TW200529342A - Bonding arm swinging type bonding apparatus - Google Patents

Bonding arm swinging type bonding apparatus Download PDF

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Publication number
TW200529342A
TW200529342A TW093139084A TW93139084A TW200529342A TW 200529342 A TW200529342 A TW 200529342A TW 093139084 A TW093139084 A TW 093139084A TW 93139084 A TW93139084 A TW 93139084A TW 200529342 A TW200529342 A TW 200529342A
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TW
Taiwan
Prior art keywords
rotation
joint
arm
center
rotating shaft
Prior art date
Application number
TW093139084A
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English (en)
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TWI330874B (zh
Inventor
Osamu Kakutani
Yutaka Kondo
Yoshihiko Seino
Original Assignee
Shinkawa Kk
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Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200529342A publication Critical patent/TW200529342A/zh
Application granted granted Critical
Publication of TWI330874B publication Critical patent/TWI330874B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J13/00—Circuit arrangements for providing remote indication of network conditions, e.g. an instantaneous record of the open or closed condition of each circuitbreaker in the network; Circuit arrangements for providing remote control of switching means in a power distribution network, e.g. switching in and out of current consumers by using a pulse code signal carried by the network
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/7835—Stable and mobile yokes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H01L2224/78823—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Wire Bonding (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
  • Manipulator (AREA)

Description

200529342 九、發明說明： 【發明所屬之技術領域】 本發明，係有關於接合時接合臂的擺動中心可固定於 接合面上的接合臂擺動型接合裝置。 【先前技術】 就接合臂擺動型接合裝置而 、、、户付银合碩於較丄 件平面高的位置，在接合範圍較大的情況，仍可不須加長 接合臂，因此，可抑制接合臂丨的慣性增大，而可達到高 速化動作，如專利文獻丨所揭示者。該構造具備：接合臂了 於前端安裝毛細管；驅動馬達，設於該接合臂的後：部： 俾驅動遠接合臂，以及接合頭，形成圓弧形窗構造，以支 持設於該接合臂兩側的支持部。_圓弧中心係設於接 合面的平面上，接合臂的支持部係於接合頭的圓窗 沿圓弧形移動。 少IS上 .(專利文獻υ曰本特開2003 一 347349號公報 【發明内容】 ::上述習知技術可縮短接合臂的長度 在該接合臂的後端，離接合臂的旋轉中” 方面受到限制。°又15動馬達’故在慣性力矩的減伯 本發明在於提供， 速動作的提升的接合臂 為解決上述問題， 合臂擺動型接合裝置， 謀求慣性力矩更為減低，俾謀求高 擺動型接合裝置。 本發明之申請專利範圍帛1項之接 係於接合臂下方具有該接合臂的旋 200529342 轉中心，其特徵在於： *旋的圓弧形旋轉馬達 園弧形空氣抽承的轉中心為中心旋轉的 部-體旋轉。 轉轴心成可與該旋轉馬達的旋轉軸 為解決上述問題，士 於上述申請專利=第本之7專利範圍第2項，係 滾動軸承或滑動軸承。軸承係選自空氣軸承、 f動接合臂的旋轉中心，設置旋轉馬達及空氣軸承、 $動軸承或滑動軸承的旋轉中心，故可謀求慣性力矩更為 減低，而谋求南速動作的提升。 【實施方式】 藉第1圖及第2圖說明本發明之一實施形態。毛細管 2固定於接合臂i的#端部，於毛細管」插通捲繞於未圖 不的金屬線軸的金屬線3。於接合臂1的上方配設夹緊臂 5,其具有供央緊金屬線3的金屬線夾頭4,央緊臂$固定 於接合臂1。又，6係感測器標尺。 疋 於接合臂1之二端部配設圓弧形旋轉馬達1〇，旋轉馬 達10的旋轉軸部11固定於接合臂〗的側面。旋轉馬達W 的旋轉軸部11係呈較半圓為小的圓弧形，其旋轉中心 於接合時位在接合面14内。旋轉馬達〗〇的旋轉轴部 藉才疋轉馬達10所具有的磁力吸附保持於旋轉馬達〗〇的口 定部12。 於旋轉馬達10之兩側部配設圓弧形的空氣軸承2〇。 200529342 空氣軸承20的旋轉軸部21 —體以於旋轉馬達ι〇的旋 轉軸部η，空氣軸承20的固定部22-體固定於旋轉馬達 10的固疋邰12又’空氣軸承2〇的旋轉軸部2 i的旋轉 中心係成為旋轉馬達U)的旋轉” n 雖未圖示，旋轉馬達1G的㈣部12固定於接合頭，接合 頭的上面固定於沿XY轴方向驅動的χγ台，⑴固定於 接合裝置的架座的頂部。 由於在接合裴置停止+ , 時），旋轉馬達10的旋轉 :η藉固定部12的磁鐵保持，故與旋轉馬達 :轴部u成-體的接合fl及空 亦保持於旋轉馬達10的固定部u的狀態。 ” =接合裝置的動作中（0N時）， 時，克服旋轉馬達1〇 T作動毛細官2 空氣…。，空氣轴承20= 生的吸附力的空氣供至 的㈣㈣Μ處於浮動狀態=部二;=達:° 轉：達1。’旋轉馬達】。的旋轉轴部"、：：供至旋 疑轉軸部2】及接合臂i即 工氧軸承20的 由接合臂1的擺動，插通毛細管2的二為中心擺動。藉 合。 、金屬線對工件進行接 如此，於接A劈7 的接合臂擺動型：”置：具有該接合臂1的旋轉中心13 广旋轉的圓弧形旋轉馬達；：：的旋轉中心13 合臂卜以旋轉中心、13為中Λ 轉1由部11固定於接 的旋轉軸邱9# “凝轉的圓弧形空氣舳$川 轉設成可與旋轉 /項輛承20 〇的旋轉軸部u 一體 200529342 万疋轉。亦gp , 而可謀求5:13,故可謀求慣性力矩更為減低， 八阿逮動作的提升。
雖然於上述實施形態中對使用办〆 的情形加㈣明，不過，#然亦可 d軸承作為車M 【圖式簡單說明】 、軸承或滑動輛承。 第1圖係表示本發明之接合臂 施形態的立體圖。 〜動型接合裝置之〜實 第2圖係第1圖之側視圖。
【主要元件符號說明】 1 :接合臂 2 :毛細管 3 :金屬線 I 0 :旋轉馬達 II :旋轉軸部 12 ·固定部
1 3 :旋轉中心 14 ·接合面 2〇 ·空氣軸承 21 :旋轉軸部 22 :固定部 8

Claims (1)

  1. 200529342 十、申請專利範圍· 1 · 一種接合臂擺動型接合裝置， 1单於接合臂 該接合臂的旋轉中心，其特徵在於： 卜方具有 以該接合臂的旋轉中心為中心 ^ > 々疋轉的圓弧形旋轉焉it 的旋轉軸部固定於該接合臂， 轉馬達 η π & + / 以。哀紅轉中心為中心旋轉的 0弧形空氣軸承的旋轉 ^ 軸5又成可與該旋轉馬達的旋轉軸 部一體旋轉。 2·如申請專利範圍第〗语* μ人 豆員之接合臂擺動型接合裝置， 〃〒该軸承係選自空顧 ' 承、滾動軸承或滑動轴承。 十一、圖式： 如次頁
    9
TW093139084A 2004-02-20 2004-12-16 Bonding arm swinging type bonding apparatus TW200529342A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004044576A JP4141394B2 (ja) 2004-02-20 2004-02-20 ボンディングアーム揺動型ボンディング装置

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TW200529342A true TW200529342A (en) 2005-09-01
TWI330874B TWI330874B (zh) 2010-09-21

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US (1) US7389805B2 (zh)
JP (1) JP4141394B2 (zh)
KR (1) KR100626186B1 (zh)
TW (1) TW200529342A (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4616779B2 (ja) * 2006-03-06 2011-01-19 株式会社新川 ホーンホルダ揺動型ボンディング装置
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
CA2713208C (en) 2008-02-15 2021-02-16 Ceres, Inc. Drought and heat tolerance in plants
CN114798399B (zh) * 2022-03-14 2023-06-06 上海工程技术大学 一种超声换能器固定装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2755667B2 (ja) * 1989-03-27 1998-05-20 株式会社東芝 モータ駆動回路及びワイヤボンディング装置
US5114244A (en) * 1991-09-04 1992-05-19 Dunham James L Compliant bearing surface with enclosed fluid support
JP2638375B2 (ja) * 1992-02-20 1997-08-06 株式会社日立製作所 連続溶融金属メッキ装置及び連続溶融金属メッキ装置用軸受
JP4010186B2 (ja) 2002-05-30 2007-11-21 日本電気株式会社 ボンディング装置

Also Published As

Publication number Publication date
US20050184127A1 (en) 2005-08-25
JP2005236104A (ja) 2005-09-02
KR100626186B1 (ko) 2006-09-20
TWI330874B (zh) 2010-09-21
US7389805B2 (en) 2008-06-24
KR20050083022A (ko) 2005-08-24
JP4141394B2 (ja) 2008-08-27

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