KR100983226B1 - 집적회로 칩을 반송하고 테스트하기 위한 지그 장치 - Google Patents

집적회로 칩을 반송하고 테스트하기 위한 지그 장치 Download PDF

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Publication number
KR100983226B1
KR100983226B1 KR1020050001569A KR20050001569A KR100983226B1 KR 100983226 B1 KR100983226 B1 KR 100983226B1 KR 1020050001569 A KR1020050001569 A KR 1020050001569A KR 20050001569 A KR20050001569 A KR 20050001569A KR 100983226 B1 KR100983226 B1 KR 100983226B1
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South Korea
Prior art keywords
chip
jig
delete delete
jig device
suction
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Expired - Lifetime
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KR1020050001569A
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English (en)
Korean (ko)
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KR20050072706A (ko
Inventor
아다치도모아키
치노네야스코
Original Assignee
유니테크노 인코퍼레이티드
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Publication of KR20050072706A publication Critical patent/KR20050072706A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020050001569A 2004-01-07 2005-01-07 집적회로 칩을 반송하고 테스트하기 위한 지그 장치 Expired - Lifetime KR100983226B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00002150 2004-01-07
JP2004002150A JP4262099B2 (ja) 2004-01-07 2004-01-07 半導体集積回路の検査治具

Publications (2)

Publication Number Publication Date
KR20050072706A KR20050072706A (ko) 2005-07-12
KR100983226B1 true KR100983226B1 (ko) 2010-09-20

Family

ID=34747020

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050001569A Expired - Lifetime KR100983226B1 (ko) 2004-01-07 2005-01-07 집적회로 칩을 반송하고 테스트하기 위한 지그 장치

Country Status (4)

Country Link
US (1) US7402995B2 (enExample)
JP (1) JP4262099B2 (enExample)
KR (1) KR100983226B1 (enExample)
TW (1) TWI346786B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170007582A (ko) * 2015-07-08 2017-01-19 삼성전자주식회사 진공 소켓 및 이를 포함하는 반도체 검사 장비

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CN2696021Y (zh) * 2004-04-15 2005-04-27 鸿富锦精密工业（深圳）有限公司 中央处理器（cpu）安装治具
TWI323503B (en) * 2005-12-12 2010-04-11 Optopac Co Ltd Apparatus, unit and method for testing image sensor packages
US20070152685A1 (en) * 2006-01-03 2007-07-05 Formfactor, Inc. A probe array structure and a method of making a probe array structure
CN101231322B (zh) * 2007-02-09 2011-01-26 段超毅 集成电路开路/短路的测试连接方法
TW200839265A (en) * 2007-03-30 2008-10-01 Au Optronics Corp Testing device and method
KR101007857B1 (ko) * 2008-02-19 2011-01-14 주식회사 오킨스전자 테스트 소켓
US9046568B2 (en) * 2009-03-27 2015-06-02 Essai, Inc. Universal spring contact pin and IC test socket therefor
CN101889763A (zh) * 2010-03-28 2010-11-24 黄超 免提式无绳任意调节组合电吹风
TWI402839B (zh) * 2010-04-15 2013-07-21 Wistron Corp 用於線上燒錄的治具及線上燒錄系統
US20120286818A1 (en) * 2011-05-11 2012-11-15 Qualcomm Incorporated Assembly for optical backside failure analysis of wire-bonded device during electrical testing
JP5966688B2 (ja) * 2012-07-04 2016-08-10 日本電産リード株式会社 配線構造及び基板検査装置
JP5943742B2 (ja) * 2012-07-04 2016-07-05 三菱電機株式会社 半導体試験治具およびそれを用いた半導体試験方法
TWI468709B (zh) * 2013-01-25 2015-01-11 Hon Tech Inc Electronic components operating device and its application of detection equipment
JP2015055575A (ja) * 2013-09-12 2015-03-23 株式会社村田製作所 電子部品の電気特性測定装置
US20180005863A1 (en) * 2015-01-12 2018-01-04 Intel Corporation Minimal contact end-effectors for handling microelectronic devices
CN107176450A (zh) * 2016-03-09 2017-09-19 精工爱普生株式会社 电子部件运送装置、以及电子部件检查装置
US10782341B2 (en) * 2018-08-21 2020-09-22 Texas Instruments Incorporated Semiconductor device handler with a floating clamp
US11366156B2 (en) 2019-01-24 2022-06-21 Stmicroelectronics Pte Ltd Crack detection integrity check
KR102545300B1 (ko) * 2019-06-24 2023-06-16 삼성전자주식회사 콜렛 장치 및 이를 이용한 반도체 장치의 제조 방법
KR102164341B1 (ko) * 2019-07-01 2020-10-12 윌테크놀러지(주) 탈부착 가능한 지지돌기부를 갖는 수직형 프로브 카드
CN110456252B (zh) * 2019-07-17 2021-06-22 安徽瑞佑自动化科技有限公司 一种功能检测设备
CN110534469A (zh) * 2019-09-05 2019-12-03 苏州苏驼通信科技股份有限公司 一种用于光模块中的光电二极管的位移对准装置、方法
KR102141535B1 (ko) * 2020-03-03 2020-08-05 장용철 멀티 플라잉 프로브 테스터
CN111965398A (zh) * 2020-08-21 2020-11-20 国网江苏省电力有限公司南通供电分公司 一种游轮配电检测装置及其控制系统
CN112488254B (zh) * 2020-11-02 2024-07-02 昆山丘钛生物识别科技有限公司 一种防呆测试机台
JP2023102503A (ja) * 2022-01-12 2023-07-25 株式会社日本マイクロニクス プローブカードおよび検査システム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100711613B1 (ko) * 1998-06-15 2007-04-26 가부시키가이샤 어드밴티스트 집적회로 흡착장치와 이를 이용한 집적회로 반송장치 및 집적회로 시험장치

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US4496903A (en) * 1981-05-11 1985-01-29 Burroughs Corporation Circuit board test fixture
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
JPH07294600A (ja) 1994-04-25 1995-11-10 Toshiba Corp 半導体集積回路装置の位置決め搬送装置
US5656942A (en) * 1995-07-21 1997-08-12 Electroglas, Inc. Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
US6229322B1 (en) * 1998-08-21 2001-05-08 Micron Technology, Inc. Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus
US6893069B1 (en) * 2001-07-16 2005-05-17 Raytheon Company Die edge-picking vacuum tool

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100711613B1 (ko) * 1998-06-15 2007-04-26 가부시키가이샤 어드밴티스트 집적회로 흡착장치와 이를 이용한 집적회로 반송장치 및 집적회로 시험장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170007582A (ko) * 2015-07-08 2017-01-19 삼성전자주식회사 진공 소켓 및 이를 포함하는 반도체 검사 장비
KR102332339B1 (ko) 2015-07-08 2021-12-01 삼성전자주식회사 진공 소켓 및 이를 포함하는 반도체 검사 장비

Also Published As

Publication number Publication date
KR20050072706A (ko) 2005-07-12
JP2005195463A (ja) 2005-07-21
TW200525159A (en) 2005-08-01
US20050156166A1 (en) 2005-07-21
US7402995B2 (en) 2008-07-22
TWI346786B (en) 2011-08-11
JP4262099B2 (ja) 2009-05-13

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