JP4188914B2 - 妨害抑圧装置 - Google Patents
妨害抑圧装置 Download PDFInfo
- Publication number
- JP4188914B2 JP4188914B2 JP2004528314A JP2004528314A JP4188914B2 JP 4188914 B2 JP4188914 B2 JP 4188914B2 JP 2004528314 A JP2004528314 A JP 2004528314A JP 2004528314 A JP2004528314 A JP 2004528314A JP 4188914 B2 JP4188914 B2 JP 4188914B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- casing
- suppression device
- circuit board
- interference suppression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B15/00—Suppression or limitation of noise or interference
- H04B15/02—Reducing interference from electric apparatus by means located at or near the interfering apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
- H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/28—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
- H01R24/30—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable with additional earth or shield contacts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0066—Constructional details of transient suppressor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Description
Claims (18)
- 少なくとも1つの差込部材を有するプラグイン機構が設けられており、該プラグイン機構は電子機器の導電性ケーシングに配置されており、
該ケーシング内に配置された回路基板が設けられており、該回路基板は電気的および/または電子的な回路を担持しており、該回路基板に向かって差込部材が案内され、
コンデンサが設けられており、該コンデンサの第2のコンデンサ面は差込部材と接続されており、該コンデンサの第1のコンデンサ面はケーシング電位におかれている形式の、
電子機器のための妨害抑圧装置において、
一部分(9)が開口部(3)を通してケーシング内部(4)から突出した回路基板(5)にコンデンサ(19,22)が配置されており、
該コンデンサ(19,22)もケーシング内部(4)からケーシング外部(10)へ向かって延在しており、
該ケーシング外部(10)に位置する回路基板(5)の一部分(9)で差込部材(8)が前記コンデンサ(19,22)および回路と導電接続されており、
前記第1のコンデンサ面(18)は回路基板(5)の表面に配置されており、
ケーシング壁(2)が開口部(3)の領域で互いに並置された遮蔽アーム(27,28)を有しており、
該遮蔽アームはケーシング外部(10)からケーシング内部(4)へと延在する1つまたは複数のコンデンサ(19,22)の領域で短く形成されていて該遮蔽アームの自由端は前記第1のコンデンサ面(18)と当接しており、
該遮蔽アーム(28)は、ケーシング外部(10)からケーシング内部(4)へと延在する前記コンデンサ(19,22)のない領域で長く形成されており、回路基板(5)中の貫通開口部(30)を通って該遮蔽アーム(28)の自由端がケーシング(1)の壁部に当接するまで延在しており、
前記遮蔽アーム(27,28)は第1のコンデンサ面(18)およびケーシング(1)の壁部にばねの予備荷重によって当接していることを特徴とする、
電子機器のための妨害抑圧装置。 - 請求項1記載の妨害抑圧装置において、
前記コンデンサ(19)は第1および第2のコンデンサ面(18,12)から成り、該前記第1および第2のコンデンサ面(18,12)は絶縁層(17)により互いに分離されて対向して配置されており、
前記第1のコンデンサ面(18)はケーシング(5)の電位におかれており、第2のコンデンサ面(12)は回路と導電接続されていることを特徴とする妨害抑圧装置。 - 請求項2記載の妨害抑圧装置において、
前記絶縁層(17)は回路基板(5)により形成されていることを特徴とする妨害抑圧装置。 - 請求項3記載の妨害抑圧装置において、
同じ差込部材(8)に対して別のコンデンサ(22)を形成するため前記回路基板(5)は、上下に位置しており互いに電気的に絶縁された2つの別のコンデンサ面(13,21)を有しており、
第3のコンデンサ面(13)が前記差込部材(8)と導電接続されており、第4のコンデンサ面(21)はケーシング電位におかれていることを特徴とする妨害抑圧装置。 - 請求項4記載の妨害抑圧装置において、
前記第4のコンデンサ面(21)は回路基板(5)の表面に配置されていることを特徴とする妨害抑圧装置。 - 請求項2から5のいずれか1項記載の妨害抑圧装置において、
前記コンデンサ面のうち1つまたは複数のコンデンサ面は回路基板のコンデンサ層であることを特徴とする妨害抑圧装置。 - 請求項1から6のいずれか1項記載の妨害抑圧装置において、
1つまたは複数の差込部材または該差込部材と導電接続されたコンデンサ面(12)は、信号線路(15)を介して回路と導電接続されていることを特徴とする妨害抑圧装置。 - 請求項7記載の妨害抑圧装置において、
前記信号線路(15)は回路基板に取り付けられた層導体であることを特徴とする妨害抑圧装置。 - 請求項1から8のいずれか1項記載の妨害抑圧装置において、
前記ケーシング(1)の開口部(3)は該開口部(3)を通って案内された回路基板(5)を密に取り囲んでいることを特徴とする妨害抑圧装置。 - 請求項9記載の妨害抑圧装置において、
前記ケーシング(1)は該ケーシングの開口部領域で、前記回路基板(5)の表面に配置されたコンデンサ(19,22)の第1および/または第4のコンデンサ面(18,21)と電気的に接触接続されていることを特徴とする妨害抑圧装置。 - 請求項9記載の妨害抑圧装置において、
前記ケーシング(1)は該ケーシングの開口部領域で、第1および/または第4のコンデンサ面(18)に弾性的に当接していることを特徴とする妨害抑圧装置。 - 請求項9または10記載の妨害抑圧装置において、
前記ケーシングの開口部領域は接続部材たとえばリベットによって第1および/または第4のコンデンサ面と接続されていることを特徴とする妨害抑圧装置。 - 請求項9記載の妨害抑圧装置において、
前記ケーシングの開口部領域の一部分が第1および/または第4のコンデンサ面の対応する切り欠きにプレスばめによりはめ込まれていることを特徴とする妨害抑圧装置。 - 請求項9から12のいずれか1項記載の妨害抑圧装置において、
前記ケーシング(1)は該ケーシングの開口部領域で、導電性接着剤またははんだ付けにより第1および/または第4のコンデンサ面(18,21)と導電接続されていることを特徴とする妨害抑圧装置。 - 請求項9記載の妨害抑圧装置において、
前記ケーシングは第1および/または第4のコンデンサ面と容量結合されていることを特徴とする妨害抑圧装置。 - 請求項1から15のいずれか1項記載の妨害抑圧装置において、
前記コンデンサ(19)および/または前記別のコンデンサ(22)は妨害抑圧コンデンサ(16)を介して回路と接続されていることを特徴とする妨害抑圧装置。 - 請求項16記載の妨害抑圧装置において、
前記ケーシング壁(2,23″)は開口部(3)の領域で打ち抜き撓み部材として構成されていることを特徴とする妨害抑圧装置。 - 請求項1から17のいずれか1項記載の妨害抑圧装置において、
ケーシング外部(10)に存在する回路基板(5)の一部分(9)およびコンデンサ(19,22)ならびに差込部材(8)が、導電性で形成された外側のケーシングチャンバ(24,24′,24″)内に配置されていることを特徴とする妨害抑圧装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10233318A DE10233318C1 (de) | 2002-07-22 | 2002-07-22 | Entstöreinrichtung |
PCT/DE2003/002031 WO2004017471A1 (de) | 2002-07-22 | 2003-06-18 | Entstöreinrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005534194A JP2005534194A (ja) | 2005-11-10 |
JP4188914B2 true JP4188914B2 (ja) | 2008-12-03 |
Family
ID=27771558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004528314A Expired - Fee Related JP4188914B2 (ja) | 2002-07-22 | 2003-06-18 | 妨害抑圧装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7269033B2 (ja) |
EP (1) | EP1523791A1 (ja) |
JP (1) | JP4188914B2 (ja) |
KR (1) | KR20050025633A (ja) |
DE (1) | DE10233318C1 (ja) |
WO (1) | WO2004017471A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100882801B1 (ko) | 2007-04-25 | 2009-02-09 | 박휴완 | 도광판 조명장치 |
DE102007032510A1 (de) * | 2007-07-12 | 2009-01-15 | Robert Bosch Gmbh | Elektrisches Gerät und Verfahren zur Herstellung eines elektrischen Geräts |
US7670147B1 (en) * | 2008-10-16 | 2010-03-02 | Elka International Ltd. | Capacitance circuit board signal-adjusting device |
EP2209172A1 (en) * | 2009-01-15 | 2010-07-21 | 3M Innovative Properties Company | Telecommunications Jack with a Multilayer PCB |
WO2013129982A1 (en) * | 2012-03-01 | 2013-09-06 | Autoliv Development Ab | An electronic unit with a pcb and two housing parts |
JP6129643B2 (ja) * | 2013-05-22 | 2017-05-17 | 日立オートモティブシステムズ株式会社 | 制御装置、コネクタ、及びコネクタ用積層コンデンサ |
JP2017118015A (ja) * | 2015-12-25 | 2017-06-29 | 株式会社トーキン | 電子装置及び電磁干渉抑制体の配置方法 |
EP3544126B1 (en) * | 2016-12-08 | 2021-09-22 | Huawei Technologies Co., Ltd. | Device having usb port |
JP6819778B2 (ja) * | 2017-05-18 | 2021-01-27 | 株式会社村田製作所 | 携帯型電子機器 |
KR102454815B1 (ko) * | 2018-02-21 | 2022-10-17 | 삼성전자주식회사 | 브라켓과 용량성 결합을 형성하고, 상기 브라켓에 배치된 복수의 회로 기판들의 접지부들과 전기적으로 연결된 도전성 부재를 포함하는 전자 장치 |
CN112136372B (zh) * | 2018-05-18 | 2023-07-14 | 日产自动车株式会社 | 屏蔽框体 |
DE102021206103B4 (de) * | 2021-06-15 | 2023-01-19 | Vitesco Technologies GmbH | Vorrichtung |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4820174A (en) * | 1986-08-06 | 1989-04-11 | Amp Incorporated | Modular connector assembly and filtered insert therefor |
US4894015A (en) * | 1988-08-31 | 1990-01-16 | Delco Electronics Corporation | Flexible circuit interconnector and method of assembly thereof |
EP0487984B1 (en) * | 1990-11-27 | 1995-06-14 | THOMAS & BETTS CORPORATION | Filtered plug connector |
DE9016083U1 (ja) | 1990-11-27 | 1991-02-14 | Thomas & Betts Corp., Bridgewater, N.J., Us | |
JP2999261B2 (ja) * | 1990-12-21 | 2000-01-17 | シーメンス アクチエンゲゼルシヤフト | 回路、例えば自動車のエヤーバックの制御回路用の高周波を遮蔽するケーシング |
DE9107385U1 (ja) * | 1991-06-14 | 1992-07-16 | Filtec Filtertechnologie Fuer Die Elektronikindustrie Gmbh, 4780 Lippstadt, De | |
US5286221A (en) * | 1992-10-19 | 1994-02-15 | Molex Incorporated | Filtered electrical connector assembly |
TW218060B (en) * | 1992-12-23 | 1993-12-21 | Panduit Corp | Communication connector with capacitor label |
DE4326486A1 (de) * | 1993-08-06 | 1995-02-09 | Siemens Ag | Filter-Stecker |
US5509825A (en) * | 1994-11-14 | 1996-04-23 | General Motors Corporation | Header assembly having a quick connect filter pack |
US5562498A (en) * | 1994-12-21 | 1996-10-08 | Delco Electronics Corp. | Flexible capacitor filter |
US5865648A (en) * | 1997-01-16 | 1999-02-02 | Elco U.S.A. Inc. | Multifunction electronic connector |
US6142831A (en) * | 1999-02-01 | 2000-11-07 | Aux Corporation | Multifunction connector assembly |
DE29911342U1 (de) * | 1999-07-02 | 2000-08-24 | Filtec Gmbh | Vielpolige Winkelsteckvorrichtung |
DE10041286A1 (de) * | 2000-04-20 | 2001-10-31 | Mannesmann Vdo Ag | Entstöreinrichtung |
DE20118263U1 (de) * | 2001-11-09 | 2002-12-19 | Filtec Gmbh | Kondensator-Körper |
-
2002
- 2002-07-22 DE DE10233318A patent/DE10233318C1/de not_active Expired - Fee Related
-
2003
- 2003-06-18 KR KR1020057001072A patent/KR20050025633A/ko not_active Application Discontinuation
- 2003-06-18 EP EP03740098A patent/EP1523791A1/de not_active Withdrawn
- 2003-06-18 WO PCT/DE2003/002031 patent/WO2004017471A1/de active Application Filing
- 2003-06-18 JP JP2004528314A patent/JP4188914B2/ja not_active Expired - Fee Related
- 2003-06-18 US US10/522,090 patent/US7269033B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7269033B2 (en) | 2007-09-11 |
WO2004017471A1 (de) | 2004-02-26 |
JP2005534194A (ja) | 2005-11-10 |
EP1523791A1 (de) | 2005-04-20 |
KR20050025633A (ko) | 2005-03-14 |
US20050221638A1 (en) | 2005-10-06 |
DE10233318C1 (de) | 2003-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2546590Y2 (ja) | フィルタコネクタ及びフィルタコネクタ用遮蔽板 | |
US4995834A (en) | Noise filter connector | |
JPH03116674A (ja) | 電気フイルタコネクタ | |
US4126840A (en) | Filter connector | |
US5516294A (en) | Coaxial interconnection system | |
EP0467400A1 (en) | Filter and electrical connector with filter | |
JPH0395880A (ja) | 電気フィルタコネクタの製造法 | |
JP4188914B2 (ja) | 妨害抑圧装置 | |
JPH0777140B2 (ja) | フィルタ付きプラグコネクタ | |
JPH07153530A (ja) | フィルタ型電気コネクタ | |
JPS6030074B2 (ja) | 電気コネクタ | |
US10418756B2 (en) | Plug connector with integrated galvanic separation and shielding element | |
JP3853375B2 (ja) | 高周波を減衰する遮蔽ハウジングを有する電子回路 | |
EP0123457A1 (en) | Filter connector | |
US20040082208A1 (en) | Electrical connector with rear ground plate | |
JP2019192656A (ja) | 電気コネクタ | |
JP5987721B2 (ja) | ケーブルコネクタおよびケーブルアッセンブリ | |
JPH0519998Y2 (ja) | ||
US20070035939A1 (en) | Reduced cost conductive interface | |
EP0382148B1 (en) | Noise filter connector | |
JPH0676887A (ja) | コネクタ装置 | |
JP2002208794A (ja) | 電磁波障害防止用部品 | |
JP3019374B2 (ja) | コネクタ装置 | |
JPH07105609B2 (ja) | 回路装置 | |
JPH118019A (ja) | フィルタ付電気コネクタ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070718 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20071017 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20071024 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071119 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080118 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080515 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20080528 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080626 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080710 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080813 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080911 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110919 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110919 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110919 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120919 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120919 Year of fee payment: 4 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120919 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130919 Year of fee payment: 5 |
|
LAPS | Cancellation because of no payment of annual fees |