JP4141394B2 - ボンディングアーム揺動型ボンディング装置 - Google Patents
ボンディングアーム揺動型ボンディング装置 Download PDFInfo
- Publication number
- JP4141394B2 JP4141394B2 JP2004044576A JP2004044576A JP4141394B2 JP 4141394 B2 JP4141394 B2 JP 4141394B2 JP 2004044576 A JP2004044576 A JP 2004044576A JP 2004044576 A JP2004044576 A JP 2004044576A JP 4141394 B2 JP4141394 B2 JP 4141394B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- bonding arm
- rotary motor
- fixed
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005096 rolling process Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J13/00—Circuit arrangements for providing remote indication of network conditions, e.g. an instantaneous record of the open or closed condition of each circuitbreaker in the network; Circuit arrangements for providing remote control of switching means in a power distribution network, e.g. switching in and out of current consumers by using a pulse code signal carried by the network
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/7835—Stable and mobile yokes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/78822—Rotational mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/78822—Rotational mechanism
- H01L2224/78823—Pivoting mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/904—Wire bonding
Description
2 キャピラリ
3 ワイヤ
10 回転モータ
11 回転軸部
12 固定部
13 回転中心
14 ボンディング面
20 エア軸受
21 回転軸部
22 固定部
Claims (2)
- ボンディングアームと、このボンディングアームを回転自在に支持するボンディングヘッドと、このボンディングヘッドの上面が固定されたXYテーブルとを備え、前記ボンディングアームの下方に該ボンディングアームの回転中心を有するボンディングアーム揺動型ボンディング装置において、前記ボンディングアームの側方に配設され、該ボンディングアームの下方の回転中心を中心として回転する円弧状の回転モータと、この回転モータの側方に配設され、前記回転中心を中心として回転する円弧状の軸受とを備え、前記回転モータは、下方の回転軸部が前記ボンディングアームに固定され、上方の固定部が前記ボンディングヘッドに固定され、前記軸受は、下方の回転軸部が前記回転モータの回転軸部と一体的に固定され、上方の固定部が前記回転モータの固定部に固定され、前記回転モータ及び前記軸受は、前記ボンディングアームの回転中心より上方に配設されていることを特徴とするボンディングアーム揺動型ボンディング装置。
- 前記軸受は、エア軸受、転がり軸受又は摺動軸受よりなることを特徴とする請求項1記載のボンディングアーム揺動型ボンディング装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004044576A JP4141394B2 (ja) | 2004-02-20 | 2004-02-20 | ボンディングアーム揺動型ボンディング装置 |
TW093139084A TW200529342A (en) | 2004-02-20 | 2004-12-16 | Bonding arm swinging type bonding apparatus |
KR1020050004161A KR100626186B1 (ko) | 2004-02-20 | 2005-01-17 | 본딩 암 요동형 본딩장치 |
US11/061,272 US7389805B2 (en) | 2004-02-20 | 2005-02-17 | Bonding arm swinging type bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004044576A JP4141394B2 (ja) | 2004-02-20 | 2004-02-20 | ボンディングアーム揺動型ボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005236104A JP2005236104A (ja) | 2005-09-02 |
JP4141394B2 true JP4141394B2 (ja) | 2008-08-27 |
Family
ID=34858065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004044576A Expired - Fee Related JP4141394B2 (ja) | 2004-02-20 | 2004-02-20 | ボンディングアーム揺動型ボンディング装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7389805B2 (ja) |
JP (1) | JP4141394B2 (ja) |
KR (1) | KR100626186B1 (ja) |
TW (1) | TW200529342A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4616779B2 (ja) | 2006-03-06 | 2011-01-19 | 株式会社新川 | ホーンホルダ揺動型ボンディング装置 |
JP4343985B2 (ja) * | 2008-01-24 | 2009-10-14 | 株式会社新川 | ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法 |
CA3100435C (en) | 2008-02-15 | 2024-01-30 | Ceres, Inc. | Drought and heat tolerance in plants |
CN114798399B (zh) * | 2022-03-14 | 2023-06-06 | 上海工程技术大学 | 一种超声换能器固定装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2755667B2 (ja) * | 1989-03-27 | 1998-05-20 | 株式会社東芝 | モータ駆動回路及びワイヤボンディング装置 |
US5114244A (en) * | 1991-09-04 | 1992-05-19 | Dunham James L | Compliant bearing surface with enclosed fluid support |
JP2638375B2 (ja) * | 1992-02-20 | 1997-08-06 | 株式会社日立製作所 | 連続溶融金属メッキ装置及び連続溶融金属メッキ装置用軸受 |
JP4010186B2 (ja) | 2002-05-30 | 2007-11-21 | 日本電気株式会社 | ボンディング装置 |
-
2004
- 2004-02-20 JP JP2004044576A patent/JP4141394B2/ja not_active Expired - Fee Related
- 2004-12-16 TW TW093139084A patent/TW200529342A/zh not_active IP Right Cessation
-
2005
- 2005-01-17 KR KR1020050004161A patent/KR100626186B1/ko not_active IP Right Cessation
- 2005-02-17 US US11/061,272 patent/US7389805B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20050083022A (ko) | 2005-08-24 |
KR100626186B1 (ko) | 2006-09-20 |
US20050184127A1 (en) | 2005-08-25 |
TWI330874B (ja) | 2010-09-21 |
JP2005236104A (ja) | 2005-09-02 |
TW200529342A (en) | 2005-09-01 |
US7389805B2 (en) | 2008-06-24 |
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