JP4293188B2 - 単結晶の製造方法及びシリコン単結晶ウエーハ - Google Patents

単結晶の製造方法及びシリコン単結晶ウエーハ Download PDF

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Publication number
JP4293188B2
JP4293188B2 JP2005513273A JP2005513273A JP4293188B2 JP 4293188 B2 JP4293188 B2 JP 4293188B2 JP 2005513273 A JP2005513273 A JP 2005513273A JP 2005513273 A JP2005513273 A JP 2005513273A JP 4293188 B2 JP4293188 B2 JP 4293188B2
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Prior art keywords
single crystal
crystal
region
silicon
concentration
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Japanese (ja)
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JPWO2005019506A1 (ja
Inventor
泉 布施川
伸晃 三田村
隆弘 柳町
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Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1024Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032Seed pulling
    • Y10T117/1068Seed pulling including heating or cooling details [e.g., shield configuration]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
JP2005513273A 2003-08-20 2004-08-13 単結晶の製造方法及びシリコン単結晶ウエーハ Expired - Fee Related JP4293188B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003296837 2003-08-20
JP2003296837 2003-08-20
PCT/JP2004/011685 WO2005019506A1 (ja) 2003-08-20 2004-08-13 単結晶の製造方法及びシリコン単結晶ウエーハ

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JPWO2005019506A1 JPWO2005019506A1 (ja) 2007-11-01
JP4293188B2 true JP4293188B2 (ja) 2009-07-08

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JP2005513273A Expired - Fee Related JP4293188B2 (ja) 2003-08-20 2004-08-13 単結晶の製造方法及びシリコン単結晶ウエーハ

Country Status (6)

Country Link
US (1) US7326395B2 (enExample)
EP (1) EP1662024B1 (enExample)
JP (1) JP4293188B2 (enExample)
KR (1) KR101120615B1 (enExample)
TW (1) TW200508429A (enExample)
WO (1) WO2005019506A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070158653A1 (en) * 2004-02-02 2007-07-12 Shin-Etsu Handotai Co., Ltd. Silicon single crystal, a silicon wafer, an apparatus for producing the same, and a method for producing the same
US7387680B2 (en) * 2005-05-13 2008-06-17 Cree, Inc. Method and apparatus for the production of silicon carbide crystals
DE102006002682A1 (de) 2006-01-19 2007-08-02 Siltronic Ag Vorrichtung und Verfahren zur Herstellung eines Einkristalls, Einkristall und Halbleiterscheibe
KR101384060B1 (ko) * 2012-08-03 2014-04-09 주식회사 엘지실트론 실리콘 단결정 잉곳 성장 방법
CN103911654B (zh) * 2014-04-15 2016-08-17 宁夏大学 制备直径为400mm以上的单晶硅的方法
CN111962140A (zh) * 2020-08-28 2020-11-20 晶科绿能(上海)管理有限公司 连续拉晶装置和连续拉制晶棒的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741383A (ja) 1993-07-29 1995-02-10 Nippon Steel Corp 半導体単結晶およびその製造方法
JP3085146B2 (ja) 1995-05-31 2000-09-04 住友金属工業株式会社 シリコン単結晶ウェーハおよびその製造方法
JPH09202684A (ja) 1996-01-19 1997-08-05 Shin Etsu Handotai Co Ltd 結晶欠陥が少ないシリコン単結晶の製造方法およびこの方法で製造されたシリコン単結晶
JP3460551B2 (ja) 1997-11-11 2003-10-27 信越半導体株式会社 結晶欠陥の少ないシリコン単結晶ウエーハ及びその製造方法
JP3601324B2 (ja) * 1998-11-19 2004-12-15 信越半導体株式会社 結晶欠陥の少ないシリコン単結晶ウエーハ及びその製造方法
JP3752890B2 (ja) 1999-05-26 2006-03-08 株式会社Sumco シリコン単結晶インゴットの製造方法
WO2001063027A1 (en) * 2000-02-28 2001-08-30 Shin-Etsu Handotai Co., Ltd Method for preparing silicon single crystal and silicon single crystal
WO2001081661A1 (fr) * 2000-04-25 2001-11-01 Shin-Etsu Handotai Co.,Ltd. Tranche de silicium monocristallin, son procede d'elaboration et procede d'obtention d'une tranche de silicium monocristallin
JP3994665B2 (ja) 2000-12-28 2007-10-24 信越半導体株式会社 シリコン単結晶ウエーハおよびシリコン単結晶の製造方法
US7129123B2 (en) * 2002-08-27 2006-10-31 Shin-Etsu Handotai Co., Ltd. SOI wafer and a method for producing an SOI wafer
JP4193610B2 (ja) * 2003-06-27 2008-12-10 信越半導体株式会社 単結晶の製造方法

Also Published As

Publication number Publication date
JPWO2005019506A1 (ja) 2007-11-01
EP1662024A1 (en) 2006-05-31
EP1662024A4 (en) 2008-10-15
US7326395B2 (en) 2008-02-05
KR20060037445A (ko) 2006-05-03
WO2005019506A1 (ja) 2005-03-03
EP1662024B1 (en) 2016-01-13
TW200508429A (en) 2005-03-01
US20060236919A1 (en) 2006-10-26
KR101120615B1 (ko) 2012-03-16
TWI338728B (enExample) 2011-03-11

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