JP4238666B2 - 発光装置の製造方法 - Google Patents

発光装置の製造方法 Download PDF

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Publication number
JP4238666B2
JP4238666B2 JP2003276099A JP2003276099A JP4238666B2 JP 4238666 B2 JP4238666 B2 JP 4238666B2 JP 2003276099 A JP2003276099 A JP 2003276099A JP 2003276099 A JP2003276099 A JP 2003276099A JP 4238666 B2 JP4238666 B2 JP 4238666B2
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JP
Japan
Prior art keywords
glass
light
led element
light emitting
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003276099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005039122A5 (enExample
JP2005039122A (ja
Inventor
好伸 末広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2003276099A priority Critical patent/JP4238666B2/ja
Priority to DE102004063978.7A priority patent/DE102004063978B4/de
Priority to DE102004034166.4A priority patent/DE102004034166B4/de
Priority to US10/891,422 priority patent/US7391153B2/en
Priority to CN2009100096747A priority patent/CN101476710B/zh
Priority to CNB2004100712619A priority patent/CN100472820C/zh
Publication of JP2005039122A publication Critical patent/JP2005039122A/ja
Publication of JP2005039122A5 publication Critical patent/JP2005039122A5/ja
Application granted granted Critical
Publication of JP4238666B2 publication Critical patent/JP4238666B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2003276099A 2003-07-17 2003-07-17 発光装置の製造方法 Expired - Fee Related JP4238666B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003276099A JP4238666B2 (ja) 2003-07-17 2003-07-17 発光装置の製造方法
DE102004034166.4A DE102004034166B4 (de) 2003-07-17 2004-07-15 Lichtemittierende Vorrichtung
US10/891,422 US7391153B2 (en) 2003-07-17 2004-07-15 Light emitting device provided with a submount assembly for improved thermal dissipation
DE102004063978.7A DE102004063978B4 (de) 2003-07-17 2004-07-15 Lichtemittierende Vorrichtung
CN2009100096747A CN101476710B (zh) 2003-07-17 2004-07-16 发光器件及其制造方法
CNB2004100712619A CN100472820C (zh) 2003-07-17 2004-07-16 发光器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003276099A JP4238666B2 (ja) 2003-07-17 2003-07-17 発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005039122A JP2005039122A (ja) 2005-02-10
JP2005039122A5 JP2005039122A5 (enExample) 2007-06-07
JP4238666B2 true JP4238666B2 (ja) 2009-03-18

Family

ID=34212528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003276099A Expired - Fee Related JP4238666B2 (ja) 2003-07-17 2003-07-17 発光装置の製造方法

Country Status (2)

Country Link
JP (1) JP4238666B2 (enExample)
CN (1) CN101476710B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112417A1 (ja) * 2005-04-15 2006-10-26 Asahi Glass Company, Limited ガラス封止発光素子、ガラス封止発光素子付き回路基板およびそれらの製造方法
JP4604819B2 (ja) * 2005-04-28 2011-01-05 豊田合成株式会社 発光装置
JP2007201354A (ja) * 2006-01-30 2007-08-09 Matsushita Electric Ind Co Ltd 発光モジュール
JP2007258466A (ja) * 2006-03-23 2007-10-04 Sumita Optical Glass Inc 照明装置及び発光装置
DE102008021436A1 (de) * 2008-04-29 2010-05-20 Schott Ag Optik-Konverter-System für (W)LEDs
BRPI0913195A2 (pt) * 2008-05-30 2016-01-12 Sharp Kk dispostivo emissor de luz, fonte de luz de superfície, dispositivo de vídeo de cristal líquido e método para a fabricação de dispositivo emissor de luz
WO2011007816A1 (ja) * 2009-07-15 2011-01-20 三菱化学株式会社 半導体発光素子、半導体発光装置、半導体発光素子の製造方法、および半導体発光装置の製造方法
JP2013077798A (ja) * 2011-09-14 2013-04-25 Toyoda Gosei Co Ltd ガラス封止ｌｅｄランプ及びその製造方法
JP5880025B2 (ja) * 2011-12-26 2016-03-08 日亜化学工業株式会社 発光装置
KR102059030B1 (ko) * 2012-09-24 2019-12-24 엘지이노텍 주식회사 자외선 발광 소자
JP2015079929A (ja) * 2013-09-11 2015-04-23 株式会社東芝 半導体発光装置及びその製造方法
JP6477734B2 (ja) * 2016-06-30 2019-03-06 日亜化学工業株式会社 発光装置及びその製造方法
CN110118312A (zh) * 2018-02-07 2019-08-13 深圳光峰科技股份有限公司 波长转换装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5995652U (ja) * 1982-12-18 1984-06-28 株式会社東芝 発光素子
EP0405757A3 (en) * 1989-06-27 1991-01-30 Hewlett-Packard Company High efficiency light-emitting diode
JP2979961B2 (ja) * 1994-06-14 1999-11-22 日亜化学工業株式会社 フルカラーｌｅｄディスプレイ
EP1271625A3 (en) * 1994-12-27 2007-05-16 Fujitsu Limited Method of fabrication compound semiconductor device
CN1264228C (zh) * 1996-06-26 2006-07-12 奥斯兰姆奥普托半导体股份有限两合公司 发光半导体器件、全色发光二极管显示装置及其应用
JPH1140871A (ja) * 1997-07-22 1999-02-12 Mitsubishi Chem Corp 光電変換素子
JP2861991B2 (ja) * 1997-10-20 1999-02-24 日亜化学工業株式会社 窒化ガリウム系化合物半導体チップの製造方法
JP3449201B2 (ja) * 1997-11-28 2003-09-22 日亜化学工業株式会社 窒化物半導体素子の製造方法
JPH11177129A (ja) 1997-12-16 1999-07-02 Rohm Co Ltd チップ型ｌｅｄ、ｌｅｄランプおよびｌｅｄディスプレイ
JP2924961B1 (ja) 1998-01-16 1999-07-26 サンケン電気株式会社 半導体発光装置及びその製法
JP3707279B2 (ja) * 1998-03-02 2005-10-19 松下電器産業株式会社 半導体発光装置
JP3337000B2 (ja) * 1999-06-07 2002-10-21 サンケン電気株式会社 半導体発光装置
JP2001144331A (ja) * 1999-09-02 2001-05-25 Toyoda Gosei Co Ltd 発光装置
JP2001185757A (ja) * 1999-12-27 2001-07-06 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体発光素子
JP3989794B2 (ja) * 2001-08-09 2007-10-10 松下電器産業株式会社 Ｌｅｄ照明装置およびｌｅｄ照明光源
JP2003147346A (ja) * 2001-11-15 2003-05-21 Kansai Tlo Kk 希土類錯体を用いた光機能材料及び発光装置
JP2003188410A (ja) * 2001-12-19 2003-07-04 Daido Steel Co Ltd 発光ダイオードチップ

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Publication number Publication date
CN101476710A (zh) 2009-07-08
CN101476710B (zh) 2011-01-05
JP2005039122A (ja) 2005-02-10

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