Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04B—TRANSMISSION
  • H04B15/00—Suppression or limitation of noise or interference
  • H04B15/02—Reducing interference from electric apparatus by means located at or near the interfering apparatus
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
  • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
  • H01R13/6581—Shield structure
  • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
  • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
  • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
  • H01R13/6581—Shield structure
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
  • H01R13/6608—Structural association with built-in electrical component with built-in single component
  • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
  • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
  • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
  • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
  • H01R24/28—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
  • H01R24/30—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable with additional earth or shield contacts
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
  • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
  • H05K9/0066—Constructional details of transient suppressor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
  • H01R13/6461—Means for preventing cross-talk
  • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
  • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
  • H05K1/0298—Multilayer circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/09672—Superposed layout, i.e. in different planes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10189—Non-printed connector
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10371—Shields or metal cases

Definitions

• the invention relates to an interference suppressor for an electronic device with a plug device having at least one plug element, which is arranged on an electrically conductive housing of the electronic device, with a printed circuit board arranged in the housing and carrying an electrical and / or electronic circuit. to which the plug-in element leads and with a capacitor which is connected on the one hand to the plug-in element and on the other hand to the potential of the housing.
• the object of the invention is therefore to provide an interference suppression device of the type mentioned at the outset which, with a simple and inexpensive construction, ensures good shielding against, in particular, high-frequency interference radiation and is also suitable for mass production.
• this object is achieved in that the capacitor is arranged on the printed circuit board projecting in part through an opening from the interior of the housing and also extends from the interior of the housing to the exterior of the housing, and in that the plug-in element on the exterior of the housing located part of the circuit board is conductively connected to the capacitor and the circuit.
• This design has the advantage that the interference suppression already takes place on the outside of the electronic device and interference radiation does not even get into the interior of the housing.
• Such an interference suppression device has few components and is therefore simple and inexpensive to assemble.
• the capacitor consists of a first and a second capacitor surface, which are arranged separated from one another by an insulating layer, the first capacitor surface being electrically conductively connected to the potential of the housing and the second capacitor surface being connected to the circuit.
• the insulating layer can be formed in a component-saving manner by the printed circuit board.
• the first capacitor surface can be arranged on the surface of the printed circuit board.
• the circuit board for forming a further capacitor for the same plug element has two further superposed, electrically insulated capacitor surfaces, the third capacitor surface being electrically connected to the plug element and the fourth capacitor surface being electrically connected to the housing potential, here too simple contacting with the housing is possible if the fourth capacitor area is arranged on the surface of the printed circuit board.
• the printed circuit boards are preferably multilayer printed circuit boards which can have more than four layers on which the capacitor areas are arranged.
• first and fourth capacitor areas are conductively connected to one another by means of plated-through holes which enclose the second and third capacitor areas between them and preferably extend approximately in the plane of the housing wall, then the second and third capacitor areas are surrounded by ground potential, which leads to a reduction in the effective opening cross-section and thus leads to a further increase in the shielding.
• one or more of the capacitor areas can be capacitor coatings on the printed circuit board.
• the plug-in element or elements or the capacitor areas conductively connected to the plug-in elements are preferably connected to the circuit via signal lines.
• the signal lines can be produced simply and inexpensively if they are layer lines applied to the printed circuit board.
• the opening of the housing preferably tightly encloses the circuit board passed through it.
• a connection with ground potential is achieved in a simple manner without substantial component expenditure if the housing with its opening area is connected to a first and / or fourth capacitor arranged on the surface of the printed circuit board. surface of the capacitor is in conductive contact.
• a mechanically stable contact to ground potential is achieved in that the opening area of the housing is connected to the first and / or fourth capacitor surface by means of a connecting element, in particular by means of a rivet.
• the opening area of the housing can also be positively connected to the first and / or fourth capacitor area, this being able to be done in a simple manner in that part of the opening area of the housing is press-fitted into a corresponding recess in the first and / or fourth capacitor area.
• Both a mechanically stable contact to the ground potential and a well-shielding closure of the opening is achieved if the opening of the housing is conductively connected to the first and / or fourth capacitor surface by conductive gluing or soldering.
• a further connection to the ground potential is achieved if the housing is capacitively coupled to the first and / or fourth capacitor surface.
• the capacitor and / or the further capacitor can be connected to the circuit via an interference suppression capacitor.
• the housing wall can be placed next to one another in the area of the opening.
• have shielding arms which are short in the regions of the capacitors extending from the housing exterior to the interior of the housing and rest with their free ends on the first capacitor surface, and that the shielding arms are long in the areas extending from the housing exterior to the housing interior and extend through through openings in the circuit board to rest with their free ends on a wall part of the housing.
• the housing wall is designed as a stamped / bent part in the region of the opening.
• the part of the printed circuit board and capacitor located in the exterior of the housing and the plug elements can be arranged in an outer, electrically conductive housing chamber.
• Figure 1 shows a cross section of a first embodiment of an interference suppression device
• FIG. 2 shows a plan view of the printed circuit board of the interference suppression device according to FIG. 1
• FIG. 3 shows the interference suppression device according to FIG. 1 with illustration of the interference radiation
• FIG. 4 shows a cross section of a second exemplary embodiment of an interference suppression device
• Figure 5 shows a cross section of a third embodiment of an interference suppression device
• FIG. 6 shows a cross section of a fourth exemplary embodiment of an interference suppression device in the region of a short shielding arm
• FIG. 7 shows a cross section of the interference suppression device according to FIG. 6 in the region of a long shielding arm
• FIG. 8 shows a plan view of part of the circuit board of the interference suppression device according to FIG. 6
• FIG. 9 shows a perspective view of the housing wall in the region of the opening of the interference suppression device according to FIG. 6.
• the interference suppression devices shown in the figures have a housing 1 made of a metal sheet for an electronic device, which has an opening 3 on a side housing wall 2.
• a circuit board 5 is arranged in the interior 4 of the housing, which is supported on raised impressions 6 of the bottom 7 of the housing 1.
• the circuit board 5 carries an electronic circuit, not shown, which can be contacted from the outside via plug-in elements 8, 8 'and receives low-frequency signals via the plug-in elements 8, 8'.
• the circuit board 5 has a part 9 which extends through the opening 3 to the housing exterior 10, the bottom 7 of the housing 1 being formed laterally protruding and covering the entire lower region of the circuit board 5 including the part 9.
• the plug elements 8, 8 ′ point horizontally from the housing 1 protruding plug pins 11 onto which a corresponding pair of mating plugs, not shown, can be plugged.
• the ends of the plug elements 8, 8 ′ opposite the plug pins 11 project vertically through the printed circuit board 5.
• the plug element 8 is conductively connected to second and third capacitor surfaces 12 and 13 arranged on the printed circuit board 5, an insulating layer 32 being arranged between the capacitor surfaces 12 and 13 is.
• the second and third capacitor areas 12 and 13 are connected to one another via a connection 14 and to the circuit via an interference suppression capacitor 16 and a signal line 15.
• the second and third capacitor surfaces 12 and 13 extend from the housing exterior 10 through the opening 3 into the housing interior 4.
• the second capacitor surface 12 is arranged in parallel opposite and separated by an insulating layer 17, a first capacitor surface 18 which forms a capacitor 18 with the second capacitor surface 12.
• a fourth capacitor surface 21 is arranged on the lower surface of the printed circuit board 5, parallel to the third capacitor surface 13 and separated by an insulating layer 20, which forms a further capacitor 22 with the third capacitor surface 13.
• connection of the capacitors 19 and 22 to a plug element 8 is shown in the figures.
• the first and fourth capacitor surfaces 18 and 21 also extend from the housing exterior 10 through the opening 3 into the housing interior 4.
• the part 9 of the printed circuit board 5 which extends through the opening 30 is from the opening 3 of the housing 1 tightly enclosed.
• the fourth capacitor surface 21 lies on the indentation 6 of the base 7 and is thus connected to the ground potential of the housing 1.
• a connection of the first capacitor surface 18 to the ground potential of the housing 1 takes place in the figures by supporting the housing wall 2 in the region of the opening 3 on the first capacitor surface 18.
• the housing wall 2 consists of a spring plate and rests on a contact region 25 of the first capacitor surface 18 with a resilient bias.
• the housing wall 2 is formed in two parts, in that the housing 1 largely engages over the plug elements 8, 8 ′ and is enclosed by an inner panel 23 of the housing wall 2, forming a housing chamber 24.
• the opening 3 is formed on the inner panel 23, which is soldered in the opening region to both contact regions of the first capacitor surface 18 and the fourth capacitor surface 21.
• a housing chamber 24 ' is formed by an inner panel 23', similar to FIG. 4.
• the inner panel 23 ' is soldered at its upper end to the inner wall of the housing 1 and at its end resiliently resting on the contact area of the first capacitor surface 18.
• the housing wall 2 and thus a housing chamber 24 ′′ is formed by an inner panel 23 ′′.
• This formed as a stamped / bent part from a spring plate inner panel 23 '' is shown in Figure 9 as a single part and has at its upper end a bend 26 with which it is riveted to the upper wall of the housing 1.
• the inner panel 23 ′′ is formed with shielding arms lying next to one another, which are alternately short shielding arms 27 and long shielding arms 28.
• All shielding arms 27 and 28 have a bulge 29 in their central area, so that they are resilient in their longitudinal extent.
• the short shielding arms 27 rest resiliently on the end face of their free end on the contact region 25 'of the first capacitor surface 18.
• arrows 31 show the high-frequency interference radiation which is prevented by the interference suppression device from penetrating into the interior 4 of the housing.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Networks & Wireless Communication (AREA)
• Signal Processing (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
• Details Of Connecting Devices For Male And Female Coupling (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=27771558

Family Applications (1)

Country Status (6)

Families Citing this family (12)

Family Cites Families (16)

• 2002
  • 2002-07-22 DE DE10233318A patent/DE10233318C1/de not_active Expired - Fee Related
• 2003
  • 2003-06-18 KR KR1020057001072A patent/KR20050025633A/ko not_active Application Discontinuation
  • 2003-06-18 JP JP2004528314A patent/JP4188914B2/ja not_active Expired - Fee Related
  • 2003-06-18 WO PCT/DE2003/002031 patent/WO2004017471A1/de active Application Filing
  • 2003-06-18 EP EP03740098A patent/EP1523791A1/de not_active Withdrawn
  • 2003-06-18 US US10/522,090 patent/US7269033B2/en not_active Expired - Fee Related

Non-Patent Citations (1)

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