JP2004356560A5 - - Google Patents
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- Publication number
- JP2004356560A5 JP2004356560A5 JP2003155272A JP2003155272A JP2004356560A5 JP 2004356560 A5 JP2004356560 A5 JP 2004356560A5 JP 2003155272 A JP2003155272 A JP 2003155272A JP 2003155272 A JP2003155272 A JP 2003155272A JP 2004356560 A5 JP2004356560 A5 JP 2004356560A5
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- JP
- Japan
- Prior art keywords
- substrate
- unit
- processing
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims 23
- 238000000034 method Methods 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003155272A JP4139739B2 (ja) | 2003-05-30 | 2003-05-30 | 基板搬送方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003155272A JP4139739B2 (ja) | 2003-05-30 | 2003-05-30 | 基板搬送方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004356560A JP2004356560A (ja) | 2004-12-16 |
| JP2004356560A5 true JP2004356560A5 (enExample) | 2005-10-20 |
| JP4139739B2 JP4139739B2 (ja) | 2008-08-27 |
Family
ID=34049695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003155272A Expired - Fee Related JP4139739B2 (ja) | 2003-05-30 | 2003-05-30 | 基板搬送方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4139739B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008072016A (ja) * | 2006-09-15 | 2008-03-27 | Tokyo Electron Ltd | 液処理装置、液処理方法及び記憶媒体 |
| US7679714B2 (en) * | 2006-10-12 | 2010-03-16 | Asml Netherlands B.V. | Lithographic apparatus, combination of lithographic apparatus and processing module, and device manufacturing method |
| JP5132920B2 (ja) * | 2006-11-22 | 2013-01-30 | 東京エレクトロン株式会社 | 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム |
| JP2009076579A (ja) * | 2007-09-19 | 2009-04-09 | Nikon Corp | 物体処理システム、物体処理方法、露光装置、露光方法、塗布現像装置、塗布現像方法及びデバイス製造方法 |
| JP2009076580A (ja) * | 2007-09-19 | 2009-04-09 | Nikon Corp | 物体処理システム、物体処理方法、処理装置、基板処理方法及びデバイス製造方法 |
| JP5077764B2 (ja) | 2008-04-22 | 2012-11-21 | 富士電機株式会社 | インプリント方法およびその装置 |
| JP5370806B2 (ja) | 2008-04-22 | 2013-12-18 | 富士電機株式会社 | インプリント方法およびその装置 |
| JP5562561B2 (ja) * | 2009-01-23 | 2014-07-30 | 株式会社Sokudo | 基板処理装置 |
| JP6253260B2 (ja) * | 2013-05-24 | 2017-12-27 | 株式会社日立産機システム | ワニス処理装置およびワニス処理方法 |
| US20170298503A1 (en) * | 2016-04-18 | 2017-10-19 | Asm Ip Holding B.V. | Combined anneal and selective deposition systems |
| JP7643861B2 (ja) * | 2020-10-30 | 2025-03-11 | 株式会社荏原製作所 | 基板処理装置においてカセットからの基板の取り出しタイミングを決定する方法、装置、プログラム、および基板処理装置 |
-
2003
- 2003-05-30 JP JP2003155272A patent/JP4139739B2/ja not_active Expired - Fee Related
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