JP4086222B2 - 耐熱熱伝導性熱圧着用シリコーンゴムシート - Google Patents

耐熱熱伝導性熱圧着用シリコーンゴムシート Download PDF

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Publication number
JP4086222B2
JP4086222B2 JP2002066422A JP2002066422A JP4086222B2 JP 4086222 B2 JP4086222 B2 JP 4086222B2 JP 2002066422 A JP2002066422 A JP 2002066422A JP 2002066422 A JP2002066422 A JP 2002066422A JP 4086222 B2 JP4086222 B2 JP 4086222B2
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JP
Japan
Prior art keywords
heat
silicone rubber
weight
conductive
thermocompression bonding
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Expired - Fee Related
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JP2002066422A
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English (en)
Japanese (ja)
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JP2003261769A (ja
Inventor
昭生 中野
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2002066422A priority Critical patent/JP4086222B2/ja
Priority to KR1020030014988A priority patent/KR100570249B1/ko
Priority to CNB031205569A priority patent/CN1233747C/zh
Priority to TW092105373A priority patent/TW200303898A/zh
Publication of JP2003261769A publication Critical patent/JP2003261769A/ja
Application granted granted Critical
Publication of JP4086222B2 publication Critical patent/JP4086222B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
JP2002066422A 2002-03-12 2002-03-12 耐熱熱伝導性熱圧着用シリコーンゴムシート Expired - Fee Related JP4086222B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002066422A JP4086222B2 (ja) 2002-03-12 2002-03-12 耐熱熱伝導性熱圧着用シリコーンゴムシート
KR1020030014988A KR100570249B1 (ko) 2002-03-12 2003-03-11 내열 열전도성 열압착용 실리콘 고무 시트
CNB031205569A CN1233747C (zh) 2002-03-12 2003-03-12 耐热热传导性热压合用硅橡胶片材
TW092105373A TW200303898A (en) 2002-03-12 2003-03-12 Heat-resistant silicone rubber sheet having thermal conductivity and thermocompression bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002066422A JP4086222B2 (ja) 2002-03-12 2002-03-12 耐熱熱伝導性熱圧着用シリコーンゴムシート

Publications (2)

Publication Number Publication Date
JP2003261769A JP2003261769A (ja) 2003-09-19
JP4086222B2 true JP4086222B2 (ja) 2008-05-14

Family

ID=28034897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002066422A Expired - Fee Related JP4086222B2 (ja) 2002-03-12 2002-03-12 耐熱熱伝導性熱圧着用シリコーンゴムシート

Country Status (4)

Country Link
JP (1) JP4086222B2 (enrdf_load_stackoverflow)
KR (1) KR100570249B1 (enrdf_load_stackoverflow)
CN (1) CN1233747C (enrdf_load_stackoverflow)
TW (1) TW200303898A (enrdf_load_stackoverflow)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3921459B2 (ja) * 2003-07-11 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 電気部品の実装方法及び実装装置
JP4739009B2 (ja) * 2005-12-19 2011-08-03 信越化学工業株式会社 耐熱熱伝導性熱圧着用シリコーンゴムシート
JP2007186544A (ja) * 2006-01-11 2007-07-26 Shin Etsu Chem Co Ltd 導電性シリコーンゴム組成物
JP4514058B2 (ja) * 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
CN100460741C (zh) * 2006-09-29 2009-02-11 王付冰 硅纤钛金不燃软接头
JP5058938B2 (ja) * 2008-10-22 2012-10-24 信越化学工業株式会社 熱圧着用シリコーンゴムシート
MY157233A (en) 2009-03-11 2016-05-13 Shinetsu Chemical Co Connection sheet for solar battery cell electrode, process for manufacturing solar cell module, and solar cell module
CN102061093A (zh) * 2010-11-18 2011-05-18 东莞市耀盛硅材料科技有限公司 耐高温硅橡胶及其制备方法
JP5853989B2 (ja) * 2013-05-16 2016-02-09 信越化学工業株式会社 リアクトル用熱伝導性シリコーン接着剤組成物及びリアクトル
JP2015170690A (ja) * 2014-03-06 2015-09-28 信越化学工業株式会社 Ｌｅｄチップ圧着用熱伝導性複合シート及びその製造方法
CN104371329A (zh) * 2014-06-26 2015-02-25 张庆成 含有氧化物的高分子碳浆及具有ptc效应的加热材料的制备方法
JP6194861B2 (ja) * 2014-07-28 2017-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーン成型物
CN104559936B (zh) * 2014-12-19 2017-12-29 武汉理工大学 一种中温用相变蓄热材料及其制备方法
CN108715067B (zh) * 2018-05-04 2020-06-23 京东方科技集团股份有限公司 缓冲材及热压工艺
KR102760484B1 (ko) * 2019-04-10 2025-02-03 헨켈 아게 운트 코. 카게아아 열 전도성 실리콘 포팅 조성물
JP7136065B2 (ja) * 2019-11-14 2022-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート
CN114276685A (zh) * 2021-12-13 2022-04-05 镇江中垒新材料科技有限公司 一种模组压合用新型硅胶热压缓冲材料及制备方法
CN115160790A (zh) * 2022-07-12 2022-10-11 苏州昌和应用材料有限公司 压合机用烧付铁板及其制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742408B2 (ja) * 1988-04-25 1995-05-10 東海カーボン株式会社 導電性シリコーンゴム組成物
JP3078155B2 (ja) * 1993-06-28 2000-08-21 信越化学工業株式会社 耐熱熱伝導性熱圧着シート
JP3041213B2 (ja) * 1994-12-26 2000-05-15 信越化学工業株式会社 耐熱熱伝導性シリコーンゴム複合シート

Also Published As

Publication number Publication date
KR100570249B1 (ko) 2006-04-12
CN1233747C (zh) 2005-12-28
KR20030074349A (ko) 2003-09-19
CN1443806A (zh) 2003-09-24
TW200303898A (en) 2003-09-16
JP2003261769A (ja) 2003-09-19
TWI302928B (enrdf_load_stackoverflow) 2008-11-11

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