JP4036644B2 - Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス - Google Patents

Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス Download PDF

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Publication number
JP4036644B2
JP4036644B2 JP2001390544A JP2001390544A JP4036644B2 JP 4036644 B2 JP4036644 B2 JP 4036644B2 JP 2001390544 A JP2001390544 A JP 2001390544A JP 2001390544 A JP2001390544 A JP 2001390544A JP 4036644 B2 JP4036644 B2 JP 4036644B2
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Japan
Prior art keywords
optical
chip mounting
optical path
optical signal
mounting substrate
Prior art date
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Expired - Fee Related
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JP2001390544A
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English (en)
Japanese (ja)
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JP2002329891A (ja
JP2002329891A5 (enExample
Inventor
元雄 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP2001390544A priority Critical patent/JP4036644B2/ja
Publication of JP2002329891A publication Critical patent/JP2002329891A/ja
Publication of JP2002329891A5 publication Critical patent/JP2002329891A5/ja
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Publication of JP4036644B2 publication Critical patent/JP4036644B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Led Device Packages (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
JP2001390544A 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス Expired - Fee Related JP4036644B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001390544A JP4036644B2 (ja) 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000391550 2000-12-22
JP2000-391550 2000-12-22
JP2001390544A JP4036644B2 (ja) 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス

Publications (3)

Publication Number Publication Date
JP2002329891A JP2002329891A (ja) 2002-11-15
JP2002329891A5 JP2002329891A5 (enExample) 2005-07-14
JP4036644B2 true JP4036644B2 (ja) 2008-01-23

Family

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Family Applications (1)

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JP2001390544A Expired - Fee Related JP4036644B2 (ja) 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス

Country Status (1)

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JP (1) JP4036644B2 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1754986B1 (en) * 2002-04-01 2012-12-05 Ibiden Co., Ltd. Optical communication device and optical communication device manufacturing method
US7070207B2 (en) 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
JPWO2004095093A1 (ja) * 2003-04-23 2006-07-13 太陽インキ製造株式会社 光導波路、光電気混載基板および該光電気混載基板の製造方法
JP2005079385A (ja) * 2003-09-01 2005-03-24 Toshiba Corp 光半導体装置および光信号入出力装置
EP1688770B1 (en) * 2003-11-27 2012-11-14 Ibiden Co., Ltd. Ic chip mounting board, substrate for mother board, device for optical communication, method for manufacturing substrate for mounting ic chip thereon, and method for manufacturing substrate for mother board
CA2572920C (en) * 2004-07-08 2014-04-08 Dow Corning Corporation Short reach optical interconnect
DE102004038591A1 (de) * 2004-08-06 2006-02-23 Robert Bosch Gmbh Schnittstellenbaustein
JP2006120956A (ja) 2004-10-22 2006-05-11 Ibiden Co Ltd 多層プリント配線板
JP4646618B2 (ja) * 2004-12-20 2011-03-09 イビデン株式会社 光路変換部材、多層プリント配線板および光通信用デバイス
JP4797407B2 (ja) * 2005-02-07 2011-10-19 日立化成工業株式会社 配線基板の製造方法、半導体チップ搭載基板の製造方法及び半導体パッケージの製造方法
JP4810958B2 (ja) * 2005-02-28 2011-11-09 ソニー株式会社 ハイブリット回路装置
TWI290820B (en) * 2005-10-13 2007-12-01 Phoenix Prec Technology Corp Circuit board structure of integrated optoelectronic component
US7674987B2 (en) 2007-03-29 2010-03-09 Ibiden Co., Ltd. Multilayer printed circuit board
US7919849B2 (en) 2007-04-04 2011-04-05 Ibiden Co., Ltd. Package substrate and device for optical communication
US7783141B2 (en) 2007-04-04 2010-08-24 Ibiden Co., Ltd. Substrate for mounting IC chip and device for optical communication
JP4767228B2 (ja) * 2007-07-30 2011-09-07 京セラ株式会社 光伝送基板とその製造方法、光伝送装置、複合光伝送基板および光電気混載基板
JP5058006B2 (ja) * 2008-01-30 2012-10-24 京セラ株式会社 光伝送基板の製造方法
JP5149759B2 (ja) * 2008-10-01 2013-02-20 日本特殊陶業株式会社 光導波路付き配線基板の製造方法
SE533551C2 (sv) * 2009-02-12 2010-10-26 Senseair Ab En ljusdetektor anpassad att som diskret enhet fästas på en bärare
JP5493744B2 (ja) * 2009-11-12 2014-05-14 富士通株式会社 光電気混載基板、および、光電気混載基板の製造方法
JP5704878B2 (ja) * 2010-09-30 2015-04-22 オリンパス株式会社 光電気変換コネクタ、光伝送モジュール、撮像装置および内視鏡
JP2013054369A (ja) * 2012-10-23 2013-03-21 Ngk Spark Plug Co Ltd 光導波路付き配線基板
JP2022191844A (ja) 2021-06-16 2022-12-28 イビデン株式会社 半導体パッケージ
JP2023038405A (ja) 2021-09-07 2023-03-17 イビデン株式会社 半導体パッケージ

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