JP4016326B2 - 無電解スズメッキ浴 - Google Patents

無電解スズメッキ浴 Download PDF

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Publication number
JP4016326B2
JP4016326B2 JP2002226530A JP2002226530A JP4016326B2 JP 4016326 B2 JP4016326 B2 JP 4016326B2 JP 2002226530 A JP2002226530 A JP 2002226530A JP 2002226530 A JP2002226530 A JP 2002226530A JP 4016326 B2 JP4016326 B2 JP 4016326B2
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Japan
Prior art keywords
acid
sulfonic acid
plating bath
tin plating
electroless tin
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Expired - Fee Related
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JP2002226530A
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English (en)
Japanese (ja)
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JP2004068056A (ja
JP2004068056A5 (enExample
Inventor
岡田  隆
祥哉 伊内
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Ishihara Chemical Co Ltd
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Ishihara Chemical Co Ltd
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Priority to JP2002226530A priority Critical patent/JP4016326B2/ja
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Publication of JP2004068056A5 publication Critical patent/JP2004068056A5/ja
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JP2002226530A 2002-08-02 2002-08-02 無電解スズメッキ浴 Expired - Fee Related JP4016326B2 (ja)

Priority Applications (1)

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JP2002226530A JP4016326B2 (ja) 2002-08-02 2002-08-02 無電解スズメッキ浴

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JP2002226530A JP4016326B2 (ja) 2002-08-02 2002-08-02 無電解スズメッキ浴

Publications (3)

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JP2004068056A JP2004068056A (ja) 2004-03-04
JP2004068056A5 JP2004068056A5 (enExample) 2005-06-16
JP4016326B2 true JP4016326B2 (ja) 2007-12-05

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JP2002226530A Expired - Fee Related JP4016326B2 (ja) 2002-08-02 2002-08-02 無電解スズメッキ浴

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102994985A (zh) * 2011-09-14 2013-03-27 罗门哈斯电子材料有限公司 除去镀液中杂质的方法
US10155894B2 (en) 2014-07-07 2018-12-18 Honeywell International Inc. Thermal interface material with ion scavenger
US10174433B2 (en) 2013-12-05 2019-01-08 Honeywell International Inc. Stannous methanesulfonate solution with adjusted pH
US10287471B2 (en) 2014-12-05 2019-05-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5715411B2 (ja) * 2010-12-28 2015-05-07 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
JP5830242B2 (ja) * 2010-12-28 2015-12-09 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
EP2476779B1 (en) * 2011-01-13 2013-03-20 Atotech Deutschland GmbH Immersion tin or tin alloy plating bath with improved removal of cupurous ions
CN110735132A (zh) * 2019-10-18 2020-01-31 北京曙光航空电气有限责任公司 一种金属表面的镀锡方法
CN115404471B (zh) * 2022-08-30 2023-07-04 江西住井新材料有限公司 一种无电解镀锡溶液及应用

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102994985A (zh) * 2011-09-14 2013-03-27 罗门哈斯电子材料有限公司 除去镀液中杂质的方法
US10174433B2 (en) 2013-12-05 2019-01-08 Honeywell International Inc. Stannous methanesulfonate solution with adjusted pH
US10155894B2 (en) 2014-07-07 2018-12-18 Honeywell International Inc. Thermal interface material with ion scavenger
US10428257B2 (en) 2014-07-07 2019-10-01 Honeywell International Inc. Thermal interface material with ion scavenger
US10287471B2 (en) 2014-12-05 2019-05-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Also Published As

Publication number Publication date
JP2004068056A (ja) 2004-03-04

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