JP4017463B2 - 洗浄方法 - Google Patents

洗浄方法 Download PDF

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Publication number
JP4017463B2
JP4017463B2 JP2002202812A JP2002202812A JP4017463B2 JP 4017463 B2 JP4017463 B2 JP 4017463B2 JP 2002202812 A JP2002202812 A JP 2002202812A JP 2002202812 A JP2002202812 A JP 2002202812A JP 4017463 B2 JP4017463 B2 JP 4017463B2
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JP
Japan
Prior art keywords
cleaning
semiconductor substrate
liquid
wall
cup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002202812A
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English (en)
Japanese (ja)
Other versions
JP2004047714A5 (https=
JP2004047714A (ja
Inventor
亮介 米倉
由紀子 西岡
光雄 宮下
義一 有賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2002202812A priority Critical patent/JP4017463B2/ja
Priority to US10/614,295 priority patent/US7264681B2/en
Publication of JP2004047714A publication Critical patent/JP2004047714A/ja
Publication of JP2004047714A5 publication Critical patent/JP2004047714A5/ja
Priority to US11/882,565 priority patent/US20080000509A1/en
Application granted granted Critical
Publication of JP4017463B2 publication Critical patent/JP4017463B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Surface Treatment Of Glass (AREA)
JP2002202812A 2002-07-11 2002-07-11 洗浄方法 Expired - Lifetime JP4017463B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002202812A JP4017463B2 (ja) 2002-07-11 2002-07-11 洗浄方法
US10/614,295 US7264681B2 (en) 2002-07-11 2003-07-08 Cleaning apparatus and cleaning method
US11/882,565 US20080000509A1 (en) 2002-07-11 2007-08-02 Cleaning apparatus and cleaning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002202812A JP4017463B2 (ja) 2002-07-11 2002-07-11 洗浄方法

Publications (3)

Publication Number Publication Date
JP2004047714A JP2004047714A (ja) 2004-02-12
JP2004047714A5 JP2004047714A5 (https=) 2005-07-21
JP4017463B2 true JP4017463B2 (ja) 2007-12-05

Family

ID=31708898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002202812A Expired - Lifetime JP4017463B2 (ja) 2002-07-11 2002-07-11 洗浄方法

Country Status (2)

Country Link
US (2) US7264681B2 (https=)
JP (1) JP4017463B2 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8316866B2 (en) * 2003-06-27 2012-11-27 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US6936540B2 (en) * 2003-09-18 2005-08-30 Micron Technology, Inc. Method of polishing a semiconductor substrate, post-CMP cleaning process, and method of cleaning residue from registration alignment markings
JP4691887B2 (ja) * 2004-03-04 2011-06-01 パナソニック株式会社 パターンの形成方法、パターンの形成装置およびプラズマディスプレイ用部材の製造方法
US20060157080A1 (en) * 2005-01-20 2006-07-20 Teng-Chun Tsai Cleaning method for semiconductor wafer
EP2428557A1 (en) * 2005-12-30 2012-03-14 LAM Research Corporation Cleaning solution
JP5220447B2 (ja) * 2008-03-17 2013-06-26 東京エレクトロン株式会社 基板処理システムの洗浄方法、記憶媒体及び基板処理システム
CA2767860C (en) 2009-07-14 2018-06-12 Temple University Of The Commonwealth System Of Higher Education Serum markers associated with early and other stages of breast cancer
JP5864232B2 (ja) * 2011-02-01 2016-02-17 東京エレクトロン株式会社 液処理装置および液処理方法
JP6295023B2 (ja) 2012-10-03 2018-03-14 株式会社荏原製作所 基板洗浄装置、基板洗浄方法、および研磨装置
CN103977973B (zh) * 2014-05-09 2016-10-05 欧蒙医学诊断（中国）有限公司 一种载片清洗装置和方法
US10155252B2 (en) * 2015-04-30 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and washing method
JP7058550B2 (ja) * 2018-05-16 2022-04-22 東京エレクトロン株式会社 現像処理装置および現像処理方法
CN110355157A (zh) * 2019-07-29 2019-10-22 南京诺尔曼生物技术有限公司 加样针清洗装置以及组件
CN112588680B (zh) * 2020-12-16 2022-04-22 无锡先导智能装备股份有限公司 清洗装置及清洗设备
KR20240166560A (ko) * 2022-04-05 2024-11-26 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 및 기판 처리 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3990462A (en) * 1975-05-19 1976-11-09 Fluoroware Systems Corporation Substrate stripping and cleaning apparatus
US4161356A (en) * 1977-01-21 1979-07-17 Burchard John S Apparatus for in-situ processing of photoplates
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
JPS63173327A (ja) * 1987-01-13 1988-07-16 Nec Corp 半導体装置の製造装置
JPH04196425A (ja) * 1990-11-28 1992-07-16 Sigma Merutetsuku Kk 薬液処理装置
KR0155390B1 (ko) * 1991-05-08 1998-12-01 이노우에 아키라 세정 장치
JPH08323302A (ja) 1995-05-29 1996-12-10 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3414916B2 (ja) * 1996-02-27 2003-06-09 大日本スクリーン製造株式会社 基板処理装置および方法
JPH09290199A (ja) * 1996-04-25 1997-11-11 Dainippon Screen Mfg Co Ltd カップ洗浄装置および回転式基板処理装置
JPH10144599A (ja) * 1996-11-11 1998-05-29 Tokyo Electron Ltd 回転処理装置およびその洗浄方法
JPH10199852A (ja) * 1997-01-13 1998-07-31 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JPH11283948A (ja) * 1998-03-27 1999-10-15 Dainippon Screen Mfg Co Ltd 基板回転処理装置
JP2000114219A (ja) * 1998-10-06 2000-04-21 Toshiba Corp 基板処理装置
US6290865B1 (en) * 1998-11-30 2001-09-18 Applied Materials, Inc. Spin-rinse-drying process for electroplated semiconductor wafers
JP3587723B2 (ja) * 1999-04-30 2004-11-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2000334395A (ja) * 1999-05-31 2000-12-05 Ebara Corp 洗浄装置
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
JP2002009035A (ja) * 2000-06-26 2002-01-11 Toshiba Corp 基板洗浄方法及び基板洗浄装置

Also Published As

Publication number Publication date
US20080000509A1 (en) 2008-01-03
JP2004047714A (ja) 2004-02-12
US7264681B2 (en) 2007-09-04
US20040065352A1 (en) 2004-04-08

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