TW200532830A - Bonding apparatus - Google Patents

Bonding apparatus Download PDF

Info

Publication number
TW200532830A
TW200532830A TW094101994A TW94101994A TW200532830A TW 200532830 A TW200532830 A TW 200532830A TW 094101994 A TW094101994 A TW 094101994A TW 94101994 A TW94101994 A TW 94101994A TW 200532830 A TW200532830 A TW 200532830A
Authority
TW
Taiwan
Prior art keywords
joint
fixed
link
bonding
arm
Prior art date
Application number
TW094101994A
Other languages
English (en)
Chinese (zh)
Other versions
TWI328845B (enExample
Inventor
Osamu Kakutani
Yutaka Kondo
Yoshihiko Seino
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200532830A publication Critical patent/TW200532830A/zh
Application granted granted Critical
Publication of TWI328845B publication Critical patent/TWI328845B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/7835—Stable and mobile yokes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H01L2224/78823—Pivoting mechanism

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW094101994A 2004-03-26 2005-01-24 Bonding apparatus TW200532830A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004092176A JP4141401B2 (ja) 2004-03-26 2004-03-26 ボンディング装置

Publications (2)

Publication Number Publication Date
TW200532830A true TW200532830A (en) 2005-10-01
TWI328845B TWI328845B (enExample) 2010-08-11

Family

ID=34988585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101994A TW200532830A (en) 2004-03-26 2005-01-24 Bonding apparatus

Country Status (4)

Country Link
US (1) US7306132B2 (enExample)
JP (1) JP4141401B2 (enExample)
KR (1) KR100628707B1 (enExample)
TW (1) TW200532830A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7377415B2 (en) * 2005-06-15 2008-05-27 Kulicke And Soffa Industries, Inc. Bond head link assembly for a wire bonding machine
JP4657942B2 (ja) * 2006-02-14 2011-03-23 株式会社新川 ボンディング装置
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
US20140183181A1 (en) * 2012-12-27 2014-07-03 Pilkington Group Limited Method and apparatus for forming a vehicle window assembly using induction soldering
EP4357067A4 (en) * 2022-08-31 2025-07-09 Wuxi Lead Intelligent Equipment Co Ltd TAB WELDING DEVICE

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328875A (en) * 1965-12-20 1967-07-04 Matheus D Pennings Method of attaching conductors to terminals
US6176414B1 (en) 1999-11-08 2001-01-23 Kulicke & Soffa Investments, Inc. Linkage guided bond head
JP2003197686A (ja) * 2001-10-18 2003-07-11 Nec Corp 電子部品実装装置及び電子部品実装方法
JP3742359B2 (ja) 2002-04-02 2006-02-01 株式会社新川 ボンディング装置
JP3666592B2 (ja) * 2002-05-23 2005-06-29 株式会社新川 ボンディング装置
JP3993157B2 (ja) * 2003-10-23 2007-10-17 株式会社新川 ボンディング装置

Also Published As

Publication number Publication date
KR20060042197A (ko) 2006-05-12
US20050211746A1 (en) 2005-09-29
TWI328845B (enExample) 2010-08-11
JP2005277325A (ja) 2005-10-06
US7306132B2 (en) 2007-12-11
JP4141401B2 (ja) 2008-08-27
KR100628707B1 (ko) 2006-09-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees