JP4159378B2 - 高周波装置とその製造方法 - Google Patents

高周波装置とその製造方法 Download PDF

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Publication number
JP4159378B2
JP4159378B2 JP2003039934A JP2003039934A JP4159378B2 JP 4159378 B2 JP4159378 B2 JP 4159378B2 JP 2003039934 A JP2003039934 A JP 2003039934A JP 2003039934 A JP2003039934 A JP 2003039934A JP 4159378 B2 JP4159378 B2 JP 4159378B2
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Japan
Prior art keywords
wiring conductor
substrate
dielectric support
support film
conductor film
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Expired - Fee Related
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JP2003039934A
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English (en)
Japanese (ja)
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JP2004007424A5 (enExample
JP2004007424A (ja
Inventor
幸久 吉田
有 西野
善幸 末廣
相錫 李
賢一 宮口
継偉 焦
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2003039934A priority Critical patent/JP4159378B2/ja
Priority to US10/421,780 priority patent/US7030721B2/en
Publication of JP2004007424A publication Critical patent/JP2004007424A/ja
Priority to US11/360,385 priority patent/US7285841B2/en
Publication of JP2004007424A5 publication Critical patent/JP2004007424A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/185—Edge coupled lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/003—Coplanar lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Waveguides (AREA)
JP2003039934A 2002-04-25 2003-02-18 高周波装置とその製造方法 Expired - Fee Related JP4159378B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003039934A JP4159378B2 (ja) 2002-04-25 2003-02-18 高周波装置とその製造方法
US10/421,780 US7030721B2 (en) 2002-04-25 2003-04-24 High frequency apparatus for transmitting or processing high frequency signal
US11/360,385 US7285841B2 (en) 2002-04-25 2006-02-24 Method of manufacturing signal processing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002124431 2002-04-25
JP2003039934A JP4159378B2 (ja) 2002-04-25 2003-02-18 高周波装置とその製造方法

Publications (3)

Publication Number Publication Date
JP2004007424A JP2004007424A (ja) 2004-01-08
JP2004007424A5 JP2004007424A5 (enExample) 2006-03-09
JP4159378B2 true JP4159378B2 (ja) 2008-10-01

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Family Applications (1)

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JP2003039934A Expired - Fee Related JP4159378B2 (ja) 2002-04-25 2003-02-18 高周波装置とその製造方法

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US (2) US7030721B2 (enExample)
JP (1) JP4159378B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109818126A (zh) * 2017-11-21 2019-05-28 锐迪科微电子（上海）有限公司 一种定向耦合器

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JP4541718B2 (ja) * 2004-02-16 2010-09-08 三菱電機株式会社 高周波集積回路とその製造方法
US7082249B2 (en) * 2004-03-26 2006-07-25 Sarnoff Corporation Low optical overlap mode (LOOM) waveguiding system and method of making same
KR100548388B1 (ko) * 2004-07-20 2006-02-02 삼성전자주식회사 저손실 인덕터소자 및 그의 제조방법
JP4823541B2 (ja) * 2005-03-18 2011-11-24 富士通セミコンダクター株式会社 高周波伝送線路
FR2895390A1 (fr) * 2005-12-22 2007-06-29 Thomson Licensing Sas Boitier avec fonction accordable en frequence
JPWO2007083354A1 (ja) * 2006-01-17 2009-06-11 富士通株式会社 半導体装置及びその製造方法
JP4815623B2 (ja) * 2007-09-07 2011-11-16 三菱電機株式会社 高周波受動素子およびその製造方法
TWI399139B (zh) * 2007-09-19 2013-06-11 Ind Tech Res Inst 彎繞線狀電感器及具有此彎繞線狀電感器的基板結構
US7955964B2 (en) 2008-05-14 2011-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Dishing-free gap-filling with multiple CMPs
US8048752B2 (en) 2008-07-24 2011-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Spacer shape engineering for void-free gap-filling process
JP2011040882A (ja) * 2009-08-07 2011-02-24 Sony Corp 高周波デバイス
TWI441307B (zh) * 2009-08-07 2014-06-11 新力股份有限公司 內插器、模組及包括該內插器之電子裝置
US8884516B2 (en) * 2010-01-08 2014-11-11 University Of Utah Research Foundation Traveling wave electron device with membrane-supported slow wave circuit
US9299664B2 (en) * 2010-01-18 2016-03-29 Semiconductor Components Industries, Llc Method of forming an EM protected semiconductor die
JP5344017B2 (ja) * 2011-10-05 2013-11-20 三菱電機株式会社 基板間接続構造およびパッケージ
US9328253B2 (en) * 2013-01-22 2016-05-03 Eastman Kodak Company Method of making electrically conductive micro-wires
US9941560B2 (en) * 2014-12-22 2018-04-10 The Regents Of The University Of Michigan Non-contact on-wafer S-parameter measurements of devices at millimeter-wave to terahertz frequencies
US10410981B2 (en) 2015-12-31 2019-09-10 International Business Machines Corporation Effective medium semiconductor cavities for RF applications
US11289814B2 (en) 2017-11-10 2022-03-29 Raytheon Company Spiral antenna and related fabrication techniques
SG11202003802SA (en) * 2017-11-10 2020-05-28 Raytheon Co Additive manufacturing technology (amt) faraday boundaries in radio frequency circuits
EP3707777B1 (en) 2017-11-10 2023-05-24 Raytheon Company Additive manufacturing technology (amt) low profile radiator
SG11202004208TA (en) 2017-11-10 2020-06-29 Raytheon Co Millimeter wave transmission line architecture
JP7000589B2 (ja) 2018-02-28 2022-01-19 レイセオン カンパニー アディティブ製造技術（ａｍｔ）低プロファイル信号分割器
JP7175317B2 (ja) 2018-02-28 2022-11-18 レイセオン カンパニー スナップ無線周波数コネクタ相互接続体
US11470695B2 (en) * 2020-04-28 2022-10-11 Northrop Grumman Systems Corporation Filter with an enclosure having a micromachined interior using semiconductor fabrication

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US5643804A (en) * 1993-05-21 1997-07-01 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a hybrid integrated circuit component having a laminated body
JP3141692B2 (ja) * 1994-08-11 2001-03-05 松下電器産業株式会社 ミリ波用検波器
JPH0936312A (ja) * 1995-07-18 1997-02-07 Nec Corp インダクタンス素子およびその製造方法
US5781091A (en) * 1995-07-24 1998-07-14 Autosplice Systems Inc. Electronic inductive device and method for manufacturing
US5874770A (en) * 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers
JPH10125860A (ja) * 1996-10-21 1998-05-15 Sony Corp 平面スパイラルインダクタおよびその製造方法
JP3218996B2 (ja) 1996-11-28 2001-10-15 松下電器産業株式会社 ミリ波導波路
JP2964981B2 (ja) * 1997-03-14 1999-10-18 日本電気株式会社 半導体装置
US6778041B2 (en) * 1998-06-02 2004-08-17 Matsushita Electric Industrial Co., Ltd. Millimeter wave module and radio apparatus
US6083802A (en) * 1998-12-31 2000-07-04 Winbond Electronics Corporation Method for forming an inductor
JP2001308610A (ja) * 2000-04-20 2001-11-02 Matsushita Electric Ind Co Ltd マイクロストリップ線路、その製造方法、インダクタ素子及び高周波半導体装置
KR100382765B1 (ko) * 2001-06-15 2003-05-09 삼성전자주식회사 송수신용 수동소자와 그 집적모듈 및 그 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109818126A (zh) * 2017-11-21 2019-05-28 锐迪科微电子（上海）有限公司 一种定向耦合器
CN109818126B (zh) * 2017-11-21 2021-05-07 锐迪科微电子（上海）有限公司 一种定向耦合器

Also Published As

Publication number Publication date
US7030721B2 (en) 2006-04-18
US20030201851A1 (en) 2003-10-30
US20060145789A1 (en) 2006-07-06
US7285841B2 (en) 2007-10-23
JP2004007424A (ja) 2004-01-08

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