JP2004007424A5 - - Google Patents
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- JP2004007424A5 JP2004007424A5 JP2003039934A JP2003039934A JP2004007424A5 JP 2004007424 A5 JP2004007424 A5 JP 2004007424A5 JP 2003039934 A JP2003039934 A JP 2003039934A JP 2003039934 A JP2003039934 A JP 2003039934A JP 2004007424 A5 JP2004007424 A5 JP 2004007424A5
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003039934A JP4159378B2 (ja) | 2002-04-25 | 2003-02-18 | 高周波装置とその製造方法 |
| US10/421,780 US7030721B2 (en) | 2002-04-25 | 2003-04-24 | High frequency apparatus for transmitting or processing high frequency signal |
| US11/360,385 US7285841B2 (en) | 2002-04-25 | 2006-02-24 | Method of manufacturing signal processing apparatus |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002124431 | 2002-04-25 | ||
| JP2003039934A JP4159378B2 (ja) | 2002-04-25 | 2003-02-18 | 高周波装置とその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004007424A JP2004007424A (ja) | 2004-01-08 |
| JP2004007424A5 true JP2004007424A5 (enExample) | 2006-03-09 |
| JP4159378B2 JP4159378B2 (ja) | 2008-10-01 |
Family
ID=29253638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003039934A Expired - Fee Related JP4159378B2 (ja) | 2002-04-25 | 2003-02-18 | 高周波装置とその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US7030721B2 (enExample) |
| JP (1) | JP4159378B2 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4541718B2 (ja) * | 2004-02-16 | 2010-09-08 | 三菱電機株式会社 | 高周波集積回路とその製造方法 |
| WO2005094316A2 (en) * | 2004-03-26 | 2005-10-13 | Sarnoff Corporation | Low optical overlap mode (loom) waveguiding system and method of making same |
| KR100548388B1 (ko) * | 2004-07-20 | 2006-02-02 | 삼성전자주식회사 | 저손실 인덕터소자 및 그의 제조방법 |
| JP4823541B2 (ja) * | 2005-03-18 | 2011-11-24 | 富士通セミコンダクター株式会社 | 高周波伝送線路 |
| FR2895390A1 (fr) * | 2005-12-22 | 2007-06-29 | Thomson Licensing Sas | Boitier avec fonction accordable en frequence |
| WO2007083354A1 (ja) | 2006-01-17 | 2007-07-26 | Fujitsu Limited | 半導体装置及びその製造方法 |
| JP4815623B2 (ja) * | 2007-09-07 | 2011-11-16 | 三菱電機株式会社 | 高周波受動素子およびその製造方法 |
| TWI399139B (zh) * | 2007-09-19 | 2013-06-11 | Ind Tech Res Inst | 彎繞線狀電感器及具有此彎繞線狀電感器的基板結構 |
| US7955964B2 (en) | 2008-05-14 | 2011-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dishing-free gap-filling with multiple CMPs |
| US8048752B2 (en) | 2008-07-24 | 2011-11-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spacer shape engineering for void-free gap-filling process |
| JP2011040882A (ja) * | 2009-08-07 | 2011-02-24 | Sony Corp | 高周波デバイス |
| TWI441307B (zh) * | 2009-08-07 | 2014-06-11 | 新力股份有限公司 | 內插器、模組及包括該內插器之電子裝置 |
| US8884516B2 (en) * | 2010-01-08 | 2014-11-11 | University Of Utah Research Foundation | Traveling wave electron device with membrane-supported slow wave circuit |
| US9299664B2 (en) * | 2010-01-18 | 2016-03-29 | Semiconductor Components Industries, Llc | Method of forming an EM protected semiconductor die |
| JP5344017B2 (ja) * | 2011-10-05 | 2013-11-20 | 三菱電機株式会社 | 基板間接続構造およびパッケージ |
| US9328253B2 (en) * | 2013-01-22 | 2016-05-03 | Eastman Kodak Company | Method of making electrically conductive micro-wires |
| US9941560B2 (en) * | 2014-12-22 | 2018-04-10 | The Regents Of The University Of Michigan | Non-contact on-wafer S-parameter measurements of devices at millimeter-wave to terahertz frequencies |
| US10410981B2 (en) | 2015-12-31 | 2019-09-10 | International Business Machines Corporation | Effective medium semiconductor cavities for RF applications |
| US11289814B2 (en) | 2017-11-10 | 2022-03-29 | Raytheon Company | Spiral antenna and related fabrication techniques |
| WO2019094477A1 (en) | 2017-11-10 | 2019-05-16 | Raytheon Company | Millimeter wave transmission line architecture |
| CN111567148B (zh) * | 2017-11-10 | 2023-07-28 | 雷神公司 | 射频电路中的增材制造技术（amt）法拉第边界 |
| KR102545915B1 (ko) | 2017-11-10 | 2023-06-22 | 레이던 컴퍼니 | 적층 제조 기술(amt) 저 프로파일 라디에이터 |
| CN109818126B (zh) * | 2017-11-21 | 2021-05-07 | 锐迪科微电子（上海）有限公司 | 一种定向耦合器 |
| JP7175317B2 (ja) | 2018-02-28 | 2022-11-18 | レイセオン カンパニー | スナップ無線周波数コネクタ相互接続体 |
| CA3087290A1 (en) | 2018-02-28 | 2019-09-06 | Raytheon Company | Additive manufacturing technology (amt) low profile signal divider |
| US11470695B2 (en) * | 2020-04-28 | 2022-10-11 | Northrop Grumman Systems Corporation | Filter with an enclosure having a micromachined interior using semiconductor fabrication |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5643804A (en) * | 1993-05-21 | 1997-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a hybrid integrated circuit component having a laminated body |
| JP3141692B2 (ja) * | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | ミリ波用検波器 |
| JPH0936312A (ja) * | 1995-07-18 | 1997-02-07 | Nec Corp | インダクタンス素子およびその製造方法 |
| US5781091A (en) * | 1995-07-24 | 1998-07-14 | Autosplice Systems Inc. | Electronic inductive device and method for manufacturing |
| US5874770A (en) * | 1996-10-10 | 1999-02-23 | General Electric Company | Flexible interconnect film including resistor and capacitor layers |
| JPH10125860A (ja) * | 1996-10-21 | 1998-05-15 | Sony Corp | 平面スパイラルインダクタおよびその製造方法 |
| JP3218996B2 (ja) | 1996-11-28 | 2001-10-15 | 松下電器産業株式会社 | ミリ波導波路 |
| JP2964981B2 (ja) * | 1997-03-14 | 1999-10-18 | 日本電気株式会社 | 半導体装置 |
| US6778041B2 (en) * | 1998-06-02 | 2004-08-17 | Matsushita Electric Industrial Co., Ltd. | Millimeter wave module and radio apparatus |
| US6083802A (en) * | 1998-12-31 | 2000-07-04 | Winbond Electronics Corporation | Method for forming an inductor |
| JP2001308610A (ja) * | 2000-04-20 | 2001-11-02 | Matsushita Electric Ind Co Ltd | マイクロストリップ線路、その製造方法、インダクタ素子及び高周波半導体装置 |
| KR100382765B1 (ko) * | 2001-06-15 | 2003-05-09 | 삼성전자주식회사 | 송수신용 수동소자와 그 집적모듈 및 그 제조방법 |
-
2003
- 2003-02-18 JP JP2003039934A patent/JP4159378B2/ja not_active Expired - Fee Related
- 2003-04-24 US US10/421,780 patent/US7030721B2/en not_active Expired - Fee Related
-
2006
- 2006-02-24 US US11/360,385 patent/US7285841B2/en not_active Expired - Fee Related