JP4163004B2 - 光取り出し手段を持つ電界発光素子 - Google Patents
光取り出し手段を持つ電界発光素子 Download PDFInfo
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 239000011368 organic material Substances 0.000 claims description 4
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
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- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052785 arsenic Inorganic materials 0.000 claims description 2
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- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
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- 239000011574 phosphorus Substances 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 claims 1
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- 239000010410 layer Substances 0.000 description 33
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 10
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- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- RJAVVKVGAZUUIE-UHFFFAOYSA-N stibanylidynephosphane Chemical compound [Sb]#P RJAVVKVGAZUUIE-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
Description
それは同等の割合の正方形と正三角形を示すか、または異なる頂点で第1および第2の角度の菱形を示し、その辺はほぼ近似した大きさでありうる;
それは選択された数の正三角形および正方形を含むパターンによる周期化もしくはスタンフリー(Stampfli)膨張、または異なる頂点で第1および第2の角度の菱形によって形成することができる;
それは選択された割合の正三角形と正方形のほぼランダムな分布、または異なる頂点で第1および第2の角度の菱形によって形成することができる。
下部ミラー5および上部ミラー14は、この非限定的な例では、ファブリ−ペロ型の共振電磁波マイクロキャビティを規定し、量子井戸において上部および下部ミラーにほぼ垂直な方向に生成したフォトンは外部へ透過し、他の残りはミラーの間、特に変換手段7の量子井戸を構成する層において導波モードの形態で閉じ込められる。
Kf=Ki+G。
Claims (23)
- 基板と、
前記基板に支持された下部ミラーと、
前記下部ミラー上に形成された電子生成層と、
前記電子生成層上に形成された変換層と、
前記変換層上に形成された正孔生成層と、
前記正孔生成層上に形成された上部ミラーと
を有する電界発光素子であって、前記変換層は電子−正孔対をフォトンに変換し、前記下部ミラーおよび上部ミラーは、電界発光素子の発光スペクトルの主波長であって導波モードに関連する選択された波長を示すフォトンの閉じ込めを確実にし、
さらに前記生成層および変換層の少なくとも一部に通じて前記生成層および変換層から導波モードにあるフォトンの少なくとも一部を取り出す光取り出し手段を有し、前記光取り出し手段は電子−正孔対の変換によってフォトンが生じる領域の周辺に形成された回折性の三次元フォトニック結晶または準結晶であり、前記フォトニック結晶または準結晶は導波モードにあるフォトンの波長に実質的に等しい寸法を有する
ことを特徴とする電界発光素子。 - 前記光取り出し手段は前記変換層および正孔生成層の少なくとも一部に形成されていることを特徴とする請求項1記載の素子。
- 前記光取り出し手段は前記電子生成層、変換層および正孔生成層の少なくとも一部に形成されていることを特徴とする請求項1記載の素子。
- 前記光取り出し手段は前記電子生成層、変換層、正孔生成層および上部ミラーの少なくとも一部に形成されていることを特徴とする請求項1記載の素子。
- 前記光取り出し手段は前記下部ミラー、電子生成層、変換層、正孔生成層および上部ミラーの少なくとも一部に形成されていることを特徴とする請求項1記載の素子。
- 前記準結晶は、実質的につながった多角形で、それらの辺の各々を唯一の隣と共有している凸面のタイリングであることを特徴とする請求項1に記載の素子。
- 前記タイリングは、実質的に等しい割合の正方形と正三角形、または頂点における角度が異なり実質的に等しいサイズの辺を持つ第1および第2の菱形からなることを特徴とする請求項6に記載の素子。
- 前記タイリングは、選択された数の正三角形および正方形を含むパターンの周期化、または頂点における角度が異なり実質的に等しいサイズの辺を持つ第1および第2の菱形からなることを特徴とする請求項6に記載の素子。
- 前記タイリングは、選択された数の正三角形および正方形を含むパターンのスタンフリー(Stampfli)膨張、または頂点における角度が異なり実質的に等しいサイズの辺を持つ第1および第2の菱形からなることを特徴とする請求項6に記載の素子。
- 前記タイリングは、選択された割合の正三角形および正方形の実質的にランダムな分布、または頂点における角度が異なり実質的に等しいサイズの辺を持つ第1および第2の菱形からなることを特徴とする請求項6に記載の素子。
- 前記タイリングは、前記電子生成層、変換層および正孔生成層を少なくとも部分的に囲んでいることを特徴とする請求項6ないし10のいずれか1項に記載の素子。
- 前記タイリングは湾曲し環状領域の少なくとも一部の上に広がっていることを特徴とする請求項6に記載の素子。
- 前記準結晶は回折要素の少なくとも1つが省略されているタイリングであることを特徴とする請求項6に記載の素子。
- 前記上部ミラーは半反射性タイプのものであり、正孔生成層と他の材料の層との間の界面によって形成されていることを特徴とする請求項1に記載の素子。
- 前記他の材料は、空気、エポキシおよび基板を形成する材料を含む群から選択されることを特徴とする請求項14に記載の素子。
- 前記下部ミラーは、基板上に設けられたブラッグミラータイプの反射ミラーであることを特徴とする請求項1に記載の素子。
- 前記電子生成層、変換層および正孔生成層の少なくとも一部は、半導体および有機電界発光材料を含む群より選択される材料からなることを特徴とする請求項1に記載の素子。
- 前記有機材料は、共役または非共役の有機ポリマー、および有機金属錯体を含む群より選択されることを特徴とする請求項17に記載の素子。
- 前記半導体は、シリコン、ガリウム、アルミニウム、インジウム、窒素、リン、ヒ素およびアンチモン系の化合物、ならびにこれらの合金を含む群より選択されることを特徴とする請求項17に記載の素子。
- i)GaAs基板と、前記下部ミラーを形成するGaAsとAlAsの交互層と、生成手段の一部を形成するnドープトGaAs層と、InGaAs中の量子井戸を囲む2つのAlGaAsバリアからなり、前記変換層を形成する活性層と、生成手段の一部および外部の空気と前記上部ミラーを形成するnドープトGaAsとをこの順に積層した積層体と、ii)pドープトGaAs層を正極性にさせる第1の電極コンタクト手段およびnドープトGaAs層を負極性にさせるのに適した第2の電極コンタクト手段とからなることを特徴とする請求項17に記載の素子。
- 前記上部ミラーおよび下部ミラーは、非対称の共振キャビティ、特にファブリ−ペロ型のものを規定することを特徴とする請求項1に記載の素子。
- 前記上部ミラーおよび下部ミラーは、変換層によって発せられるフォトンの波長を持つ反共振キャビティを規定することを特徴とする請求項1に記載の素子。
- 請求項1ないし22のいずれか1項の素子を有することを特徴とする電界発光ダイオード。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0105652A FR2824228B1 (fr) | 2001-04-26 | 2001-04-26 | Dispositif electroluminescent a extracteur de lumiere |
PCT/FR2002/001341 WO2002089218A2 (fr) | 2001-04-26 | 2002-04-18 | Dispositif electroluminescent a extracteur de lumiere |
Publications (3)
Publication Number | Publication Date |
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JP2004521509A JP2004521509A (ja) | 2004-07-15 |
JP2004521509A5 JP2004521509A5 (ja) | 2008-07-17 |
JP4163004B2 true JP4163004B2 (ja) | 2008-10-08 |
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Application Number | Title | Priority Date | Filing Date |
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JP2002586411A Expired - Fee Related JP4163004B2 (ja) | 2001-04-26 | 2002-04-18 | 光取り出し手段を持つ電界発光素子 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6987288B2 (ja) |
EP (1) | EP1382074B1 (ja) |
JP (1) | JP4163004B2 (ja) |
AT (1) | ATE488027T1 (ja) |
AU (1) | AU2002256752A1 (ja) |
CA (1) | CA2444338C (ja) |
DE (1) | DE60238245D1 (ja) |
FR (1) | FR2824228B1 (ja) |
WO (1) | WO2002089218A2 (ja) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3956918B2 (ja) | 2002-10-03 | 2007-08-08 | 日亜化学工業株式会社 | 発光ダイオード |
JP2004172506A (ja) | 2002-11-22 | 2004-06-17 | Sony Corp | 半導体レーザ素子 |
JP4610863B2 (ja) * | 2003-03-19 | 2011-01-12 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | フォトニック結晶構造を使用するled効率の改良 |
US7078735B2 (en) | 2003-03-27 | 2006-07-18 | Sanyo Electric Co., Ltd. | Light-emitting device and illuminator |
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DE60238245D1 (de) | 2010-12-23 |
AU2002256752A1 (en) | 2002-11-11 |
US20040141333A1 (en) | 2004-07-22 |
US6987288B2 (en) | 2006-01-17 |
JP2004521509A (ja) | 2004-07-15 |
EP1382074B1 (fr) | 2010-11-10 |
EP1382074A2 (fr) | 2004-01-21 |
FR2824228B1 (fr) | 2003-08-01 |
FR2824228A1 (fr) | 2002-10-31 |
WO2002089218A3 (fr) | 2003-01-09 |
WO2002089218A2 (fr) | 2002-11-07 |
ATE488027T1 (de) | 2010-11-15 |
CA2444338C (fr) | 2012-10-30 |
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