JP4201079B2 - 発光素子、その製造方法およびｌｅｄランプ - Google Patents

発光素子、その製造方法およびｌｅｄランプ Download PDF

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Publication number
JP4201079B2
JP4201079B2 JP2002369092A JP2002369092A JP4201079B2 JP 4201079 B2 JP4201079 B2 JP 4201079B2 JP 2002369092 A JP2002369092 A JP 2002369092A JP 2002369092 A JP2002369092 A JP 2002369092A JP 4201079 B2 JP4201079 B2 JP 4201079B2
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Prior art keywords
substrate
light
layer
emitting element
gan
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Expired - Lifetime
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JP2002369092A
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Japanese (ja)
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JP2004200523A (ja
Inventor
剛規 安田
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Resonac Holdings Corp
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Showa Denko KK
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Priority to JP2002369092A priority Critical patent/JP4201079B2/ja
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to PCT/JP2003/016330 priority patent/WO2004057682A1/ja
Priority to KR1020057011483A priority patent/KR100802452B1/ko
Priority to DE10393949T priority patent/DE10393949T5/de
Priority to CNB2003801090522A priority patent/CN100361322C/zh
Priority to AU2003292584A priority patent/AU2003292584A1/en
Priority to TW92136289A priority patent/TWI241032B/zh
Priority to US10/742,640 priority patent/US7042150B2/en
Publication of JP2004200523A publication Critical patent/JP2004200523A/ja
Application granted granted Critical
Publication of JP4201079B2 publication Critical patent/JP4201079B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/0242—Crystalline insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/02428—Structure
    • H01L21/0243—Surface structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639—Preparation of substrate for selective deposition

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Devices (AREA)
JP2002369092A 2002-12-20 2002-12-20 発光素子、その製造方法およびｌｅｄランプ Expired - Lifetime JP4201079B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2002369092A JP4201079B2 (ja) 2002-12-20 2002-12-20 発光素子、その製造方法およびｌｅｄランプ
KR1020057011483A KR100802452B1 (ko) 2002-12-20 2003-12-19 발광소자, 그 제조방법 및 ｌｅｄ램프
DE10393949T DE10393949T5 (de) 2002-12-20 2003-12-19 Lichtemittierende Vorrichtung, Verfahren zum Herstellen der Vorrichtung und LED-Lampe, bei der die Vorrichtung verwendet wird
CNB2003801090522A CN100361322C (zh) 2002-12-20 2003-12-19 发光元件、其制造方法以及led灯
PCT/JP2003/016330 WO2004057682A1 (ja) 2002-12-20 2003-12-19 発光素子、その製造方法およびｌｅｄランプ
AU2003292584A AU2003292584A1 (en) 2002-12-20 2003-12-19 Light-emitting device, method for manufacturing same, and led lamp
TW92136289A TWI241032B (en) 2002-12-20 2003-12-19 Light-emitting device, method of fabricating the same, and LED lamp
US10/742,640 US7042150B2 (en) 2002-12-20 2003-12-22 Light-emitting device, method of fabricating the device, and LED lamp using the device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002369092A JP4201079B2 (ja) 2002-12-20 2002-12-20 発光素子、その製造方法およびｌｅｄランプ

Related Child Applications (2)

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JP2008213855A Division JP2008277871A (ja) 2008-08-22 2008-08-22 Ｌｅｄランプ
JP2008213856A Division JP2008288617A (ja) 2008-08-22 2008-08-22 Ｌｅｄランプ

Publications (2)

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JP2004200523A JP2004200523A (ja) 2004-07-15
JP4201079B2 true JP4201079B2 (ja) 2008-12-24

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JP2002369092A Expired - Lifetime JP4201079B2 (ja) 2002-12-20 2002-12-20 発光素子、その製造方法およびｌｅｄランプ

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Country Link
JP (1) JP4201079B2 (zh)
KR (1) KR100802452B1 (zh)
CN (1) CN100361322C (zh)
AU (1) AU2003292584A1 (zh)
DE (1) DE10393949T5 (zh)
TW (1) TWI241032B (zh)
WO (1) WO2004057682A1 (zh)

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KR100649494B1 (ko) 2004-08-17 2006-11-24 삼성전기주식회사 레이저를 이용하여 발광 다이오드 기판을 표면 처리하는발광 다이오드 제조 방법 및 이 방법에 의해 제조된 발광다이오드
JP2006066442A (ja) * 2004-08-24 2006-03-09 Kyocera Corp 半導体素子用単結晶サファイア基板とその製造方法及び半導体発光素子
CN100461471C (zh) * 2004-11-11 2009-02-11 晶元光电股份有限公司 高亮度的发光元件及其制造方法
KR100624449B1 (ko) 2004-12-08 2006-09-18 삼성전기주식회사 요철 구조를 포함하는 발광 소자 및 그 제조 방법
US20070145386A1 (en) 2004-12-08 2007-06-28 Samsung Electro-Mechanics Co., Ltd. Semiconductor light emitting device and method of manufacturing the same
JP5082278B2 (ja) 2005-05-16 2012-11-28 ソニー株式会社 発光ダイオードの製造方法、集積型発光ダイオードの製造方法および窒化物系ｉｉｉ−ｖ族化合物半導体の成長方法
KR20070081184A (ko) 2006-02-10 2007-08-16 삼성전기주식회사 질화물계 반도체 발광소자 및 그 제조방법
WO2007098215A2 (en) * 2006-02-17 2007-08-30 The Regents Of The University Of California Method for growth of semipolar (al,in,ga,b)n optoelectronic devices
TWI288491B (en) * 2006-03-02 2007-10-11 Nat Univ Chung Hsing High extraction efficiency of solid-state light emitting device
KR100786777B1 (ko) * 2006-03-28 2007-12-18 전북대학교산학협력단 반도체 구조물의 제조 방법
DE102007004302A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips
KR20090082923A (ko) * 2006-11-15 2009-07-31 더 리전츠 오브 더 유니버시티 오브 캘리포니아 다중 추출기를 통하여 광을 고효율로 추출하는 발광 다이오드
JP5176334B2 (ja) * 2007-02-01 2013-04-03 日亜化学工業株式会社 半導体発光素子
KR101364168B1 (ko) * 2007-03-20 2014-02-18 서울바이오시스 주식회사 발광 소자용 기판 제조방법
JP4804444B2 (ja) * 2007-10-31 2011-11-02 泰谷光電科技股▲ふん▼有限公司 発光ダイオードの構造及びその製造方法
CN101488545B (zh) * 2008-01-18 2011-10-05 泰谷光电科技股份有限公司 发光二极管基板表面粗化的方法
CN101533881B (zh) * 2008-03-11 2012-05-02 广镓光电股份有限公司 半导体发光组件
CN101621097B (zh) * 2008-07-04 2011-12-28 泰谷光电科技股份有限公司 光电装置及其制造方法
CN101661981B (zh) * 2008-08-29 2014-10-22 广镓光电股份有限公司 用于制造发光元件的基板以及利用该基板制造的发光元件
CN102024885A (zh) * 2009-09-10 2011-04-20 鸿富锦精密工业（深圳）有限公司 氮化物半导体发光元件
JP5603085B2 (ja) * 2010-01-06 2014-10-08 株式会社ディスコ 光デバイスウエーハの製造方法
JP2010135855A (ja) * 2010-03-16 2010-06-17 Showa Denko Kk 発光素子の製造方法及び発光素子
JP2010147505A (ja) * 2010-03-16 2010-07-01 Showa Denko Kk 発光素子の製造方法及び発光素子
US8217488B2 (en) * 2010-07-19 2012-07-10 Walsin Lihwa Corporation GaN light emitting diode and method for increasing light extraction on GaN light emitting diode via sapphire shaping
CN101937967B (zh) * 2010-09-14 2012-07-04 映瑞光电科技(上海)有限公司 发光二极管、发光装置及制造方法
CN102130249B (zh) * 2010-09-28 2013-05-01 映瑞光电科技(上海)有限公司 超亮度发光二极管及其制作方法
CN102130271A (zh) * 2010-09-28 2011-07-20 映瑞光电科技(上海)有限公司 Led芯片封装结构与白光led发光装置
JP5246235B2 (ja) * 2010-09-30 2013-07-24 豊田合成株式会社 Ｉｉｉ族窒化物半導体発光素子の製造方法
JP5246236B2 (ja) * 2010-09-30 2013-07-24 豊田合成株式会社 Ｉｉｉ族窒化物半導体発光素子の製造方法
KR20140068793A (ko) * 2010-10-29 2014-06-09 더 리전츠 오브 더 유니버시티 오브 캘리포니아 서로 간에 예각, 직각 또는 둔각을 이루는 적어도 2개의 표면들을 가진 시드들 상에서의 ⅲ-족 질화물 결정들의 암모니아 열적 성장
CN102324460A (zh) * 2011-10-24 2012-01-18 佛山市国星光电股份有限公司 基于图形化封装基板的led封装装置
JP5811009B2 (ja) 2012-03-30 2015-11-11 豊田合成株式会社 Ｉｉｉ族窒化物半導体の製造方法及びｉｉｉ族窒化物半導体
CN103545170A (zh) * 2012-07-13 2014-01-29 华夏光股份有限公司 半导体装置及其制造方法
JP2014034481A (ja) * 2012-08-07 2014-02-24 Hitachi Metals Ltd 窒化ガリウム結晶成長用サファイア基板、窒化ガリウム結晶の製造方法、及び窒化ガリウム結晶
EP3043392A1 (en) * 2012-10-12 2016-07-13 Asahi Kasei E-materials Corporation Optical substrate, semiconductor light emitting device and manufacturing method of the same
KR20140085918A (ko) * 2012-12-28 2014-07-08 서울바이오시스 주식회사 발광 소자 및 그것을 제조하는 방법
JP6020357B2 (ja) 2013-05-31 2016-11-02 豊田合成株式会社 Ｉｉｉ族窒化物半導体の製造方法及びｉｉｉ族窒化物半導体
WO2015012403A1 (ja) * 2013-07-26 2015-01-29 株式会社トクヤマ ベース基板の前処理方法、および該前処理を行ったベース基板を用いた積層体の製造方法
TWI640104B (zh) * 2014-05-30 2018-11-01 日商日亞化學工業股份有限公司 氮化物半導體元件及其製造方法
JP6227134B2 (ja) * 2014-06-03 2017-11-08 シャープ株式会社 窒化物半導体発光素子
CN104752586A (zh) * 2015-03-27 2015-07-01 华南理工大学 一种led图形优化封装基板、led封装体及其制备方法
TWI778010B (zh) * 2017-01-26 2022-09-21 晶元光電股份有限公司 發光元件

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JP3439063B2 (ja) * 1997-03-24 2003-08-25 三洋電機株式会社 半導体発光素子および発光ランプ
JP4032538B2 (ja) * 1998-11-26 2008-01-16 ソニー株式会社 半導体薄膜および半導体素子の製造方法
JP3633447B2 (ja) * 1999-09-29 2005-03-30 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体素子
JP3556916B2 (ja) 2000-09-18 2004-08-25 三菱電線工業株式会社 半導体基材の製造方法
JP3595276B2 (ja) * 2001-03-21 2004-12-02 三菱電線工業株式会社 紫外線発光素子
JP3595277B2 (ja) * 2001-03-21 2004-12-02 三菱電線工業株式会社 ＧａＮ系半導体発光ダイオード
JP4055503B2 (ja) * 2001-07-24 2008-03-05 日亜化学工業株式会社 半導体発光素子

Also Published As

Publication number Publication date
KR100802452B1 (ko) 2008-02-13
TWI241032B (en) 2005-10-01
CN100361322C (zh) 2008-01-09
JP2004200523A (ja) 2004-07-15
DE10393949T5 (de) 2011-12-01
TW200418207A (en) 2004-09-16
WO2004057682A1 (ja) 2004-07-08
AU2003292584A1 (en) 2004-07-14
KR20050091736A (ko) 2005-09-15
CN1742381A (zh) 2006-03-01

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