JP4295740B2 - 電荷結合素子型イメージセンサ - Google Patents
電荷結合素子型イメージセンサ Download PDFInfo
- Publication number
- JP4295740B2 JP4295740B2 JP2005110566A JP2005110566A JP4295740B2 JP 4295740 B2 JP4295740 B2 JP 4295740B2 JP 2005110566 A JP2005110566 A JP 2005110566A JP 2005110566 A JP2005110566 A JP 2005110566A JP 4295740 B2 JP4295740 B2 JP 4295740B2
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- JP
- Japan
- Prior art keywords
- drain region
- gate electrode
- region
- image sensor
- floating diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009792 diffusion process Methods 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 36
- 239000012535 impurity Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 description 25
- 230000005540 biological transmission Effects 0.000 description 12
- 238000001514 detection method Methods 0.000 description 11
- 230000003071 parasitic effect Effects 0.000 description 11
- 230000035945 sensitivity Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/762—Charge transfer devices
- H01L29/765—Charge-coupled devices
- H01L29/768—Charge-coupled devices with field effect produced by an insulated gate
- H01L29/76816—Output structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
Description
CCD伝送部1の端部に出力ゲート17が形成されており、続いて浮動拡散領域18とプリチャージゲート25とプリチャージドレイン23よりなるプリチャージMOSトランジスタ(又はリセットMOSトランジスタ)が形成されており、点線で書かれたチャネルストッパ22を境界として前記浮動拡散領域18と連結されたゲート電極19とソース領域20、ドレイン領域21よりなる第1駆動MOSトランジスタM1が形成されている。
ΔVOUT =QSIG /CFD
で与えられる。QSIGは浮動拡散領域18に伝送された信号電荷量であり、CFDは浮動拡散領域と関連した寄生容量を含んだ総静電容量であり、前記図2からCFD=CB +CP +CO +CI +CINであることが分かる。ここで、CBは浮動拡散領域18とP型半導体ウェル12の間の静電容量と浮動拡散領域とチャネルストッパ22の間の静電容量との和であり、CPは浮動拡散領域18とプリチャージゲート電極25の間の静電容量C1とプリチャージゲート電極25と第1駆動MOSトランジスタM1のゲート電極19の配線との間の静電容量C2の和であり、COは浮動拡散領域18と出力ゲート17との間の静電容量であり、CIは出力増幅器3の配線の静電容量であり、CINは出力増幅器3の入力静電容量を示す。
検出感度=AV /CFD[クーロン/ボルト]
で与えられる。
14 絶縁層、15 伝送電極、17 出力ゲート、18 浮動拡散領域、
19 ゲート電極、20 ソース領域、21 ドレイン領域、22 チャネルストッパ、23 プリチャージドレイン、24 チャネル領域、25 プリチャージゲート、
27 空乏チャネル
Claims (6)
- 基板と、
前記基板の表面近傍に形成されたチャネル層と、
前記チャネル層の端側に形成された浮動拡散領域と、
前記チャネル層上に形成された複数の電極手段と、
前記浮動拡散領域をそのソース領域とするプリチャージトランジスタと、
前記基板の表面近傍に形成されたドレイン領域と、前記浮動拡散領域と接続する形に形成されており、前記ドレイン領域と重畳されない形に前記基板上に形成されたゲート電極と、
前記ゲート電極とドレイン領域の間で前記ドレイン領域と接続する形に前記基板に埋没され形成された埋没ドレイン領域を具備する駆動トランジスタを含むことを特徴とする電荷結合素子型イメージセンサ。 - 前記埋没ドレイン領域の上部に形成された表面空乏層を更に具備し、前記表面空乏層は前記基板と同じ導電層の不純物より構成されていることを特徴とする請求項1記載の電荷結合素子型イメージセンサ。
- 前記ドレイン領域の不純物の濃度は前記埋没ドレイン領域の不純物濃度より更に大きいことを特徴とする請求項1記載の電荷結合素子型イメージセンサ。
- 前記埋没ドレイン領域は前記ゲート電極に自己整合的に形成されていることを特徴とする請求項1記載の電荷結合素子型イメージセンサ。
- 前記埋没ドレイン領域は前記ドレイン領域とその一部が重なる模様に形成されることを特徴とする請求項1記載の電荷結合素子型イメージセンサ。
- 前記埋没ドレイン領域の下部面は前記ドレイン領域の下部面より更に低いことを特徴とする請求項1記載の電荷結合素子型イメージセンサ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930006155A KR960002100B1 (ko) | 1993-03-27 | 1993-04-13 | 전하결합소자형 이미지센서 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP07341194A Division JP3905139B2 (ja) | 1993-04-13 | 1994-04-12 | 電荷結合素子型イメージセンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005223356A JP2005223356A (ja) | 2005-08-18 |
JP4295740B2 true JP4295740B2 (ja) | 2009-07-15 |
Family
ID=19353855
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP07341194A Expired - Fee Related JP3905139B2 (ja) | 1993-04-13 | 1994-04-12 | 電荷結合素子型イメージセンサ |
JP2005110566A Expired - Fee Related JP4295740B2 (ja) | 1993-04-13 | 2005-04-07 | 電荷結合素子型イメージセンサ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP07341194A Expired - Fee Related JP3905139B2 (ja) | 1993-04-13 | 1994-04-12 | 電荷結合素子型イメージセンサ |
Country Status (5)
Country | Link |
---|---|
US (1) | US5477070A (ja) |
JP (2) | JP3905139B2 (ja) |
KR (1) | KR960002100B1 (ja) |
DE (1) | DE4412671C2 (ja) |
FR (1) | FR2704095B1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2707977B2 (ja) * | 1994-09-01 | 1998-02-04 | 日本電気株式会社 | Mos型半導体装置およびその製造方法 |
US5793089A (en) * | 1997-01-10 | 1998-08-11 | Advanced Micro Devices, Inc. | Graded MOS transistor junction formed by aligning a sequence of implants to a selectively removable polysilicon sidewall space and oxide thermally grown thereon |
US5837572A (en) * | 1997-01-10 | 1998-11-17 | Advanced Micro Devices, Inc. | CMOS integrated circuit formed by using removable spacers to produce asymmetrical NMOS junctions before asymmetrical PMOS junctions for optimizing thermal diffusivity of dopants implanted therein |
US5895955A (en) * | 1997-01-10 | 1999-04-20 | Advanced Micro Devices, Inc. | MOS transistor employing a removable, dual layer etch stop to protect implant regions from sidewall spacer overetch |
JP3028074B2 (ja) * | 1997-05-26 | 2000-04-04 | 日本電気株式会社 | 電荷転送素子とその駆動方法 |
KR100223826B1 (ko) * | 1997-06-04 | 1999-10-15 | 구본준 | 씨씨디(ccd) 영상소자의 제조방법 |
DE19732179C2 (de) * | 1997-07-25 | 1999-08-19 | Siemens Ag | MOS-Ausgangstreiber |
US6690423B1 (en) * | 1998-03-19 | 2004-02-10 | Kabushiki Kaisha Toshiba | Solid-state image pickup apparatus |
JPH11274454A (ja) | 1998-03-19 | 1999-10-08 | Canon Inc | 固体撮像装置及びその形成方法 |
US6124610A (en) * | 1998-06-26 | 2000-09-26 | Advanced Micro Devices, Inc. | Isotropically etching sidewall spacers to be used for both an NMOS source/drain implant and a PMOS LDD implant |
JP3937716B2 (ja) * | 2000-10-24 | 2007-06-27 | キヤノン株式会社 | 固体撮像装置及び撮像システム |
US6710424B2 (en) | 2001-09-21 | 2004-03-23 | Airip | RF chipset architecture |
KR100788483B1 (ko) * | 2005-04-20 | 2007-12-24 | 엠텍비젼 주식회사 | 이미지 센서의 픽셀 구조 및 그 제조 방법 |
US8110470B2 (en) | 2009-08-31 | 2012-02-07 | Globalfoundries Singapore Pte. Ltd. | Asymmetrical transistor device and method of fabrication |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1153428A (en) * | 1965-06-18 | 1969-05-29 | Philips Nv | Improvements in Semiconductor Devices. |
US4389615A (en) * | 1979-08-29 | 1983-06-21 | Rockwell International Corporation | CCD Demodulator circuit |
JPH079981B2 (ja) * | 1985-02-05 | 1995-02-01 | ソニー株式会社 | 電荷転送装置 |
US4680603A (en) * | 1985-04-12 | 1987-07-14 | General Electric Company | Graded extended drain concept for reduced hot electron effect |
EP0282557B1 (en) * | 1986-09-18 | 1993-12-15 | EASTMAN KODAK COMPANY (a New Jersey corporation) | Output circuit for image sensor |
US5192990A (en) * | 1986-09-18 | 1993-03-09 | Eastman Kodak Company | Output circuit for image sensor |
JPS63209175A (ja) * | 1987-02-26 | 1988-08-30 | Toshiba Corp | 電荷検出回路 |
JP2667857B2 (ja) * | 1988-02-12 | 1997-10-27 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
JPH01283870A (ja) * | 1988-05-10 | 1989-11-15 | Nec Corp | 電荷転送装置 |
US5065203A (en) * | 1988-07-07 | 1991-11-12 | Tektronix, Inc. | Trench structured charge-coupled device |
JPH02262344A (ja) * | 1989-03-31 | 1990-10-25 | Sony Corp | 出力回路 |
JP2832136B2 (ja) * | 1992-12-28 | 1998-12-02 | シャープ株式会社 | 固体撮像装置及びその製造方法 |
US5349225A (en) * | 1993-04-12 | 1994-09-20 | Texas Instruments Incorporated | Field effect transistor with a lightly doped drain |
-
1993
- 1993-04-13 KR KR1019930006155A patent/KR960002100B1/ko not_active IP Right Cessation
-
1994
- 1994-04-12 FR FR9404328A patent/FR2704095B1/fr not_active Expired - Fee Related
- 1994-04-12 JP JP07341194A patent/JP3905139B2/ja not_active Expired - Fee Related
- 1994-04-13 US US08/227,352 patent/US5477070A/en not_active Expired - Lifetime
- 1994-04-13 DE DE4412671A patent/DE4412671C2/de not_active Expired - Fee Related
-
2005
- 2005-04-07 JP JP2005110566A patent/JP4295740B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE4412671C2 (de) | 2003-03-06 |
KR940022909A (ko) | 1994-10-21 |
JPH077147A (ja) | 1995-01-10 |
KR960002100B1 (ko) | 1996-02-10 |
US5477070A (en) | 1995-12-19 |
JP3905139B2 (ja) | 2007-04-18 |
FR2704095B1 (fr) | 1995-09-01 |
DE4412671A1 (de) | 1994-10-20 |
FR2704095A1 (fr) | 1994-10-21 |
JP2005223356A (ja) | 2005-08-18 |
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