JP4262099B2 - 半導体集積回路の検査治具 - Google Patents

半導体集積回路の検査治具 Download PDF

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Publication number
JP4262099B2
JP4262099B2 JP2004002150A JP2004002150A JP4262099B2 JP 4262099 B2 JP4262099 B2 JP 4262099B2 JP 2004002150 A JP2004002150 A JP 2004002150A JP 2004002150 A JP2004002150 A JP 2004002150A JP 4262099 B2 JP4262099 B2 JP 4262099B2
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Japan
Prior art keywords
semiconductor integrated
integrated circuit
main body
contact
suction passage
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Expired - Lifetime
Application number
JP2004002150A
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English (en)
Japanese (ja)
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JP2005195463A (ja
JP2005195463A5 (enExample
Inventor
智昭 足立
康子 茅根
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Unitechno Inc
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Unitechno Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitechno Inc filed Critical Unitechno Inc
Priority to JP2004002150A priority Critical patent/JP4262099B2/ja
Priority to TW093138414A priority patent/TWI346786B/zh
Priority to US11/029,827 priority patent/US7402995B2/en
Priority to KR1020050001569A priority patent/KR100983226B1/ko
Publication of JP2005195463A publication Critical patent/JP2005195463A/ja
Publication of JP2005195463A5 publication Critical patent/JP2005195463A5/ja
Application granted granted Critical
Publication of JP4262099B2 publication Critical patent/JP4262099B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2004002150A 2004-01-07 2004-01-07 半導体集積回路の検査治具 Expired - Lifetime JP4262099B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004002150A JP4262099B2 (ja) 2004-01-07 2004-01-07 半導体集積回路の検査治具
TW093138414A TWI346786B (en) 2004-01-07 2004-12-10 Jig device for transporting and testing integrated circuit chip
US11/029,827 US7402995B2 (en) 2004-01-07 2005-01-05 Jig device for transporting and testing integrated circuit chip
KR1020050001569A KR100983226B1 (ko) 2004-01-07 2005-01-07 집적회로 칩을 반송하고 테스트하기 위한 지그 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004002150A JP4262099B2 (ja) 2004-01-07 2004-01-07 半導体集積回路の検査治具

Publications (3)

Publication Number Publication Date
JP2005195463A JP2005195463A (ja) 2005-07-21
JP2005195463A5 JP2005195463A5 (enExample) 2008-02-14
JP4262099B2 true JP4262099B2 (ja) 2009-05-13

Family

ID=34747020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004002150A Expired - Lifetime JP4262099B2 (ja) 2004-01-07 2004-01-07 半導体集積回路の検査治具

Country Status (4)

Country Link
US (1) US7402995B2 (enExample)
JP (1) JP4262099B2 (enExample)
KR (1) KR100983226B1 (enExample)
TW (1) TWI346786B (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2696021Y (zh) * 2004-04-15 2005-04-27 鸿富锦精密工业（深圳）有限公司 中央处理器（cpu）安装治具
TWI323503B (en) * 2005-12-12 2010-04-11 Optopac Co Ltd Apparatus, unit and method for testing image sensor packages
US20070152685A1 (en) * 2006-01-03 2007-07-05 Formfactor, Inc. A probe array structure and a method of making a probe array structure
CN101231322B (zh) * 2007-02-09 2011-01-26 段超毅 集成电路开路/短路的测试连接方法
TW200839265A (en) * 2007-03-30 2008-10-01 Au Optronics Corp Testing device and method
KR101007857B1 (ko) * 2008-02-19 2011-01-14 주식회사 오킨스전자 테스트 소켓
US9046568B2 (en) * 2009-03-27 2015-06-02 Essai, Inc. Universal spring contact pin and IC test socket therefor
CN101889763A (zh) * 2010-03-28 2010-11-24 黄超 免提式无绳任意调节组合电吹风
TWI402839B (zh) * 2010-04-15 2013-07-21 Wistron Corp 用於線上燒錄的治具及線上燒錄系統
US20120286818A1 (en) * 2011-05-11 2012-11-15 Qualcomm Incorporated Assembly for optical backside failure analysis of wire-bonded device during electrical testing
JP5966688B2 (ja) * 2012-07-04 2016-08-10 日本電産リード株式会社 配線構造及び基板検査装置
JP5943742B2 (ja) * 2012-07-04 2016-07-05 三菱電機株式会社 半導体試験治具およびそれを用いた半導体試験方法
TWI468709B (zh) * 2013-01-25 2015-01-11 Hon Tech Inc Electronic components operating device and its application of detection equipment
JP2015055575A (ja) * 2013-09-12 2015-03-23 株式会社村田製作所 電子部品の電気特性測定装置
US20180005863A1 (en) * 2015-01-12 2018-01-04 Intel Corporation Minimal contact end-effectors for handling microelectronic devices
KR102332339B1 (ko) * 2015-07-08 2021-12-01 삼성전자주식회사 진공 소켓 및 이를 포함하는 반도체 검사 장비
CN107176450A (zh) * 2016-03-09 2017-09-19 精工爱普生株式会社 电子部件运送装置、以及电子部件检查装置
US10782341B2 (en) * 2018-08-21 2020-09-22 Texas Instruments Incorporated Semiconductor device handler with a floating clamp
US11366156B2 (en) 2019-01-24 2022-06-21 Stmicroelectronics Pte Ltd Crack detection integrity check
KR102545300B1 (ko) * 2019-06-24 2023-06-16 삼성전자주식회사 콜렛 장치 및 이를 이용한 반도체 장치의 제조 방법
KR102164341B1 (ko) * 2019-07-01 2020-10-12 윌테크놀러지(주) 탈부착 가능한 지지돌기부를 갖는 수직형 프로브 카드
CN110456252B (zh) * 2019-07-17 2021-06-22 安徽瑞佑自动化科技有限公司 一种功能检测设备
CN110534469A (zh) * 2019-09-05 2019-12-03 苏州苏驼通信科技股份有限公司 一种用于光模块中的光电二极管的位移对准装置、方法
KR102141535B1 (ko) * 2020-03-03 2020-08-05 장용철 멀티 플라잉 프로브 테스터
CN111965398A (zh) * 2020-08-21 2020-11-20 国网江苏省电力有限公司南通供电分公司 一种游轮配电检测装置及其控制系统
CN112488254B (zh) * 2020-11-02 2024-07-02 昆山丘钛生物识别科技有限公司 一种防呆测试机台
JP2023102503A (ja) * 2022-01-12 2023-07-25 株式会社日本マイクロニクス プローブカードおよび検査システム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4496903A (en) * 1981-05-11 1985-01-29 Burroughs Corporation Circuit board test fixture
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
JPH07294600A (ja) 1994-04-25 1995-11-10 Toshiba Corp 半導体集積回路装置の位置決め搬送装置
US5656942A (en) * 1995-07-21 1997-08-12 Electroglas, Inc. Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
JP4090117B2 (ja) * 1998-06-15 2008-05-28 株式会社アドバンテスト Ｉｃ吸着装置およびこれを用いたｉｃ搬送装置並びにｉｃ試験装置
US6229322B1 (en) * 1998-08-21 2001-05-08 Micron Technology, Inc. Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus
US6893069B1 (en) * 2001-07-16 2005-05-17 Raytheon Company Die edge-picking vacuum tool

Also Published As

Publication number Publication date
KR20050072706A (ko) 2005-07-12
JP2005195463A (ja) 2005-07-21
TW200525159A (en) 2005-08-01
KR100983226B1 (ko) 2010-09-20
US20050156166A1 (en) 2005-07-21
US7402995B2 (en) 2008-07-22
TWI346786B (en) 2011-08-11

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