JP4128790B2 - リッジ導波路型分布帰還レーザの製造方法 - Google Patents

リッジ導波路型分布帰還レーザの製造方法 Download PDF

Info

Publication number
JP4128790B2
JP4128790B2 JP2002086567A JP2002086567A JP4128790B2 JP 4128790 B2 JP4128790 B2 JP 4128790B2 JP 2002086567 A JP2002086567 A JP 2002086567A JP 2002086567 A JP2002086567 A JP 2002086567A JP 4128790 B2 JP4128790 B2 JP 4128790B2
Authority
JP
Japan
Prior art keywords
type
layer
diffraction grating
ridge waveguide
inp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002086567A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003283047A5 (enExample
JP2003283047A (ja
Inventor
透 瀧口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2002086567A priority Critical patent/JP4128790B2/ja
Priority to US10/245,495 priority patent/US6741630B2/en
Publication of JP2003283047A publication Critical patent/JP2003283047A/ja
Publication of JP2003283047A5 publication Critical patent/JP2003283047A5/ja
Application granted granted Critical
Publication of JP4128790B2 publication Critical patent/JP4128790B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/305Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • H01S5/3054Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure p-doping

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Semiconductor Lasers (AREA)
JP2002086567A 2002-02-16 2002-03-26 リッジ導波路型分布帰還レーザの製造方法 Expired - Lifetime JP4128790B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002086567A JP4128790B2 (ja) 2002-03-26 2002-03-26 リッジ導波路型分布帰還レーザの製造方法
US10/245,495 US6741630B2 (en) 2002-02-16 2002-09-18 Ridge waveguide distributed feedback laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002086567A JP4128790B2 (ja) 2002-03-26 2002-03-26 リッジ導波路型分布帰還レーザの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008104735A Division JP2008177623A (ja) 2008-04-14 2008-04-14 リッジ導波路型分布帰還レーザ

Publications (3)

Publication Number Publication Date
JP2003283047A JP2003283047A (ja) 2003-10-03
JP2003283047A5 JP2003283047A5 (enExample) 2005-06-23
JP4128790B2 true JP4128790B2 (ja) 2008-07-30

Family

ID=28449312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002086567A Expired - Lifetime JP4128790B2 (ja) 2002-02-16 2002-03-26 リッジ導波路型分布帰還レーザの製造方法

Country Status (2)

Country Link
US (1) US6741630B2 (enExample)
JP (1) JP4128790B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234541A (ja) * 2001-12-07 2003-08-22 Furukawa Electric Co Ltd:The 分布帰還型半導体レーザ素子
JP4504610B2 (ja) * 2002-03-01 2010-07-14 株式会社日立製作所 リッジ型半導体レーザ素子
JP4638753B2 (ja) * 2005-03-16 2011-02-23 日本オプネクスト株式会社 半導体光素子および半導体光素子の製造方法
JP4892940B2 (ja) * 2005-11-29 2012-03-07 富士ゼロックス株式会社 面発光型半導体レーザ装置およびその製造方法
JP2008098387A (ja) * 2006-10-12 2008-04-24 Sumitomo Electric Ind Ltd 回折格子の作製方法
JP2008177623A (ja) * 2008-04-14 2008-07-31 Mitsubishi Electric Corp リッジ導波路型分布帰還レーザ
JP5310271B2 (ja) * 2009-05-29 2013-10-09 住友電気工業株式会社 半導体レーザ素子
JP4917157B2 (ja) * 2010-02-26 2012-04-18 Nttエレクトロニクス株式会社 リッジ型半導体レーザ及びリッジ型半導体レーザの製造方法
US20120106583A1 (en) 2010-11-02 2012-05-03 Onechip Photonics Inc. Vertically-coupled surface-etched grating dfb laser
FR3026571B1 (fr) * 2014-09-26 2016-12-02 Thales Sa Procede d'elaboration d'une structure resonante d'un laser a semi-conducteur a contre-reaction repartie

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6284583A (ja) 1985-10-08 1987-04-18 Nec Corp 分布帰還型半導体レ−ザ
US6072812A (en) 1997-08-01 2000-06-06 Lucent Technologies Inc. Distributed feedback laser with loss coupling
JP4786024B2 (ja) * 2000-11-20 2011-10-05 三菱電機株式会社 分布帰還型レーザおよびその製造方法

Also Published As

Publication number Publication date
JP2003283047A (ja) 2003-10-03
US6741630B2 (en) 2004-05-25
US20030185263A1 (en) 2003-10-02

Similar Documents

Publication Publication Date Title
JP2547001B2 (ja) 半導体構造の製造方法
US5452315A (en) Semiconductor laser with semi-insulating current blocking layers
US5684823A (en) Method of fabricating a diffraction grating and a distributed feedback semiconductor laser incorporating the diffraction grating
JP3234086B2 (ja) 光半導体デバイス及びその製造方法
US4870468A (en) Semiconductor light-emitting device and method of manufacturing the same
JP4128790B2 (ja) リッジ導波路型分布帰還レーザの製造方法
JP3907854B2 (ja) 半導体レーザ及びその製造方法
US5665612A (en) Method for fabricating a planar buried heterostructure laser diode
US6642075B2 (en) Method for manufacturing semiconductor laser device
JP4514868B2 (ja) 半導体装置の製造方法
JP3672062B2 (ja) 半導体レーザ,及びその製造方法
JP3762640B2 (ja) 半導体装置の製造方法および光導波路の製造方法、多層光導波路の製造方法
US6498889B2 (en) Waveguide optical device and method of fabricating the same
JP2004119467A (ja) 半導体レーザ装置
JP4213154B2 (ja) 半導体装置の製造方法
JP2008177623A (ja) リッジ導波路型分布帰還レーザ
JPH05299764A (ja) 半導体レーザの製造方法
JP4164248B2 (ja) 半導体素子及びその製造方法、及び半導体光装置
JP3038424B2 (ja) 埋め込み構造半導体レーザとその製造方法
US20060018352A1 (en) Ridge-type semiconductor laser and method of fabricating the same
JP4040663B2 (ja) 半導体レーザ及びその製造方法
JP3602814B2 (ja) 半導体装置の製造方法
JP3994928B2 (ja) 半導体レーザの製造方法
KR100388536B1 (ko) 아이형 리지를 가지는 반도체 레이저 다이오드 및 그제조방법
JPH08148760A (ja) 半導体レーザの製造方法および半導体レーザ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040927

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040927

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070817

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070828

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071005

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080125

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20080205

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080311

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080414

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080513

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080515

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4128790

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120523

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120523

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130523

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140523

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term