JP4162659B2 - フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 - Google Patents

フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 Download PDF

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Publication number
JP4162659B2
JP4162659B2 JP2005004383A JP2005004383A JP4162659B2 JP 4162659 B2 JP4162659 B2 JP 4162659B2 JP 2005004383 A JP2005004383 A JP 2005004383A JP 2005004383 A JP2005004383 A JP 2005004383A JP 4162659 B2 JP4162659 B2 JP 4162659B2
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JP
Japan
Prior art keywords
printed wiring
flexible printed
wiring board
layer
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005004383A
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English (en)
Japanese (ja)
Other versions
JP2006196548A5 (enrdf_load_stackoverflow
JP2006196548A (ja
Inventor
和英 北
宏和 平井
秀一 藤田
卓 三輪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arisawa Mfg Co Ltd
Original Assignee
Arisawa Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arisawa Mfg Co Ltd filed Critical Arisawa Mfg Co Ltd
Priority to JP2005004383A priority Critical patent/JP4162659B2/ja
Priority to TW094144455A priority patent/TWI306726B/zh
Priority to KR1020060002492A priority patent/KR100750019B1/ko
Priority to CN200610000573XA priority patent/CN1805652B/zh
Publication of JP2006196548A publication Critical patent/JP2006196548A/ja
Publication of JP2006196548A5 publication Critical patent/JP2006196548A5/ja
Application granted granted Critical
Publication of JP4162659B2 publication Critical patent/JP4162659B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
JP2005004383A 2005-01-11 2005-01-11 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 Expired - Lifetime JP4162659B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005004383A JP4162659B2 (ja) 2005-01-11 2005-01-11 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末
TW094144455A TWI306726B (en) 2005-01-11 2005-12-15 Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board
KR1020060002492A KR100750019B1 (ko) 2005-01-11 2006-01-10 가요성 프린트 배선판 및 다층 가요성 프린트 배선판, 상기다층 가요성 프린트 배선판을 이용한 휴대 전화 단말
CN200610000573XA CN1805652B (zh) 2005-01-11 2006-01-11 软性印刷电路板和多层软性印刷电路板及便携式电话终端

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005004383A JP4162659B2 (ja) 2005-01-11 2005-01-11 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008035730A Division JP4954111B2 (ja) 2008-02-18 2008-02-18 フレキシブルプリント配線板及び金属張積層板、前記フレキシブルプリント配線板に使用されるカバーレイ

Publications (3)

Publication Number Publication Date
JP2006196548A JP2006196548A (ja) 2006-07-27
JP2006196548A5 JP2006196548A5 (enrdf_load_stackoverflow) 2007-03-01
JP4162659B2 true JP4162659B2 (ja) 2008-10-08

Family

ID=36802402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005004383A Expired - Lifetime JP4162659B2 (ja) 2005-01-11 2005-01-11 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末

Country Status (4)

Country Link
JP (1) JP4162659B2 (enrdf_load_stackoverflow)
KR (1) KR100750019B1 (enrdf_load_stackoverflow)
CN (1) CN1805652B (enrdf_load_stackoverflow)
TW (1) TWI306726B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102529271A (zh) * 2011-12-23 2012-07-04 云南云天化股份有限公司 用于柔性电路板的聚酰亚胺薄膜及其制备方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008010544A1 (fr) 2006-07-19 2008-01-24 B-Core Inc. Symbole optique, article auquel est fixé un symbole optique, procédé pour fixer un symbole optique à un article, et procédé de reconnaissance d'un code par reconnaissance optique
JP2008041960A (ja) 2006-08-07 2008-02-21 Nissan Chem Ind Ltd 電子回路部品の製造方法
JP4845705B2 (ja) * 2006-12-19 2011-12-28 日東電工株式会社 プリント配線基板、その製造方法および電子機器
US8232476B2 (en) 2007-02-20 2012-07-31 Hitachi Chemical Company, Ltd. Flexible multilayer wiring board
JP2008282352A (ja) 2007-05-14 2008-11-20 B-Core Inc 遮蔽によるマーキング方法及び除去によるマーキング方法及び変色によるマーキング方法
US8383230B2 (en) 2007-05-24 2013-02-26 Arisawa Mfg. Co., Ltd. Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board
CN101801156B (zh) * 2009-02-06 2013-02-27 周伯如 软性印刷电路板的制造方法及其结构
CN102186304A (zh) * 2011-03-15 2011-09-14 珠海元盛电子科技股份有限公司 用于翻盖/滑盖手机的分层fpc及制作方法
DE102013202037A1 (de) * 2013-02-07 2014-08-07 Olympus Winter & Ibe Gmbh Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument
KR20140148111A (ko) * 2013-06-21 2014-12-31 삼성전기주식회사 경연성 인쇄회로기판 및 그 제조방법
CN105934347B (zh) * 2014-01-30 2019-04-02 惠普发展公司，有限责任合伙企业 印刷线路板流体喷射装置
TWI607677B (zh) 2016-11-21 2017-12-01 同泰電子科技股份有限公司 可撓性線路板結構
JP2023158561A (ja) * 2022-04-18 2023-10-30 大日本印刷株式会社 配線基板、画像表示装置用積層体及び画像表示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07312469A (ja) * 1994-05-16 1995-11-28 Nippon Mektron Ltd 多層フレキシブル回路基板の屈曲部構造
JP2002261450A (ja) 2001-02-28 2002-09-13 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
KR100828520B1 (ko) * 2001-11-23 2008-05-13 삼성전자주식회사 액정 표시 모듈
JP4411544B2 (ja) 2003-03-04 2010-02-10 日本ゼオン株式会社 多層プリント配線板の製造方法および多層プリント配線板
KR100477378B1 (ko) * 2003-03-21 2005-03-18 주식회사 에스아이 플렉스 다층 연성 인쇄회로기판의 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102529271A (zh) * 2011-12-23 2012-07-04 云南云天化股份有限公司 用于柔性电路板的聚酰亚胺薄膜及其制备方法
CN102529271B (zh) * 2011-12-23 2014-12-24 云南云天化股份有限公司 用于柔性电路板的聚酰亚胺薄膜及其制备方法

Also Published As

Publication number Publication date
CN1805652A (zh) 2006-07-19
TW200638813A (en) 2006-11-01
TWI306726B (en) 2009-02-21
KR100750019B1 (ko) 2007-08-16
CN1805652B (zh) 2012-04-25
KR20060082043A (ko) 2006-07-14
JP2006196548A (ja) 2006-07-27

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