JP4162659B2 - フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 - Google Patents
フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 Download PDFInfo
- Publication number
- JP4162659B2 JP4162659B2 JP2005004383A JP2005004383A JP4162659B2 JP 4162659 B2 JP4162659 B2 JP 4162659B2 JP 2005004383 A JP2005004383 A JP 2005004383A JP 2005004383 A JP2005004383 A JP 2005004383A JP 4162659 B2 JP4162659 B2 JP 4162659B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- flexible printed
- wiring board
- layer
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010410 layer Substances 0.000 claims description 141
- 239000004020 conductor Substances 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 229920001721 polyimide Polymers 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 22
- 238000010292 electrical insulation Methods 0.000 claims description 18
- 239000004642 Polyimide Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 description 34
- 239000000758 substrate Substances 0.000 description 19
- 239000011342 resin composition Substances 0.000 description 14
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 238000005452 bending Methods 0.000 description 12
- 239000000945 filler Substances 0.000 description 11
- 125000000524 functional group Chemical group 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 7
- 238000005488 sandblasting Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 235000019700 dicalcium phosphate Nutrition 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 241000280258 Dyschoriste linearis Species 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- -1 aromatic tetracarboxylic acid Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000010735 electrical insulating oil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- WMIYKQLTONQJES-UHFFFAOYSA-N hexafluoroethane Chemical compound FC(F)(F)C(F)(F)F WMIYKQLTONQJES-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005004383A JP4162659B2 (ja) | 2005-01-11 | 2005-01-11 | フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 |
| TW094144455A TWI306726B (en) | 2005-01-11 | 2005-12-15 | Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board |
| KR1020060002492A KR100750019B1 (ko) | 2005-01-11 | 2006-01-10 | 가요성 프린트 배선판 및 다층 가요성 프린트 배선판, 상기다층 가요성 프린트 배선판을 이용한 휴대 전화 단말 |
| CN200610000573XA CN1805652B (zh) | 2005-01-11 | 2006-01-11 | 软性印刷电路板和多层软性印刷电路板及便携式电话终端 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005004383A JP4162659B2 (ja) | 2005-01-11 | 2005-01-11 | フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008035730A Division JP4954111B2 (ja) | 2008-02-18 | 2008-02-18 | フレキシブルプリント配線板及び金属張積層板、前記フレキシブルプリント配線板に使用されるカバーレイ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006196548A JP2006196548A (ja) | 2006-07-27 |
| JP2006196548A5 JP2006196548A5 (ko) | 2007-03-01 |
| JP4162659B2 true JP4162659B2 (ja) | 2008-10-08 |
Family
ID=36802402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005004383A Active JP4162659B2 (ja) | 2005-01-11 | 2005-01-11 | フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4162659B2 (ko) |
| KR (1) | KR100750019B1 (ko) |
| CN (1) | CN1805652B (ko) |
| TW (1) | TWI306726B (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102529271A (zh) * | 2011-12-23 | 2012-07-04 | 云南云天化股份有限公司 | 用于柔性电路板的聚酰亚胺薄膜及其制备方法 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2374181T3 (es) | 2006-07-19 | 2012-02-14 | B-Core Inc. | Símbolo óptico, artículo al que se fija el símbolo óptico, método para fijar un símbolo óptico a un artículo, y método para el reconocimiento de un código por reconocimiento óptico. |
| JP2008041960A (ja) | 2006-08-07 | 2008-02-21 | Nissan Chem Ind Ltd | 電子回路部品の製造方法 |
| JP4845705B2 (ja) * | 2006-12-19 | 2011-12-28 | 日東電工株式会社 | プリント配線基板、その製造方法および電子機器 |
| TWI424802B (zh) * | 2007-02-20 | 2014-01-21 | Hitachi Chemical Co Ltd | Flexible multilayer wiring board |
| JP2008282352A (ja) | 2007-05-14 | 2008-11-20 | B-Core Inc | 遮蔽によるマーキング方法及び除去によるマーキング方法及び変色によるマーキング方法 |
| US8383230B2 (en) | 2007-05-24 | 2013-02-26 | Arisawa Mfg. Co., Ltd. | Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board |
| CN101801156B (zh) * | 2009-02-06 | 2013-02-27 | 周伯如 | 软性印刷电路板的制造方法及其结构 |
| CN102186304A (zh) * | 2011-03-15 | 2011-09-14 | 珠海元盛电子科技股份有限公司 | 用于翻盖/滑盖手机的分层fpc及制作方法 |
| DE102013202037A1 (de) * | 2013-02-07 | 2014-08-07 | Olympus Winter & Ibe Gmbh | Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument |
| KR20140148111A (ko) * | 2013-06-21 | 2014-12-31 | 삼성전기주식회사 | 경연성 인쇄회로기판 및 그 제조방법 |
| WO2015116076A1 (en) | 2014-01-30 | 2015-08-06 | Hewlett-Packard Development Company, Lp | Printed circuit board fluid ejection apparatus |
| TWI607677B (zh) | 2016-11-21 | 2017-12-01 | 同泰電子科技股份有限公司 | 可撓性線路板結構 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07312469A (ja) * | 1994-05-16 | 1995-11-28 | Nippon Mektron Ltd | 多層フレキシブル回路基板の屈曲部構造 |
| JP2002261450A (ja) | 2001-02-28 | 2002-09-13 | Shin Etsu Chem Co Ltd | 多層フレキシブル印刷配線板 |
| KR100828520B1 (ko) * | 2001-11-23 | 2008-05-13 | 삼성전자주식회사 | 액정 표시 모듈 |
| KR101018944B1 (ko) | 2003-03-04 | 2011-03-02 | 니폰 제온 가부시키가이샤 | 다층 프린트 배선판의 제조방법 및 다층 프린트 배선판 |
| KR100477378B1 (ko) * | 2003-03-21 | 2005-03-18 | 주식회사 에스아이 플렉스 | 다층 연성 인쇄회로기판의 제조방법 |
-
2005
- 2005-01-11 JP JP2005004383A patent/JP4162659B2/ja active Active
- 2005-12-15 TW TW094144455A patent/TWI306726B/zh active
-
2006
- 2006-01-10 KR KR1020060002492A patent/KR100750019B1/ko active IP Right Grant
- 2006-01-11 CN CN200610000573XA patent/CN1805652B/zh active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102529271A (zh) * | 2011-12-23 | 2012-07-04 | 云南云天化股份有限公司 | 用于柔性电路板的聚酰亚胺薄膜及其制备方法 |
| CN102529271B (zh) * | 2011-12-23 | 2014-12-24 | 云南云天化股份有限公司 | 用于柔性电路板的聚酰亚胺薄膜及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1805652B (zh) | 2012-04-25 |
| TW200638813A (en) | 2006-11-01 |
| JP2006196548A (ja) | 2006-07-27 |
| TWI306726B (en) | 2009-02-21 |
| KR100750019B1 (ko) | 2007-08-16 |
| CN1805652A (zh) | 2006-07-19 |
| KR20060082043A (ko) | 2006-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4162659B2 (ja) | フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 | |
| KR101494936B1 (ko) | 금속박 적층 폴리이미드 수지 기판 | |
| KR100742066B1 (ko) | 열가소성 폴리이미드 수지 필름, 적층체 및 그것을 포함하는 인쇄 배선판의 제조 방법 | |
| JP5751284B2 (ja) | 接着シート | |
| KR101078234B1 (ko) | 동박 적층판 | |
| KR101210800B1 (ko) | 섬유-수지 복합체, 적층체 및 프린트 배선판, 및 프린트배선판의 제조 방법 | |
| KR101219065B1 (ko) | 2층 양면 플렉시블 금속 적층판 및 그 제조 방법 | |
| US8383230B2 (en) | Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board | |
| KR100727716B1 (ko) | 연성금속 적층판 및 그 제조방법 | |
| JP4954111B2 (ja) | フレキシブルプリント配線板及び金属張積層板、前記フレキシブルプリント配線板に使用されるカバーレイ | |
| TWI384909B (zh) | 配線基板用積層體 | |
| JP2012006200A (ja) | ポリイミド金属積層体、及びそれを用いたプリント配線板 | |
| KR100795617B1 (ko) | 적층체 및 그의 용도 | |
| JP2008063560A (ja) | ポリイミド樹脂層の表面改質方法及び金属張積層板の製造方法 | |
| JP4481797B2 (ja) | フレキシブルプリント配線板及びその製造方法 | |
| JP7452230B2 (ja) | 電磁波シールドシート、並びにプリント配線板およびその製造方法 | |
| JP2007036098A (ja) | プリント配線板およびその製造方法 | |
| JP2007260608A (ja) | 銅張積層板の製造方法 | |
| JP2005329641A (ja) | フレキシブルプリント配線板用基板及びその製造方法 | |
| JP2005197532A (ja) | 多層回路基板およびその製造方法ならびに回路基材 | |
| JP2021170603A (ja) | 金属貼積層板および回路基板 | |
| JP2003118060A (ja) | 耐熱性フレキシブル積層板の製造方法 | |
| JPH09153677A (ja) | 多層プリント配線板の製造法 | |
| JP2005072398A (ja) | 多層配線基板 | |
| JP2010283389A (ja) | 多層回路基板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061005 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070115 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071214 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071221 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080219 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080703 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080722 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110801 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4162659 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110801 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120801 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120801 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130801 Year of fee payment: 5 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |