JP4258887B2 - 熱可塑性樹脂組成物およびその製造方法 - Google Patents
熱可塑性樹脂組成物およびその製造方法 Download PDFInfo
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- JP4258887B2 JP4258887B2 JP12079899A JP12079899A JP4258887B2 JP 4258887 B2 JP4258887 B2 JP 4258887B2 JP 12079899 A JP12079899 A JP 12079899A JP 12079899 A JP12079899 A JP 12079899A JP 4258887 B2 JP4258887 B2 JP 4258887B2
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| JP12079899A Expired - Fee Related JP4258887B2 (ja) | 1999-04-27 | 1999-04-27 | 熱可塑性樹脂組成物およびその製造方法 |
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| US12104010B2 (en) | 2021-02-04 | 2024-10-01 | Ticona Llc | Polymer composition for an electric circuit protection device |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3530829B2 (ja) | 2001-03-12 | 2004-05-24 | 日本ピラー工業株式会社 | 電子部品用フッ素樹脂組成物 |
| JP4901015B2 (ja) * | 2001-04-20 | 2012-03-21 | 旭化成ケミカルズ株式会社 | ポリフェニレンエーテル系樹脂組成物 |
| JP4517554B2 (ja) * | 2001-08-02 | 2010-08-04 | 東レ株式会社 | 熱可塑性樹脂組成物および成形品ならびにシャーシまたは筐体 |
| JP2003073530A (ja) * | 2001-09-05 | 2003-03-12 | Asahi Kasei Corp | 樹脂組成物 |
| JP2004083065A (ja) * | 2002-08-27 | 2004-03-18 | Sumitomo Bakelite Co Ltd | 電子部品搬送用容器及びシート |
| JP4194888B2 (ja) * | 2003-06-16 | 2008-12-10 | 日本ポリオレフィン株式会社 | 複合成形品およびその製造方法 |
| JP4498810B2 (ja) * | 2004-04-16 | 2010-07-07 | ポリプラスチックス株式会社 | 液晶樹脂組成物 |
| JP2006182877A (ja) * | 2004-12-27 | 2006-07-13 | Nippon Petrochemicals Co Ltd | 摺動部材 |
| JP4815875B2 (ja) * | 2005-05-25 | 2011-11-16 | Ｊｓｒ株式会社 | 環状オレフィン系樹脂組成物およびその成形体 |
| US20090137724A1 (en) * | 2006-06-13 | 2009-05-28 | Polyplastics Co., Ltd. | Thermoplastic Resin Composition |
| CN101585963B (zh) * | 2009-06-10 | 2011-09-21 | 惠州市沃特新材料有限公司 | 一种彩色导电耐高温模塑料及其制备方法 |
| KR102490028B1 (ko) | 2017-02-24 | 2023-01-18 | 삼성전자주식회사 | 유무기 복합 조성물, 및 이를 포함하는 성형품 및 광학부품 |
| CN111741841B (zh) | 2018-02-20 | 2023-05-30 | 提克纳有限责任公司 | 导热聚合物组合物 |
| JP2018119162A (ja) * | 2018-04-18 | 2018-08-02 | 旭化成株式会社 | 成形体 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US12104010B2 (en) | 2021-02-04 | 2024-10-01 | Ticona Llc | Polymer composition for an electric circuit protection device |
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