JP4064218B2 - 半導体レーザ装置 - Google Patents
半導体レーザ装置 Download PDFInfo
- Publication number
- JP4064218B2 JP4064218B2 JP2002345572A JP2002345572A JP4064218B2 JP 4064218 B2 JP4064218 B2 JP 4064218B2 JP 2002345572 A JP2002345572 A JP 2002345572A JP 2002345572 A JP2002345572 A JP 2002345572A JP 4064218 B2 JP4064218 B2 JP 4064218B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- main surface
- laser device
- laser element
- stem
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1039—Details on the cavity length
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002345572A JP4064218B2 (ja) | 2002-11-28 | 2002-11-28 | 半導体レーザ装置 |
| US10/452,517 US6901093B2 (en) | 2002-11-28 | 2003-06-03 | Semiconductor laser device |
| TW092124852A TWI223483B (en) | 2002-11-28 | 2003-09-09 | Semiconductor laser apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002345572A JP4064218B2 (ja) | 2002-11-28 | 2002-11-28 | 半導体レーザ装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004179494A JP2004179494A (ja) | 2004-06-24 |
| JP2004179494A5 JP2004179494A5 (enExample) | 2005-07-21 |
| JP4064218B2 true JP4064218B2 (ja) | 2008-03-19 |
Family
ID=32376014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002345572A Expired - Lifetime JP4064218B2 (ja) | 2002-11-28 | 2002-11-28 | 半導体レーザ装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6901093B2 (enExample) |
| JP (1) | JP4064218B2 (enExample) |
| TW (1) | TWI223483B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005048421A1 (ja) * | 2003-11-14 | 2005-05-26 | Sanyo Electric Co., Ltd | 半導体レーザ装置 |
| KR100856280B1 (ko) * | 2004-05-25 | 2008-09-03 | 삼성전기주식회사 | 반도체 레이저 다이오드 패키지 |
| JP5100655B2 (ja) * | 2005-10-27 | 2012-12-19 | リモ パテントフェルヴァルトゥング ゲーエムベーハー ウント コー.カーゲー | 半導体レーザ装置 |
| JP4762729B2 (ja) * | 2006-01-13 | 2011-08-31 | シャープ株式会社 | 半導体レーザ素子の実装構造 |
| KR101929465B1 (ko) * | 2016-10-18 | 2019-03-14 | 주식회사 옵텔라 | 광학모듈 |
| JP7398877B2 (ja) * | 2019-04-18 | 2023-12-15 | 新光電気工業株式会社 | 半導体装置用ステム及び半導体装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5156999A (en) * | 1990-06-08 | 1992-10-20 | Wai-Hon Lee | Packaging method for semiconductor laser/detector devices |
| JPH0523563U (ja) * | 1991-07-17 | 1993-03-26 | ソニー株式会社 | 半導体レーザ装置 |
| JPH0727177U (ja) * | 1993-10-13 | 1995-05-19 | 東洋発條工業株式会社 | ヒートシンク |
| JP3239056B2 (ja) * | 1995-11-29 | 2001-12-17 | シャープ株式会社 | 半導体レーザ装置 |
| JPH1166590A (ja) | 1997-08-15 | 1999-03-09 | Toshiba Corp | 光集積ユニット、光ピックアップ装置およびdvdシステム |
| JP2000082865A (ja) * | 1998-09-04 | 2000-03-21 | Sony Corp | 半導体装置およびパッケージならびにそれらの製造方法 |
| JP3934828B2 (ja) * | 1999-06-30 | 2007-06-20 | 株式会社東芝 | 半導体レーザ装置 |
| JP2001160648A (ja) * | 1999-09-24 | 2001-06-12 | Mitsui Chemicals Inc | 半導体レーザ装置 |
| US6907054B2 (en) * | 2001-06-29 | 2005-06-14 | Sharp Kabushiki Kaisha | Semiconductor laser device |
| US6687272B2 (en) * | 2001-09-18 | 2004-02-03 | Kabushiki Kaisha Toshiba | Semiconductor laser device |
| JP3987716B2 (ja) * | 2001-12-10 | 2007-10-10 | シャープ株式会社 | 半導体レーザ装置およびその製造方法 |
-
2002
- 2002-11-28 JP JP2002345572A patent/JP4064218B2/ja not_active Expired - Lifetime
-
2003
- 2003-06-03 US US10/452,517 patent/US6901093B2/en not_active Expired - Lifetime
- 2003-09-09 TW TW092124852A patent/TWI223483B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200409424A (en) | 2004-06-01 |
| JP2004179494A (ja) | 2004-06-24 |
| TWI223483B (en) | 2004-11-01 |
| US6901093B2 (en) | 2005-05-31 |
| US20040105472A1 (en) | 2004-06-03 |
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