JP4124327B2 - 基板ホルダ及びめっき装置 - Google Patents

基板ホルダ及びめっき装置 Download PDF

Info

Publication number
JP4124327B2
JP4124327B2 JP2002213209A JP2002213209A JP4124327B2 JP 4124327 B2 JP4124327 B2 JP 4124327B2 JP 2002213209 A JP2002213209 A JP 2002213209A JP 2002213209 A JP2002213209 A JP 2002213209A JP 4124327 B2 JP4124327 B2 JP 4124327B2
Authority
JP
Japan
Prior art keywords
substrate
holding member
substrate holder
movable holding
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002213209A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004076022A (ja
JP2004076022A5 (de
Inventor
潤一郎 吉岡
邦明 堀江
誉綱 郭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2002213209A priority Critical patent/JP4124327B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to KR1020047000836A priority patent/KR100980051B1/ko
Priority to CN2008100040249A priority patent/CN101281858B/zh
Priority to TW092116755A priority patent/TWI316097B/zh
Priority to CNB038008459A priority patent/CN100370578C/zh
Priority to EP03760917A priority patent/EP1516357A2/de
Priority to US10/482,476 priority patent/US7601248B2/en
Priority to PCT/JP2003/007855 priority patent/WO2004001813A2/en
Publication of JP2004076022A publication Critical patent/JP2004076022A/ja
Publication of JP2004076022A5 publication Critical patent/JP2004076022A5/ja
Priority to JP2008075465A priority patent/JP4669019B2/ja
Application granted granted Critical
Publication of JP4124327B2 publication Critical patent/JP4124327B2/ja
Priority to US12/585,141 priority patent/US7901551B2/en
Priority to US13/017,294 priority patent/US8337680B2/en
Priority to US13/684,902 priority patent/US8936705B2/en
Priority to US14/565,841 priority patent/US9388505B2/en
Priority to US15/180,448 priority patent/US9506162B2/en
Priority to US15/180,457 priority patent/US9624596B2/en
Priority to US15/180,477 priority patent/US9593430B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2002213209A 2002-06-21 2002-07-22 基板ホルダ及びめっき装置 Expired - Lifetime JP4124327B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2002213209A JP4124327B2 (ja) 2002-06-21 2002-07-22 基板ホルダ及びめっき装置
KR1020047000836A KR100980051B1 (ko) 2002-06-21 2003-06-20 기판홀더 및 도금장치
CN2008100040249A CN101281858B (zh) 2002-06-21 2003-06-20 基片保持装置和电镀设备
TW092116755A TWI316097B (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
CNB038008459A CN100370578C (zh) 2002-06-21 2003-06-20 基片保持装置和电镀设备
EP03760917A EP1516357A2 (de) 2002-06-21 2003-06-20 Substrathalter und plattierungseinrichtung
US10/482,476 US7601248B2 (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
PCT/JP2003/007855 WO2004001813A2 (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
JP2008075465A JP4669019B2 (ja) 2002-06-21 2008-03-24 基板ホルダ及び電解めっき装置
US12/585,141 US7901551B2 (en) 2002-06-21 2009-09-04 Substrate holder and plating apparatus
US13/017,294 US8337680B2 (en) 2002-06-21 2011-01-31 Substrate holder and plating apparatus
US13/684,902 US8936705B2 (en) 2002-06-21 2012-11-26 Electrochemical deposition apparatus
US14/565,841 US9388505B2 (en) 2002-06-21 2014-12-10 Electrochemical deposition method
US15/180,448 US9506162B2 (en) 2002-06-21 2016-06-13 Electrochemical deposition method
US15/180,457 US9624596B2 (en) 2002-07-22 2016-06-13 Electrochemical deposition method
US15/180,477 US9593430B2 (en) 2002-07-22 2016-06-13 Electrochemical deposition method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002182236 2002-06-21
JP2002213209A JP4124327B2 (ja) 2002-06-21 2002-07-22 基板ホルダ及びめっき装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008075465A Division JP4669019B2 (ja) 2002-06-21 2008-03-24 基板ホルダ及び電解めっき装置

Publications (3)

Publication Number Publication Date
JP2004076022A JP2004076022A (ja) 2004-03-11
JP2004076022A5 JP2004076022A5 (de) 2007-11-08
JP4124327B2 true JP4124327B2 (ja) 2008-07-23

Family

ID=32032640

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002213209A Expired - Lifetime JP4124327B2 (ja) 2002-06-21 2002-07-22 基板ホルダ及びめっき装置
JP2008075465A Expired - Lifetime JP4669019B2 (ja) 2002-06-21 2008-03-24 基板ホルダ及び電解めっき装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008075465A Expired - Lifetime JP4669019B2 (ja) 2002-06-21 2008-03-24 基板ホルダ及び電解めっき装置

Country Status (1)

Country Link
JP (2) JP4124327B2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741191U (ja) * 1993-12-21 1995-07-21 株式会社イナックス フランジ付き防振配管具
KR20190098058A (ko) 2018-02-13 2019-08-21 가부시키가이샤 에바라 세이사꾸쇼 기판 유지 부재, 기판 처리 장치, 기판 처리 장치의 제어 방법, 프로그램을 저장한 기억 매체

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5766048B2 (ja) * 2010-08-19 2015-08-19 株式会社荏原製作所 基板ホルダ及びめっき装置
JP5750327B2 (ja) * 2010-10-21 2015-07-22 株式会社荏原製作所 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法
TWI580814B (zh) 2010-10-21 2017-05-01 荏原製作所股份有限公司 基板處理裝置，以及鍍覆裝置及鍍覆方法
JP5908266B2 (ja) * 2011-11-30 2016-04-26 株式会社Ｓｃｒｅｅｎホールディングス 陽極化成装置及びそれを備えた陽極化成システム並びに半導体ウエハ
JP5643239B2 (ja) * 2012-01-30 2014-12-17 株式会社荏原製作所 基板ホルダ及びめっき装置
JP5782398B2 (ja) 2012-03-27 2015-09-24 株式会社荏原製作所 めっき方法及びめっき装置
JP6077886B2 (ja) 2013-03-04 2017-02-08 株式会社荏原製作所 めっき装置
JP6508935B2 (ja) * 2014-02-28 2019-05-08 株式会社荏原製作所 基板ホルダ、めっき装置及びめっき方法
JP2016000851A (ja) * 2014-06-12 2016-01-07 株式会社村田製作所 めっき用治具
JP6455778B2 (ja) * 2014-12-04 2019-01-23 株式会社オジックテクノロジーズ 治具及び治具生産方法
KR102342006B1 (ko) * 2016-03-04 2021-12-22 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 방법
JP6747859B2 (ja) * 2016-05-09 2020-08-26 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置
US10283396B2 (en) * 2016-06-27 2019-05-07 Asm Nexx, Inc. Workpiece holder for a wet processing system
JP6713863B2 (ja) * 2016-07-13 2020-06-24 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置
WO2019175990A1 (ja) * 2018-03-13 2019-09-19 株式会社山本鍍金試験器 めっき装置及びめっきシステム
JP7132135B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132136B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132134B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7264780B2 (ja) * 2019-09-10 2023-04-25 株式会社荏原製作所 基板ホルダ及びそれを備えた基板めっき装置、並びに電気接点
JP7256728B2 (ja) 2019-10-04 2023-04-12 株式会社荏原製作所 基板ホルダ及び基板処理装置
JP7421302B2 (ja) * 2019-10-07 2024-01-24 上村工業株式会社 保持治具
KR102466975B1 (ko) * 2021-11-09 2022-11-16 가부시키가이샤 에바라 세이사꾸쇼 도금 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617848B2 (ja) * 1992-02-07 1997-06-04 株式会社荏原製作所 半導体ウエハの鍍金治具
JP2000239898A (ja) * 1999-02-22 2000-09-05 Ebara Corp めっき装置
WO2000070128A1 (fr) * 1999-05-18 2000-11-23 Ebara Corporation Support de revetement et dispositif pour tranche de semi-conducteur

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741191U (ja) * 1993-12-21 1995-07-21 株式会社イナックス フランジ付き防振配管具
KR20190098058A (ko) 2018-02-13 2019-08-21 가부시키가이샤 에바라 세이사꾸쇼 기판 유지 부재, 기판 처리 장치, 기판 처리 장치의 제어 방법, 프로그램을 저장한 기억 매체
US10818527B2 (en) 2018-02-13 2020-10-27 Ebara Corporation Substrate holding member, substrate processing device, method for controlling substrate processing device, and storage medium storing programs

Also Published As

Publication number Publication date
JP2004076022A (ja) 2004-03-11
JP4669019B2 (ja) 2011-04-13
JP2008156758A (ja) 2008-07-10

Similar Documents

Publication Publication Date Title
JP4669019B2 (ja) 基板ホルダ及び電解めっき装置
JP4722955B2 (ja) 基板ホルダ及び電解めっき装置
KR102334585B1 (ko) 기판 홀더 및 이것을 사용한 도금 장치
JP5993065B2 (ja) 基板ホルダ
US9506162B2 (en) Electrochemical deposition method
JP3827627B2 (ja) めっき装置及びめっき方法
JP5643239B2 (ja) 基板ホルダ及びめっき装置
JP5529188B2 (ja) アノードホルダ及びめっき装置
KR102103538B1 (ko) 기판 홀더, 도금 장치 및 도금 방법
US9593430B2 (en) Electrochemical deposition method
JP2015071802A (ja) めっき装置および該めっき装置に使用されるクリーニング装置
TW201914702A (zh) 基板洗淨方法
JP2017203178A (ja) 基板ホルダ及びこれを用いためっき装置
JP2014189806A (ja) めっき装置およびめっき方法
JP3778282B2 (ja) 基板ホルダ及びめっき装置
JP2004269923A (ja) めっき装置
JP2002363793A (ja) 基板ホルダ及びめっき装置
JP2002363797A (ja) 電気接点及びその製造方法、並びにめっき装置
JP5763243B2 (ja) めっき装置
TW201900943A (zh) 基板固持器及使用該基板固持器之鍍覆裝置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070926

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080122

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080324

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080430

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080430

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4124327

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110516

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110516

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120516

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130516

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140516

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term