JP4115641B2 - 加熱処理装置 - Google Patents

加熱処理装置 Download PDF

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Publication number
JP4115641B2
JP4115641B2 JP37378699A JP37378699A JP4115641B2 JP 4115641 B2 JP4115641 B2 JP 4115641B2 JP 37378699 A JP37378699 A JP 37378699A JP 37378699 A JP37378699 A JP 37378699A JP 4115641 B2 JP4115641 B2 JP 4115641B2
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Japan
Prior art keywords
cooling
heating plate
cooling gas
plate
wafer
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Expired - Fee Related
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JP37378699A
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Japanese (ja)
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JP2001189250A5 (enExample
JP2001189250A (ja
Inventor
英一 白川
哲也 小田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP37378699A priority Critical patent/JP4115641B2/ja
Publication of JP2001189250A publication Critical patent/JP2001189250A/ja
Publication of JP2001189250A5 publication Critical patent/JP2001189250A5/ja
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Publication of JP4115641B2 publication Critical patent/JP4115641B2/ja
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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP37378699A 1999-12-28 1999-12-28 加熱処理装置 Expired - Fee Related JP4115641B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP37378699A JP4115641B2 (ja) 1999-12-28 1999-12-28 加熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP37378699A JP4115641B2 (ja) 1999-12-28 1999-12-28 加熱処理装置

Publications (3)

Publication Number Publication Date
JP2001189250A JP2001189250A (ja) 2001-07-10
JP2001189250A5 JP2001189250A5 (enExample) 2005-07-21
JP4115641B2 true JP4115641B2 (ja) 2008-07-09

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Family Applications (1)

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JP37378699A Expired - Fee Related JP4115641B2 (ja) 1999-12-28 1999-12-28 加熱処理装置

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JP (1) JP4115641B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3996845B2 (ja) * 2002-12-27 2007-10-24 大日本スクリーン製造株式会社 基板処理装置
JP4410147B2 (ja) * 2005-05-09 2010-02-03 東京エレクトロン株式会社 加熱装置、塗布、現像装置及び加熱方法
JP4527670B2 (ja) 2006-01-25 2010-08-18 東京エレクトロン株式会社 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体
JP4606355B2 (ja) * 2006-03-14 2011-01-05 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
JP5793468B2 (ja) * 2012-05-30 2015-10-14 東京エレクトロン株式会社 熱処理装置、熱処理板の冷却方法、プログラム及びコンピュータ記憶媒体
JP5914922B2 (ja) * 2012-10-18 2016-05-11 アユミ工業株式会社 半導体熱処理用ヒーター
JP7186096B2 (ja) 2019-01-09 2022-12-08 東京エレクトロン株式会社 熱板の冷却方法及び加熱処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169330A (ja) * 1986-12-19 1987-07-25 Canon Inc 半導体露光装置
JP3559139B2 (ja) * 1997-03-21 2004-08-25 大日本スクリーン製造株式会社 基板処理装置
JPH10284382A (ja) * 1997-04-07 1998-10-23 Komatsu Ltd 温度制御装置
JP3934246B2 (ja) * 1997-10-27 2007-06-20 大日本スクリーン製造株式会社 基板冷却装置および基板冷却方法
JPH11329922A (ja) * 1998-05-08 1999-11-30 Dainippon Screen Mfg Co Ltd 基板冷却装置および基板冷却方法
JP3348712B2 (ja) * 1999-02-10 2002-11-20 イビデン株式会社 ホットプレートユニット

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JP2001189250A (ja) 2001-07-10

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