JP2001205555A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001205555A5 JP2001205555A5 JP2000259116A JP2000259116A JP2001205555A5 JP 2001205555 A5 JP2001205555 A5 JP 2001205555A5 JP 2000259116 A JP2000259116 A JP 2000259116A JP 2000259116 A JP2000259116 A JP 2000259116A JP 2001205555 A5 JP2001205555 A5 JP 2001205555A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000259116A JP4028163B2 (ja) | 1999-11-16 | 2000-08-29 | メカノケミカル研磨方法及びメカノケミカル研磨装置 |
| US09/709,454 US6835120B1 (en) | 1999-11-16 | 2000-11-13 | Method and apparatus for mechanochemical polishing |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32543799 | 1999-11-16 | ||
| JP11-325437 | 1999-11-16 | ||
| JP2000259116A JP4028163B2 (ja) | 1999-11-16 | 2000-08-29 | メカノケミカル研磨方法及びメカノケミカル研磨装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006003055A Division JP4345746B2 (ja) | 1999-11-16 | 2006-01-10 | メカノケミカル研磨装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001205555A JP2001205555A (ja) | 2001-07-31 |
| JP2001205555A5 true JP2001205555A5 (enExample) | 2005-10-27 |
| JP4028163B2 JP4028163B2 (ja) | 2007-12-26 |
Family
ID=26571822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000259116A Expired - Lifetime JP4028163B2 (ja) | 1999-11-16 | 2000-08-29 | メカノケミカル研磨方法及びメカノケミカル研磨装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6835120B1 (enExample) |
| JP (1) | JP4028163B2 (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100905266B1 (ko) * | 2000-12-01 | 2009-06-29 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| US20040134418A1 (en) * | 2002-11-08 | 2004-07-15 | Taisuke Hirooka | SiC substrate and method of manufacturing the same |
| JP2005001018A (ja) * | 2003-06-09 | 2005-01-06 | Kao Corp | 基板の製造方法 |
| JP4986099B2 (ja) * | 2003-06-09 | 2012-07-25 | 花王株式会社 | 基板の製造方法 |
| DE102004010379A1 (de) * | 2004-03-03 | 2005-09-22 | Schott Ag | Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer und damit erhaltene elektronische Bauteile |
| EP1735826A4 (en) * | 2004-04-08 | 2010-08-18 | Ii Vi Inc | CHEMICAL-MECHANICAL POLICY OF SIC SURFACES USING HYDROGEN PEROXIDE OR OZONE WATER SOLUTION IN CONNECTION WITH COLLOIDAL POLISHING AGENT |
| US20060108325A1 (en) * | 2004-11-19 | 2006-05-25 | Everson William J | Polishing process for producing damage free surfaces on semi-insulating silicon carbide wafers |
| JP2006224252A (ja) * | 2005-02-18 | 2006-08-31 | Kumamoto Univ | 研磨装置 |
| JP2008006559A (ja) * | 2006-06-30 | 2008-01-17 | Hitachi Maxell Ltd | 鏡面加工方法、および鏡面加工用の加工体 |
| EP2381008A2 (en) * | 2006-08-28 | 2011-10-26 | Osaka University | Catalyst-aided chemical processing method and apparatus |
| JP4982742B2 (ja) * | 2006-09-13 | 2012-07-25 | 国立大学法人 熊本大学 | 磁性微粒子を用いた触媒化学加工方法及び装置 |
| US7781312B2 (en) * | 2006-12-13 | 2010-08-24 | General Electric Company | Silicon carbide devices and method of making |
| JP5095228B2 (ja) | 2007-01-23 | 2012-12-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP5315573B2 (ja) * | 2007-10-12 | 2013-10-16 | 国立大学法人 熊本大学 | 加工装置および加工方法 |
| CN101422872B (zh) * | 2007-10-30 | 2010-05-26 | 昆明市凯跃机电塑料有限责任公司 | 一种气浮式机械抛光方法 |
| JP4732423B2 (ja) * | 2007-11-13 | 2011-07-27 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| US20090148606A1 (en) * | 2007-12-07 | 2009-06-11 | Lenzsavers, Llc | Compositions and methods for restoring plastic covers and lenses |
| US8580346B2 (en) * | 2007-12-07 | 2013-11-12 | Pcw Holdings, Llc | Compositions and methods for restoring aircraft windows and other plastic surfaces |
| AU2009338803B2 (en) * | 2009-01-30 | 2015-06-04 | Pcw Holdings, Llc | Compositions and methods for restoring plastic covers and lenses |
| WO2010090024A1 (ja) | 2009-02-04 | 2010-08-12 | 日立金属株式会社 | 炭化珪素単結晶基板およびその製造方法 |
| JP5364959B2 (ja) * | 2009-03-27 | 2013-12-11 | 国立大学法人大阪大学 | 研磨方法及び研磨装置 |
| US9368367B2 (en) * | 2009-04-13 | 2016-06-14 | Sinmat, Inc. | Chemical mechanical polishing of silicon carbide comprising surfaces |
| JP4827963B2 (ja) * | 2009-12-11 | 2011-11-30 | 国立大学法人九州大学 | 炭化珪素の研磨液及びその研磨方法 |
| JP2011218494A (ja) * | 2010-04-09 | 2011-11-04 | Mitsui Mining & Smelting Co Ltd | 研摩スラリー及びその研摩方法 |
| JP5236687B2 (ja) * | 2010-05-26 | 2013-07-17 | 兵庫県 | 表面処理方法及び表面処理装置 |
| US8778203B2 (en) * | 2010-05-28 | 2014-07-15 | Clarkson University | Tunable polish rates by varying dissolved oxygen content |
| KR101222764B1 (ko) * | 2010-11-04 | 2013-01-15 | 조희태 | 자동차 유리의 흠집제거방법 |
| US8574032B2 (en) | 2011-03-22 | 2013-11-05 | Pcw Holdings, Llc | UV protective coating composition and method |
| US8828874B2 (en) * | 2011-03-28 | 2014-09-09 | Sinmat, Inc. | Chemical mechanical polishing of group III-nitride surfaces |
| JP5743800B2 (ja) * | 2011-08-15 | 2015-07-01 | 新日鉄住金マテリアルズ株式会社 | ＳｉＣウェハの製造方法 |
| CN103890127B (zh) | 2011-10-13 | 2015-09-09 | 三井金属矿业株式会社 | 研磨剂浆料及研磨方法 |
| JP5400228B1 (ja) * | 2012-04-27 | 2014-01-29 | 三井金属鉱業株式会社 | ＳｉＣ単結晶基板 |
| JP6016301B2 (ja) * | 2013-02-13 | 2016-10-26 | 昭和電工株式会社 | 単結晶ＳｉＣ基板の表面加工方法、その製造方法及び単結晶ＳｉＣ基板の表面加工用研削プレート |
| KR20150060358A (ko) * | 2013-11-26 | 2015-06-03 | 삼성디스플레이 주식회사 | 기판 절단 및 강화 장치, 기판의 절단 및 강화 방법 |
| JP6381068B2 (ja) * | 2014-04-08 | 2018-08-29 | 山口精研工業株式会社 | 炭化ケイ素基板研磨用組成物 |
| JP6475518B2 (ja) * | 2015-03-03 | 2019-02-27 | 株式会社ディスコ | ウエーハの加工方法 |
| CN109195745B (zh) | 2016-06-01 | 2021-02-05 | 富士纺控股株式会社 | 研磨垫及其制造方法、以及研磨物的制造方法 |
| CN109822454B (zh) * | 2019-03-27 | 2023-11-10 | 西南交通大学 | 一种模块化设计的自供紫外光源的绿色节能抛光头装置 |
| CN110524408A (zh) * | 2019-09-12 | 2019-12-03 | 江苏吉星新材料有限公司 | 一种蓝宝石晶片研磨方法 |
| JP7528681B2 (ja) * | 2020-09-29 | 2024-08-06 | 住友金属鉱山株式会社 | ＳｉＣ多結晶基板の研磨方法 |
| CN217361526U (zh) * | 2020-09-30 | 2022-09-02 | 广东晶相光电科技有限公司 | 一种发光二极管及发光二极管显示器 |
| CN113524025B (zh) * | 2021-07-30 | 2023-04-28 | 河南科技学院 | 一种SiC单晶片抛光方法 |
| CN116285698A (zh) * | 2023-02-02 | 2023-06-23 | 浙江兆晶新材料科技有限公司 | 一种用于碳化硅晶片抛光液的组合物、抛光液及其制备方法和应用 |
| CN117567942A (zh) * | 2023-11-08 | 2024-02-20 | 深圳平湖实验室 | 抛光液及其制备方法与应用 |
| US20250282021A1 (en) * | 2024-03-07 | 2025-09-11 | Wolfspeed, Inc. | Disc Grinding for Semiconductor Wafers on Polishing System |
| CN119260483B (zh) * | 2024-12-06 | 2025-09-30 | 浙江大学杭州国际科创中心 | 碳化硅晶锭的加工方法和碳化硅衬底的加工方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4343116A (en) * | 1979-07-26 | 1982-08-10 | Pilkington Brothers Limited | Processes for finishing glass surfaces |
| JPS5623746A (en) | 1979-08-01 | 1981-03-06 | Matsushita Electronics Corp | Manufacture of semiconductor device |
| JPH06333892A (ja) | 1993-03-22 | 1994-12-02 | Fuji Electric Corp Res & Dev Ltd | 電子デバイス |
| US5554064A (en) * | 1993-08-06 | 1996-09-10 | Intel Corporation | Orbital motion chemical-mechanical polishing apparatus and method of fabrication |
| US5658183A (en) * | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| JPH0780770A (ja) | 1993-09-14 | 1995-03-28 | Nippon Steel Corp | 炭化珪素単結晶のメカノケミカルポリシング方法 |
| US6236542B1 (en) | 1994-01-21 | 2001-05-22 | International Business Machines Corporation | Substrate independent superpolishing process and slurry |
| JP3185535B2 (ja) | 1994-04-15 | 2001-07-11 | 富士電機株式会社 | 電子デバイスおよびその製造方法 |
| JPH0822503A (ja) | 1994-07-06 | 1996-01-23 | Sanyo Electric Co Ltd | 遠隔診療支援システム |
| JP3734289B2 (ja) * | 1995-01-24 | 2006-01-11 | 株式会社荏原製作所 | ポリッシング装置 |
| US5674107A (en) * | 1995-04-25 | 1997-10-07 | Lucent Technologies Inc. | Diamond polishing method and apparatus employing oxygen-emitting medium |
| JP3042593B2 (ja) * | 1995-10-25 | 2000-05-15 | 日本電気株式会社 | 研磨パッド |
| US5904611A (en) * | 1996-05-10 | 1999-05-18 | Canon Kabushiki Kaisha | Precision polishing apparatus |
| US6012966A (en) * | 1996-05-10 | 2000-01-11 | Canon Kabushiki Kaisha | Precision polishing apparatus with detecting means |
| JP2865061B2 (ja) * | 1996-06-27 | 1999-03-08 | 日本電気株式会社 | 研磨パッドおよび研磨装置ならびに半導体装置の製造方法 |
| JP3507628B2 (ja) | 1996-08-06 | 2004-03-15 | 昭和電工株式会社 | 化学的機械研磨用研磨組成物 |
| JP3672685B2 (ja) * | 1996-11-29 | 2005-07-20 | 松下電器産業株式会社 | 研磨方法及び研磨装置 |
| US5816900A (en) * | 1997-07-17 | 1998-10-06 | Lsi Logic Corporation | Apparatus for polishing a substrate at radially varying polish rates |
| US5997392A (en) * | 1997-07-22 | 1999-12-07 | International Business Machines Corporation | Slurry injection technique for chemical-mechanical polishing |
| US5931718A (en) * | 1997-09-30 | 1999-08-03 | The Board Of Regents Of Oklahoma State University | Magnetic float polishing processes and materials therefor |
| JP3075352B2 (ja) * | 1998-04-15 | 2000-08-14 | 日本電気株式会社 | 化学的機械研磨液の供給方法および装置 |
| US6270395B1 (en) * | 1998-09-24 | 2001-08-07 | Alliedsignal, Inc. | Oxidizing polishing slurries for low dielectric constant materials |
| US6293851B1 (en) * | 1998-11-06 | 2001-09-25 | Beaver Creek Concepts Inc | Fixed abrasive finishing method using lubricants |
| US6077151A (en) * | 1999-05-17 | 2000-06-20 | Vlsi Technology, Inc. | Temperature control carrier head for chemical mechanical polishing process |
-
2000
- 2000-08-29 JP JP2000259116A patent/JP4028163B2/ja not_active Expired - Lifetime
- 2000-11-13 US US09/709,454 patent/US6835120B1/en not_active Expired - Lifetime