JP4293188B2 - 単結晶の製造方法及びシリコン単結晶ウエーハ - Google Patents
単結晶の製造方法及びシリコン単結晶ウエーハ Download PDFInfo
- Publication number
- JP4293188B2 JP4293188B2 JP2005513273A JP2005513273A JP4293188B2 JP 4293188 B2 JP4293188 B2 JP 4293188B2 JP 2005513273 A JP2005513273 A JP 2005513273A JP 2005513273 A JP2005513273 A JP 2005513273A JP 4293188 B2 JP4293188 B2 JP 4293188B2
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- Prior art keywords
- single crystal
- crystal
- region
- silicon
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000013078 crystal Substances 0.000 title claims description 166
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 56
- 229910052710 silicon Inorganic materials 0.000 title claims description 54
- 239000010703 silicon Substances 0.000 title claims description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000000034 method Methods 0.000 claims description 30
- 239000011261 inert gas Substances 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 82
- 235000012431 wafers Nutrition 0.000 description 33
- 230000007547 defect Effects 0.000 description 27
- 238000011109 contamination Methods 0.000 description 22
- 230000002093 peripheral effect Effects 0.000 description 22
- 239000007789 gas Substances 0.000 description 20
- 229910001385 heavy metal Inorganic materials 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 239000000155 melt Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000002296 pyrolytic carbon Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1068—Seed pulling including heating or cooling details [e.g., shield configuration]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003296837 | 2003-08-20 | ||
| JP2003296837 | 2003-08-20 | ||
| PCT/JP2004/011685 WO2005019506A1 (ja) | 2003-08-20 | 2004-08-13 | 単結晶の製造方法及びシリコン単結晶ウエーハ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2005019506A1 JPWO2005019506A1 (ja) | 2007-11-01 |
| JP4293188B2 true JP4293188B2 (ja) | 2009-07-08 |
Family
ID=34213598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005513273A Expired - Fee Related JP4293188B2 (ja) | 2003-08-20 | 2004-08-13 | 単結晶の製造方法及びシリコン単結晶ウエーハ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7326395B2 (enExample) |
| EP (1) | EP1662024B1 (enExample) |
| JP (1) | JP4293188B2 (enExample) |
| KR (1) | KR101120615B1 (enExample) |
| TW (1) | TW200508429A (enExample) |
| WO (1) | WO2005019506A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070158653A1 (en) * | 2004-02-02 | 2007-07-12 | Shin-Etsu Handotai Co., Ltd. | Silicon single crystal, a silicon wafer, an apparatus for producing the same, and a method for producing the same |
| US7387680B2 (en) * | 2005-05-13 | 2008-06-17 | Cree, Inc. | Method and apparatus for the production of silicon carbide crystals |
| DE102006002682A1 (de) | 2006-01-19 | 2007-08-02 | Siltronic Ag | Vorrichtung und Verfahren zur Herstellung eines Einkristalls, Einkristall und Halbleiterscheibe |
| KR101384060B1 (ko) * | 2012-08-03 | 2014-04-09 | 주식회사 엘지실트론 | 실리콘 단결정 잉곳 성장 방법 |
| CN103911654B (zh) * | 2014-04-15 | 2016-08-17 | 宁夏大学 | 制备直径为400mm以上的单晶硅的方法 |
| CN111962140A (zh) * | 2020-08-28 | 2020-11-20 | 晶科绿能(上海)管理有限公司 | 连续拉晶装置和连续拉制晶棒的方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0741383A (ja) | 1993-07-29 | 1995-02-10 | Nippon Steel Corp | 半導体単結晶およびその製造方法 |
| JP3085146B2 (ja) | 1995-05-31 | 2000-09-04 | 住友金属工業株式会社 | シリコン単結晶ウェーハおよびその製造方法 |
| JPH09202684A (ja) | 1996-01-19 | 1997-08-05 | Shin Etsu Handotai Co Ltd | 結晶欠陥が少ないシリコン単結晶の製造方法およびこの方法で製造されたシリコン単結晶 |
| JP3460551B2 (ja) | 1997-11-11 | 2003-10-27 | 信越半導体株式会社 | 結晶欠陥の少ないシリコン単結晶ウエーハ及びその製造方法 |
| JP3601324B2 (ja) * | 1998-11-19 | 2004-12-15 | 信越半導体株式会社 | 結晶欠陥の少ないシリコン単結晶ウエーハ及びその製造方法 |
| JP3752890B2 (ja) | 1999-05-26 | 2006-03-08 | 株式会社Sumco | シリコン単結晶インゴットの製造方法 |
| WO2001063027A1 (en) * | 2000-02-28 | 2001-08-30 | Shin-Etsu Handotai Co., Ltd | Method for preparing silicon single crystal and silicon single crystal |
| WO2001081661A1 (fr) * | 2000-04-25 | 2001-11-01 | Shin-Etsu Handotai Co.,Ltd. | Tranche de silicium monocristallin, son procede d'elaboration et procede d'obtention d'une tranche de silicium monocristallin |
| JP3994665B2 (ja) | 2000-12-28 | 2007-10-24 | 信越半導体株式会社 | シリコン単結晶ウエーハおよびシリコン単結晶の製造方法 |
| US7129123B2 (en) * | 2002-08-27 | 2006-10-31 | Shin-Etsu Handotai Co., Ltd. | SOI wafer and a method for producing an SOI wafer |
| JP4193610B2 (ja) * | 2003-06-27 | 2008-12-10 | 信越半導体株式会社 | 単結晶の製造方法 |
-
2004
- 2004-08-13 WO PCT/JP2004/011685 patent/WO2005019506A1/ja not_active Ceased
- 2004-08-13 KR KR1020067003089A patent/KR101120615B1/ko not_active Expired - Fee Related
- 2004-08-13 US US10/568,186 patent/US7326395B2/en not_active Expired - Lifetime
- 2004-08-13 EP EP04771652.7A patent/EP1662024B1/en not_active Expired - Lifetime
- 2004-08-13 JP JP2005513273A patent/JP4293188B2/ja not_active Expired - Fee Related
- 2004-08-18 TW TW093124770A patent/TW200508429A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2005019506A1 (ja) | 2007-11-01 |
| EP1662024A1 (en) | 2006-05-31 |
| EP1662024A4 (en) | 2008-10-15 |
| US7326395B2 (en) | 2008-02-05 |
| KR20060037445A (ko) | 2006-05-03 |
| WO2005019506A1 (ja) | 2005-03-03 |
| EP1662024B1 (en) | 2016-01-13 |
| TW200508429A (en) | 2005-03-01 |
| US20060236919A1 (en) | 2006-10-26 |
| KR101120615B1 (ko) | 2012-03-16 |
| TWI338728B (enExample) | 2011-03-11 |
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