CN1805652B - 软性印刷电路板和多层软性印刷电路板及便携式电话终端 - Google Patents

软性印刷电路板和多层软性印刷电路板及便携式电话终端 Download PDF

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Publication number
CN1805652B
CN1805652B CN200610000573XA CN200610000573A CN1805652B CN 1805652 B CN1805652 B CN 1805652B CN 200610000573X A CN200610000573X A CN 200610000573XA CN 200610000573 A CN200610000573 A CN 200610000573A CN 1805652 B CN1805652 B CN 1805652B
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China
Prior art keywords
layer
printed wiring
flexible printed
wiring board
electric insulation
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CN200610000573XA
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English (en)
Chinese (zh)
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CN1805652A (zh
Inventor
北和英
平井宏和
藤田秀一
三轮卓
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Arisawa Mfg Co Ltd
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Arisawa Mfg Co Ltd
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Publication of CN1805652A publication Critical patent/CN1805652A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
CN200610000573XA 2005-01-11 2006-01-11 软性印刷电路板和多层软性印刷电路板及便携式电话终端 Active CN1805652B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005-004383 2005-01-11
JP2005004383 2005-01-11
JP2005004383A JP4162659B2 (ja) 2005-01-11 2005-01-11 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末

Publications (2)

Publication Number Publication Date
CN1805652A CN1805652A (zh) 2006-07-19
CN1805652B true CN1805652B (zh) 2012-04-25

Family

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Family Applications (1)

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CN200610000573XA Active CN1805652B (zh) 2005-01-11 2006-01-11 软性印刷电路板和多层软性印刷电路板及便携式电话终端

Country Status (4)

Country Link
JP (1) JP4162659B2 (enrdf_load_stackoverflow)
KR (1) KR100750019B1 (enrdf_load_stackoverflow)
CN (1) CN1805652B (enrdf_load_stackoverflow)
TW (1) TWI306726B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607677B (zh) * 2016-11-21 2017-12-01 同泰電子科技股份有限公司 可撓性線路板結構

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008010544A1 (fr) 2006-07-19 2008-01-24 B-Core Inc. Symbole optique, article auquel est fixé un symbole optique, procédé pour fixer un symbole optique à un article, et procédé de reconnaissance d'un code par reconnaissance optique
JP2008041960A (ja) 2006-08-07 2008-02-21 Nissan Chem Ind Ltd 電子回路部品の製造方法
JP4845705B2 (ja) * 2006-12-19 2011-12-28 日東電工株式会社 プリント配線基板、その製造方法および電子機器
US8232476B2 (en) 2007-02-20 2012-07-31 Hitachi Chemical Company, Ltd. Flexible multilayer wiring board
JP2008282352A (ja) 2007-05-14 2008-11-20 B-Core Inc 遮蔽によるマーキング方法及び除去によるマーキング方法及び変色によるマーキング方法
US8383230B2 (en) 2007-05-24 2013-02-26 Arisawa Mfg. Co., Ltd. Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board
CN101801156B (zh) * 2009-02-06 2013-02-27 周伯如 软性印刷电路板的制造方法及其结构
CN102186304A (zh) * 2011-03-15 2011-09-14 珠海元盛电子科技股份有限公司 用于翻盖/滑盖手机的分层fpc及制作方法
CN102529271B (zh) * 2011-12-23 2014-12-24 云南云天化股份有限公司 用于柔性电路板的聚酰亚胺薄膜及其制备方法
DE102013202037A1 (de) * 2013-02-07 2014-08-07 Olympus Winter & Ibe Gmbh Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument
KR20140148111A (ko) * 2013-06-21 2014-12-31 삼성전기주식회사 경연성 인쇄회로기판 및 그 제조방법
CN105934347B (zh) * 2014-01-30 2019-04-02 惠普发展公司，有限责任合伙企业 印刷线路板流体喷射装置
JP2023158561A (ja) * 2022-04-18 2023-10-30 大日本印刷株式会社 配線基板、画像表示装置用積層体及び画像表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516989A (en) * 1994-05-16 1996-05-14 Nippon Mektron, Ltd. Structure of the flexing section of a multilayer flexible circuit board
CN1421729A (zh) * 2001-11-23 2003-06-04 三星电子株式会社 液晶显示模块

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261450A (ja) 2001-02-28 2002-09-13 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
JP4411544B2 (ja) 2003-03-04 2010-02-10 日本ゼオン株式会社 多層プリント配線板の製造方法および多層プリント配線板
KR100477378B1 (ko) * 2003-03-21 2005-03-18 주식회사 에스아이 플렉스 다층 연성 인쇄회로기판의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516989A (en) * 1994-05-16 1996-05-14 Nippon Mektron, Ltd. Structure of the flexing section of a multilayer flexible circuit board
CN1421729A (zh) * 2001-11-23 2003-06-04 三星电子株式会社 液晶显示模块

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2003-133734A 2003.05.09
JP特开平10-67027A 1998.03.10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607677B (zh) * 2016-11-21 2017-12-01 同泰電子科技股份有限公司 可撓性線路板結構
US10104778B2 (en) 2016-11-21 2018-10-16 Uniflex Technology Inc. Flexible printed circuit board structure

Also Published As

Publication number Publication date
CN1805652A (zh) 2006-07-19
TW200638813A (en) 2006-11-01
TWI306726B (en) 2009-02-21
KR100750019B1 (ko) 2007-08-16
JP4162659B2 (ja) 2008-10-08
KR20060082043A (ko) 2006-07-14
JP2006196548A (ja) 2006-07-27

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