JP4250949B2 - 発光装置及びその製造方法 - Google Patents

発光装置及びその製造方法 Download PDF

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Publication number
JP4250949B2
JP4250949B2 JP2002319485A JP2002319485A JP4250949B2 JP 4250949 B2 JP4250949 B2 JP 4250949B2 JP 2002319485 A JP2002319485 A JP 2002319485A JP 2002319485 A JP2002319485 A JP 2002319485A JP 4250949 B2 JP4250949 B2 JP 4250949B2
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Prior art keywords
light
light emitting
epoxy resin
emitting device
emitting element
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JP2002319485A
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Japanese (ja)
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JP2003224305A5 (enrdf_load_stackoverflow
JP2003224305A (ja
Inventor
雅信 佐藤
智也 月岡
雅史 蔵本
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/85909—Post-treatment of the connector or wire bonding area
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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JP2002319485A 2001-11-01 2002-11-01 発光装置及びその製造方法 Expired - Lifetime JP4250949B2 (ja)

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JP2002319485A JP4250949B2 (ja) 2001-11-01 2002-11-01 発光装置及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-336944 2001-11-01
JP2001336944 2001-11-01
JP2002319485A JP4250949B2 (ja) 2001-11-01 2002-11-01 発光装置及びその製造方法

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JP2003224305A JP2003224305A (ja) 2003-08-08
JP2003224305A5 JP2003224305A5 (enrdf_load_stackoverflow) 2005-12-22
JP4250949B2 true JP4250949B2 (ja) 2009-04-08

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Families Citing this family (34)

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JP4337574B2 (ja) * 2003-09-25 2009-09-30 日亜化学工業株式会社 発光装置およびその形成方法
JP5262374B2 (ja) * 2004-11-30 2013-08-14 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2006193570A (ja) * 2005-01-12 2006-07-27 Stanley Electric Co Ltd 熱硬化性樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード
KR101139891B1 (ko) * 2005-01-31 2012-04-27 렌슬러 폴리테크닉 인스티튜트 확산 반사면을 구비한 발광 다이오드 소자
JP4557824B2 (ja) * 2005-07-04 2010-10-06 株式会社東芝 発光装置およびその製造方法
KR100984733B1 (ko) 2005-08-04 2010-10-01 니치아 카가쿠 고교 가부시키가이샤 발광 장치 및 그 제조 방법 및 성형체 및 밀봉 부재
US20100104794A1 (en) * 2005-08-04 2010-04-29 Shin-Etsu Chemical Co., Ltd. Thermosetting epoxy resin composition and semiconductor device
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
JP5135735B2 (ja) * 2006-08-25 2013-02-06 日亜化学工業株式会社 発光装置
CN102516712B (zh) * 2006-11-15 2015-04-22 日立化成株式会社 光反射用热固化性树脂组合物、用该组合物的光半导体元件搭载用基板及其光半导体装置
JP2008144127A (ja) * 2006-11-15 2008-06-26 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体素子搭載用基板、光半導体装置およびこれらの製造方法
JP5380774B2 (ja) * 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
WO2008081794A1 (ja) * 2006-12-28 2008-07-10 Nichia Corporation 発光装置およびその製造方法
JP5470680B2 (ja) 2007-02-06 2014-04-16 日亜化学工業株式会社 発光装置及びその製造方法並びに成形体
KR101309765B1 (ko) * 2007-03-29 2013-09-23 서울반도체 주식회사 색 편차를 줄인 발광 다이오드 패키지
JP5207658B2 (ja) * 2007-05-17 2013-06-12 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物およびその硬化体ならびにそれを用いた光半導体装置
JP4623322B2 (ja) 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
JP5463447B2 (ja) 2008-01-18 2014-04-09 三洋電機株式会社 発光装置及びそれを備えた灯具
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JP2010021533A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
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JP5182512B2 (ja) 2008-12-15 2013-04-17 日亜化学工業株式会社 熱硬化性エポキシ樹脂組成物及び半導体装置
JP5488326B2 (ja) 2009-09-01 2014-05-14 信越化学工業株式会社 光半導体装置用白色熱硬化性シリコーンエポキシ混成樹脂組成物及びその製造方法並びにプレモールドパッケージ及びｌｅｄ装置
JP5246880B2 (ja) * 2009-09-15 2013-07-24 信越化学工業株式会社 アンダーフィル材組成物及び光半導体装置
EP2526572B1 (en) 2010-01-19 2019-08-14 LG Innotek Co., Ltd. Package and manufacturing method of the same
JP5650097B2 (ja) 2011-11-09 2015-01-07 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物及び光半導体装置
KR101881604B1 (ko) 2011-11-21 2018-07-24 신에쓰 가가꾸 고교 가부시끼가이샤 Ｌｅｄ 리플렉터로서 유용한 백색 열경화성 실리콘 수지 조성물 및 상기 조성물을 이용한 광반도체 장치
JP5376014B2 (ja) * 2012-07-03 2013-12-25 日立化成株式会社 光反射用熱硬化性樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
JP5725115B2 (ja) * 2013-09-25 2015-05-27 ウシオ電機株式会社 発光装置及びそれを備えた灯具
JP6194853B2 (ja) 2014-06-06 2017-09-13 信越化学工業株式会社 光半導体装置用白色熱硬化性シリコーン樹脂組成物、及び光半導体素子搭載用ケース
JP6311626B2 (ja) 2015-02-20 2018-04-18 信越化学工業株式会社 Ｌｅｄリフレクター用白色熱硬化性エポキシ樹脂組成物
JP6809518B2 (ja) * 2018-08-28 2021-01-06 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP7054019B2 (ja) * 2020-04-27 2022-04-13 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法

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