JP4089974B2 - 窒化ケイ素質粉末、窒化ケイ素質焼結体及びこれを用いた電子部品用回路基板 - Google Patents
窒化ケイ素質粉末、窒化ケイ素質焼結体及びこれを用いた電子部品用回路基板 Download PDFInfo
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- JP4089974B2 JP4089974B2 JP2004130790A JP2004130790A JP4089974B2 JP 4089974 B2 JP4089974 B2 JP 4089974B2 JP 2004130790 A JP2004130790 A JP 2004130790A JP 2004130790 A JP2004130790 A JP 2004130790A JP 4089974 B2 JP4089974 B2 JP 4089974B2
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- Prior art keywords
- silicon nitride
- sintered body
- nitride powder
- less
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052581 Si3N4 Inorganic materials 0.000 title claims description 146
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title claims description 146
- 239000000843 powder Substances 0.000 title claims description 100
- 239000002245 particle Substances 0.000 claims description 53
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 37
- 239000001301 oxygen Substances 0.000 claims description 37
- 229910052760 oxygen Inorganic materials 0.000 claims description 37
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 33
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 33
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 23
- 239000000395 magnesium oxide Substances 0.000 claims description 22
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 22
- 238000005245 sintering Methods 0.000 claims description 18
- 229910052757 nitrogen Inorganic materials 0.000 claims description 16
- 239000012298 atmosphere Substances 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 14
- 239000011777 magnesium Substances 0.000 claims description 13
- 229910052746 lanthanum Inorganic materials 0.000 claims description 12
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 11
- 229910052727 yttrium Inorganic materials 0.000 claims description 11
- 230000001590 oxidative effect Effects 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 238000013001 point bending Methods 0.000 claims description 7
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 2
- 238000000034 method Methods 0.000 description 27
- 239000000758 substrate Substances 0.000 description 23
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- 229910004298 SiO 2 Inorganic materials 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 229910052684 Cerium Inorganic materials 0.000 description 4
- 229910052692 Dysprosium Inorganic materials 0.000 description 4
- 229910052688 Gadolinium Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- 229910052799 carbon Inorganic materials 0.000 description 3
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- 239000006104 solid solution Substances 0.000 description 3
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 208000025599 Heat Stress disease Diseases 0.000 description 2
- 229910052689 Holmium Inorganic materials 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
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- 150000003949 imides Chemical class 0.000 description 2
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- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910007277 Si3 N4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- 238000004220 aggregation Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009036 growth inhibition Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- -1 silicon imide Chemical class 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000009628 steelmaking Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004130790A JP4089974B2 (ja) | 2004-04-27 | 2004-04-27 | 窒化ケイ素質粉末、窒化ケイ素質焼結体及びこれを用いた電子部品用回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004130790A JP4089974B2 (ja) | 2004-04-27 | 2004-04-27 | 窒化ケイ素質粉末、窒化ケイ素質焼結体及びこれを用いた電子部品用回路基板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000284957A Division JP3565425B2 (ja) | 2000-09-20 | 2000-09-20 | 窒化ケイ素質粉末の製造方法および窒化ケイ素質焼結体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004262756A JP2004262756A (ja) | 2004-09-24 |
| JP2004262756A5 JP2004262756A5 (enExample) | 2005-06-16 |
| JP4089974B2 true JP4089974B2 (ja) | 2008-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004130790A Expired - Lifetime JP4089974B2 (ja) | 2004-04-27 | 2004-04-27 | 窒化ケイ素質粉末、窒化ケイ素質焼結体及びこれを用いた電子部品用回路基板 |
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| Country | Link |
|---|---|
| JP (1) | JP4089974B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8029903B2 (en) * | 2005-08-11 | 2011-10-04 | Denki Kagaku Kogyo Kabushiki Kaisha | Silicon nitride substrate, silicon nitride circuit board utilizing the same, and use thereof |
| JP5200741B2 (ja) * | 2007-08-01 | 2013-06-05 | 三菱化学株式会社 | 結晶性窒化珪素及びその製造方法、並びに、それを用いた蛍光体、該蛍光体含有組成物、発光装置、照明装置、画像表示装置、焼結体及び顔料 |
| JP5637221B2 (ja) * | 2010-12-28 | 2014-12-10 | 宇部興産株式会社 | 多結晶シリコンインゴット鋳造用鋳型及びその製造方法並びに多結晶シリコンインゴット鋳造用鋳型の離型材用窒化珪素粉末及びそれを含有したスラリー |
| WO2012090541A1 (ja) * | 2010-12-28 | 2012-07-05 | 宇部興産株式会社 | 多結晶シリコンインゴット鋳造用鋳型及びその製造方法並びに多結晶シリコンインゴット鋳造用鋳型の離型材用窒化珪素粉末及びそれを含有したスラリー |
| JP6693575B2 (ja) * | 2016-12-12 | 2020-05-13 | 宇部興産株式会社 | 窒化ケイ素粉末、多結晶シリコンインゴット用離型剤及び多結晶シリコンインゴットの製造方法 |
| KR101901172B1 (ko) * | 2018-05-23 | 2018-09-27 | (주)존인피니티 | 전기절연성이 우수한 고열전도성 질화규소 세라믹스 기판 |
| WO2021117829A1 (ja) * | 2019-12-11 | 2021-06-17 | 宇部興産株式会社 | 板状の窒化ケイ素質焼結体およびその製造方法 |
| JP7640530B2 (ja) * | 2020-03-30 | 2025-03-05 | デンカ株式会社 | 窒化ケイ素粉末、及び窒化ケイ素焼結体の製造方法 |
| EP4397642A4 (en) * | 2021-09-03 | 2025-11-05 | Toshiba Kk | Sintered high-thermal conductive silicon nitride tablet, silicon nitride substrate, silicon nitride printed circuit board, and semiconducting device |
| EP4477633A4 (en) | 2022-03-31 | 2025-10-01 | Denka Company Ltd | SILICON NITRIDE POWDER AND METHOD FOR PRODUCING SAME AND SILICON NITRIDE SINTERED BODY AND METHOD FOR PRODUCING SAME |
| WO2024202733A1 (ja) * | 2023-03-31 | 2024-10-03 | 住友化学株式会社 | 窒化ケイ素粉末およびそれを用いた樹脂組成物 |
| JP2025156828A (ja) | 2024-04-02 | 2025-10-15 | デンカ株式会社 | 窒化ケイ素粉末 |
| JP2025156831A (ja) | 2024-04-02 | 2025-10-15 | デンカ株式会社 | 窒化ケイ素粉末 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0829923B2 (ja) * | 1989-12-07 | 1996-03-27 | 電気化学工業株式会社 | 窒化ケイ素粉末 |
| JP3501317B2 (ja) * | 1995-07-21 | 2004-03-02 | 日産自動車株式会社 | 高熱伝導率窒化ケイ素質焼結体および窒化ケイ素質焼結体製絶縁基板 |
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2004
- 2004-04-27 JP JP2004130790A patent/JP4089974B2/ja not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| JP2004262756A (ja) | 2004-09-24 |
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