JP4028163B2 - メカノケミカル研磨方法及びメカノケミカル研磨装置 - Google Patents

メカノケミカル研磨方法及びメカノケミカル研磨装置 Download PDF

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Publication number
JP4028163B2
JP4028163B2 JP2000259116A JP2000259116A JP4028163B2 JP 4028163 B2 JP4028163 B2 JP 4028163B2 JP 2000259116 A JP2000259116 A JP 2000259116A JP 2000259116 A JP2000259116 A JP 2000259116A JP 4028163 B2 JP4028163 B2 JP 4028163B2
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Japan
Prior art keywords
polishing
cloth
mechanochemical
silicon carbide
abrasive grains
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Expired - Lifetime
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JP2000259116A
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English (en)
Japanese (ja)
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JP2001205555A5 (enExample
JP2001205555A (ja
Inventor
正樹 松井
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Denso Corp
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Denso Corp
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Publication date
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Priority to JP2000259116A priority Critical patent/JP4028163B2/ja
Priority to US09/709,454 priority patent/US6835120B1/en
Publication of JP2001205555A publication Critical patent/JP2001205555A/ja
Publication of JP2001205555A5 publication Critical patent/JP2001205555A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
    • H01L21/0475—Changing the shape of the semiconductor body, e.g. forming recesses

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2000259116A 1999-11-16 2000-08-29 メカノケミカル研磨方法及びメカノケミカル研磨装置 Expired - Lifetime JP4028163B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000259116A JP4028163B2 (ja) 1999-11-16 2000-08-29 メカノケミカル研磨方法及びメカノケミカル研磨装置
US09/709,454 US6835120B1 (en) 1999-11-16 2000-11-13 Method and apparatus for mechanochemical polishing

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-325437 1999-11-16
JP32543799 1999-11-16
JP2000259116A JP4028163B2 (ja) 1999-11-16 2000-08-29 メカノケミカル研磨方法及びメカノケミカル研磨装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006003055A Division JP4345746B2 (ja) 1999-11-16 2006-01-10 メカノケミカル研磨装置

Publications (3)

Publication Number Publication Date
JP2001205555A JP2001205555A (ja) 2001-07-31
JP2001205555A5 JP2001205555A5 (enExample) 2005-10-27
JP4028163B2 true JP4028163B2 (ja) 2007-12-26

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US (1) US6835120B1 (enExample)
JP (1) JP4028163B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025188982A1 (en) * 2024-03-07 2025-09-12 Wolfspeed, Inc. Disc grinding for semiconductor wafers on polishing system

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JP4827963B2 (ja) * 2009-12-11 2011-11-30 国立大学法人九州大学 炭化珪素の研磨液及びその研磨方法
JP2011218494A (ja) * 2010-04-09 2011-11-04 Mitsui Mining & Smelting Co Ltd 研摩スラリー及びその研摩方法
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JP6475518B2 (ja) * 2015-03-03 2019-02-27 株式会社ディスコ ウエーハの加工方法
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CN109822454B (zh) * 2019-03-27 2023-11-10 西南交通大学 一种模块化设计的自供紫外光源的绿色节能抛光头装置
CN110524408A (zh) * 2019-09-12 2019-12-03 江苏吉星新材料有限公司 一种蓝宝石晶片研磨方法
JP7528681B2 (ja) * 2020-09-29 2024-08-06 住友金属鉱山株式会社 ＳｉＣ多結晶基板の研磨方法
CN114300401A (zh) * 2020-09-30 2022-04-08 广东晶相光电科技有限公司 一种发光二极管及其应用
CN113524025B (zh) * 2021-07-30 2023-04-28 河南科技学院 一种SiC单晶片抛光方法
CN116285698A (zh) * 2023-02-02 2023-06-23 浙江兆晶新材料科技有限公司 一种用于碳化硅晶片抛光液的组合物、抛光液及其制备方法和应用
CN117567942A (zh) * 2023-11-08 2024-02-20 深圳平湖实验室 抛光液及其制备方法与应用
CN119260483B (zh) * 2024-12-06 2025-09-30 浙江大学杭州国际科创中心 碳化硅晶锭的加工方法和碳化硅衬底的加工方法

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Publication number Priority date Publication date Assignee Title
WO2025188982A1 (en) * 2024-03-07 2025-09-12 Wolfspeed, Inc. Disc grinding for semiconductor wafers on polishing system

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US6835120B1 (en) 2004-12-28
JP2001205555A (ja) 2001-07-31

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