JP4141401B2 - ボンディング装置 - Google Patents

ボンディング装置 Download PDF

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Publication number
JP4141401B2
JP4141401B2 JP2004092176A JP2004092176A JP4141401B2 JP 4141401 B2 JP4141401 B2 JP 4141401B2 JP 2004092176 A JP2004092176 A JP 2004092176A JP 2004092176 A JP2004092176 A JP 2004092176A JP 4141401 B2 JP4141401 B2 JP 4141401B2
Authority
JP
Japan
Prior art keywords
bonding
drive motor
link
capillary
rear link
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004092176A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005277325A (ja
Inventor
修 角谷
嘉彦 清野
豊 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004092176A priority Critical patent/JP4141401B2/ja
Priority to TW094101994A priority patent/TW200532830A/zh
Priority to KR1020050015639A priority patent/KR100628707B1/ko
Priority to US11/089,262 priority patent/US7306132B2/en
Publication of JP2005277325A publication Critical patent/JP2005277325A/ja
Application granted granted Critical
Publication of JP4141401B2 publication Critical patent/JP4141401B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/7835—Stable and mobile yokes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H01L2224/78823—Pivoting mechanism

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2004092176A 2004-03-26 2004-03-26 ボンディング装置 Expired - Fee Related JP4141401B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004092176A JP4141401B2 (ja) 2004-03-26 2004-03-26 ボンディング装置
TW094101994A TW200532830A (en) 2004-03-26 2005-01-24 Bonding apparatus
KR1020050015639A KR100628707B1 (ko) 2004-03-26 2005-02-25 본딩장치
US11/089,262 US7306132B2 (en) 2004-03-26 2005-03-24 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004092176A JP4141401B2 (ja) 2004-03-26 2004-03-26 ボンディング装置

Publications (2)

Publication Number Publication Date
JP2005277325A JP2005277325A (ja) 2005-10-06
JP4141401B2 true JP4141401B2 (ja) 2008-08-27

Family

ID=34988585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004092176A Expired - Fee Related JP4141401B2 (ja) 2004-03-26 2004-03-26 ボンディング装置

Country Status (4)

Country Link
US (1) US7306132B2 (enExample)
JP (1) JP4141401B2 (enExample)
KR (1) KR100628707B1 (enExample)
TW (1) TW200532830A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7377415B2 (en) * 2005-06-15 2008-05-27 Kulicke And Soffa Industries, Inc. Bond head link assembly for a wire bonding machine
JP4657942B2 (ja) * 2006-02-14 2011-03-23 株式会社新川 ボンディング装置
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
US20140183181A1 (en) * 2012-12-27 2014-07-03 Pilkington Group Limited Method and apparatus for forming a vehicle window assembly using induction soldering
EP4357067A4 (en) * 2022-08-31 2025-07-09 Wuxi Lead Intelligent Equipment Co Ltd TAB WELDING DEVICE

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328875A (en) * 1965-12-20 1967-07-04 Matheus D Pennings Method of attaching conductors to terminals
US6176414B1 (en) 1999-11-08 2001-01-23 Kulicke & Soffa Investments, Inc. Linkage guided bond head
JP2003197686A (ja) * 2001-10-18 2003-07-11 Nec Corp 電子部品実装装置及び電子部品実装方法
JP3742359B2 (ja) 2002-04-02 2006-02-01 株式会社新川 ボンディング装置
JP3666592B2 (ja) * 2002-05-23 2005-06-29 株式会社新川 ボンディング装置
JP3993157B2 (ja) * 2003-10-23 2007-10-17 株式会社新川 ボンディング装置

Also Published As

Publication number Publication date
KR20060042197A (ko) 2006-05-12
US20050211746A1 (en) 2005-09-29
TWI328845B (enExample) 2010-08-11
JP2005277325A (ja) 2005-10-06
US7306132B2 (en) 2007-12-11
TW200532830A (en) 2005-10-01
KR100628707B1 (ko) 2006-09-29

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