JP4139739B2 - 基板搬送方法 - Google Patents

基板搬送方法 Download PDF

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Publication number
JP4139739B2
JP4139739B2 JP2003155272A JP2003155272A JP4139739B2 JP 4139739 B2 JP4139739 B2 JP 4139739B2 JP 2003155272 A JP2003155272 A JP 2003155272A JP 2003155272 A JP2003155272 A JP 2003155272A JP 4139739 B2 JP4139739 B2 JP 4139739B2
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substrate
processing
time
unit
sender
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Japanese (ja)
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JP2004356560A (ja
JP2004356560A5 (enExample
Inventor
義樹 岩田
誠一 甲斐
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Canon Marketing Japan Inc
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Canon Marketing Japan Inc
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Priority to JP2003155272A priority Critical patent/JP4139739B2/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2003155272A 2003-05-30 2003-05-30 基板搬送方法 Expired - Fee Related JP4139739B2 (ja)

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JP2003155272A JP4139739B2 (ja) 2003-05-30 2003-05-30 基板搬送方法

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JP2003155272A JP4139739B2 (ja) 2003-05-30 2003-05-30 基板搬送方法

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JP2004356560A JP2004356560A (ja) 2004-12-16
JP2004356560A5 JP2004356560A5 (enExample) 2005-10-20
JP4139739B2 true JP4139739B2 (ja) 2008-08-27

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JP2003155272A Expired - Fee Related JP4139739B2 (ja) 2003-05-30 2003-05-30 基板搬送方法

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008072016A (ja) * 2006-09-15 2008-03-27 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体
US7679714B2 (en) * 2006-10-12 2010-03-16 Asml Netherlands B.V. Lithographic apparatus, combination of lithographic apparatus and processing module, and device manufacturing method
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
JP2009076579A (ja) * 2007-09-19 2009-04-09 Nikon Corp 物体処理システム、物体処理方法、露光装置、露光方法、塗布現像装置、塗布現像方法及びデバイス製造方法
JP2009076580A (ja) * 2007-09-19 2009-04-09 Nikon Corp 物体処理システム、物体処理方法、処理装置、基板処理方法及びデバイス製造方法
JP5077764B2 (ja) 2008-04-22 2012-11-21 富士電機株式会社 インプリント方法およびその装置
JP5370806B2 (ja) 2008-04-22 2013-12-18 富士電機株式会社 インプリント方法およびその装置
JP5562561B2 (ja) * 2009-01-23 2014-07-30 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP6253260B2 (ja) * 2013-05-24 2017-12-27 株式会社日立産機システム ワニス処理装置およびワニス処理方法
US20170298503A1 (en) * 2016-04-18 2017-10-19 Asm Ip Holding B.V. Combined anneal and selective deposition systems
JP7643861B2 (ja) * 2020-10-30 2025-03-11 株式会社荏原製作所 基板処理装置においてカセットからの基板の取り出しタイミングを決定する方法、装置、プログラム、および基板処理装置

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JP2004356560A (ja) 2004-12-16

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