-08 ワイヤボンディング方法

Country Status (4)

Country Link
US (2) US20060175383A1 (cg-RX-API-DMAC10.html)
JP (1) JP4298665B2 (cg-RX-API-DMAC10.html)
KR (1) KR100765376B1 (cg-RX-API-DMAC10.html)
TW (1) TW200629447A (cg-RX-API-DMAC10.html)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159267A (ja) * 2003-10-30 2005-06-16 Shinkawa Ltd 半導体装置及びワイヤボンディング方法
US7347352B2 (en) * 2003-11-26 2008-03-25 Kulicke And Soffa Industries, Inc. Low loop height ball bonding method and apparatus
JP4509043B2 (ja) * 2006-02-14 2010-07-21 株式会社新川 スタッドバンプの形成方法
JP4679427B2 (ja) * 2006-04-24 2011-04-27 株式会社新川 ボンディング装置のテールワイヤ切断方法及びプログラム
KR100833187B1 (ko) * 2006-11-02 2008-05-28 삼성전자주식회사 반도체 패키지의 와이어 본딩방법
JP4397408B2 (ja) * 2007-09-21 2010-01-13 株式会社新川 半導体装置及びワイヤボンディング方法
WO2009096950A1 (en) * 2008-01-30 2009-08-06 Kulicke And Soffa Industries, Inc. Wire loop and method of forming the wire loop
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP4344002B1 (ja) * 2008-10-27 2009-10-14 株式会社新川 ワイヤボンディング方法
CN102576684B (zh) * 2009-10-09 2015-08-26 日亚化学工业株式会社 半导体装置及其制造方法
JP4787374B2 (ja) * 2010-01-27 2011-10-05 株式会社新川 半導体装置の製造方法並びにワイヤボンディング装置
JP5359977B2 (ja) * 2010-04-12 2013-12-04 株式会社デンソー ワイヤボンディング方法
JP2012004464A (ja) * 2010-06-18 2012-01-05 Toshiba Corp 半導体装置、半導体装置の製造方法及び半導体装置の製造装置
DE102010038130B4 (de) * 2010-10-12 2012-04-19 Technische Universität Berlin Dickdraht-Bondanordnung und Verfahren zum Herstellen
MY181180A (en) * 2011-09-09 2020-12-21 Carsem M Sdn Bhd Low loop wire bonding
KR102094563B1 (ko) * 2012-07-17 2020-03-27 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 상호접속 구조를 형성하는 방법
CN104813455B (zh) * 2012-11-16 2017-11-21 株式会社新川 引线接合装置以及半导体装置的制造方法
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9087815B2 (en) * 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
TWI543284B (zh) * 2014-02-10 2016-07-21 新川股份有限公司 半導體裝置的製造方法以及打線裝置
JP2014140074A (ja) * 2014-04-17 2014-07-31 Toshiba Corp 半導体装置
DE102014116956A1 (de) 2014-11-19 2016-05-19 Infineon Technologies Ag Verfahren zum Bilden eines Bondpads und Bondpad
US10600756B1 (en) 2017-02-15 2020-03-24 United States Of America, As Represented By The Secretary Of The Navy Wire bonding technique for integrated circuit board connections
CN112437974B (zh) * 2018-06-06 2025-02-14 德州仪器公司 半导体裸片的球接合附接
US11145620B2 (en) * 2019-03-05 2021-10-12 Asm Technology Singapore Pte Ltd Formation of bonding wire vertical interconnects
CN113785386B (zh) * 2019-05-27 2025-01-10 株式会社新川 打线接合装置、半导体装置的制造方法以及半导体装置
KR102488240B1 (ko) * 2020-07-15 2023-01-13 가부시키가이샤 신가와 와이어 본딩 장치 및 반도체 장치의 제조 방법
US12057431B2 (en) * 2020-12-18 2024-08-06 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures and related wire bonding tools
CN115707348B (zh) * 2021-06-07 2025-09-30 株式会社新川 半导体装置的制造方法以及打线接合装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0951011A (ja) 1995-08-10 1997-02-18 Tanaka Denshi Kogyo Kk 半導体チップのワイヤボンディング方法
JP3913134B2 (ja) * 2002-08-08 2007-05-09 株式会社カイジョー バンプの形成方法及びバンプ
DE10128236A1 (de) * 2001-06-11 2002-08-01 Infineon Technologies Ag Verfahren zur Kompensation einer stufenförmigen DC-Störung in einem digitalen Basisbandsignal eines Homodyn-Funkempfängers
JP3573133B2 (ja) * 2002-02-19 2004-10-06 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP3923379B2 (ja) 2002-06-21 2007-05-30 株式会社ルネサステクノロジ 半導体装置
JP2004172477A (ja) 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
JP3854232B2 (ja) 2003-02-17 2006-12-06 株式会社新川 バンプ形成方法及びワイヤボンディング方法
JP2004247674A (ja) * 2003-02-17 2004-09-02 Shinkawa Ltd ワイヤボンディング方法
KR100536898B1 (ko) * 2003-09-04 2005-12-16 삼성전자주식회사 반도체 소자의 와이어 본딩 방법
US7494042B2 (en) * 2003-10-02 2009-02-24 Asm Technology Singapore Pte. Ltd. Method of forming low wire loops and wire loops formed using the method
TWI248186B (en) * 2004-01-09 2006-01-21 Unaxis Internat Tranding Ltd Method for producing a wedge-wedge wire connection
JP2006261448A (ja) 2005-03-17 2006-09-28 Toshiba Corp 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
TWI358096B (cg-RX-API-DMAC10.html) 2012-02-11
KR100765376B1 (ko) 2007-10-10
JP2006222128A (ja) 2006-08-24
KR20060090567A (ko) 2006-08-14
US20060175383A1 (en) 2006-08-10
US7934634B2 (en) 2011-05-03
TW200629447A (en) 2006-08-16
US20090194577A1 (en) 2009-08-06

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