JP4008494B2 - 集積回路ウエハ移送アセンブリ用のドッキング・環境パージ装置 - Google Patents

集積回路ウエハ移送アセンブリ用のドッキング・環境パージ装置 Download PDF

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Publication number
JP4008494B2
JP4008494B2 JP50668497A JP50668497A JP4008494B2 JP 4008494 B2 JP4008494 B2 JP 4008494B2 JP 50668497 A JP50668497 A JP 50668497A JP 50668497 A JP50668497 A JP 50668497A JP 4008494 B2 JP4008494 B2 JP 4008494B2
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Japan
Prior art keywords
docking
door
container
purge
environment
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Expired - Fee Related
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JP50668497A
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English (en)
Japanese (ja)
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JPH11509688A (ja
JPH11509688A5 (enExample
Inventor
グレン エイ ジュニア ロバーソン
ロバート エム ジェンコ
ジー カイル マンド
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Asyst Technologies Inc
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Asyst Technologies Inc
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Publication date
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Publication of JPH11509688A publication Critical patent/JPH11509688A/ja
Publication of JPH11509688A5 publication Critical patent/JPH11509688A5/ja
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Publication of JP4008494B2 publication Critical patent/JP4008494B2/ja
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
JP50668497A 1995-07-18 1996-06-26 集積回路ウエハ移送アセンブリ用のドッキング・環境パージ装置 Expired - Fee Related JP4008494B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/503,677 1995-07-18
US08/503,677 US5674123A (en) 1995-07-18 1995-07-18 Docking and environmental purging system for integrated circuit wafer transport assemblies
PCT/US1996/010930 WO1997004479A1 (en) 1995-07-18 1996-06-26 Docking and environmental purging system for integrated circuit wafer transport assemblies

Publications (3)

Publication Number Publication Date
JPH11509688A JPH11509688A (ja) 1999-08-24
JPH11509688A5 JPH11509688A5 (enExample) 2004-08-12
JP4008494B2 true JP4008494B2 (ja) 2007-11-14

Family

ID=24003066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50668497A Expired - Fee Related JP4008494B2 (ja) 1995-07-18 1996-06-26 集積回路ウエハ移送アセンブリ用のドッキング・環境パージ装置

Country Status (8)

Country Link
US (3) US5674123A (enExample)
EP (1) EP0839385A1 (enExample)
JP (1) JP4008494B2 (enExample)
KR (1) KR100281942B1 (enExample)
CN (1) CN1191039A (enExample)
AU (1) AU6396296A (enExample)
TW (1) TW304902B (enExample)
WO (1) WO1997004479A1 (enExample)

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US6942738B1 (en) 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US6723174B2 (en) 1996-03-26 2004-04-20 Semitool, Inc. Automated semiconductor processing system
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
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TW393741B (en) * 1997-08-11 2000-06-11 Ind Tech Res Inst An automated picking and placing method for IC packing processes of magazine covering plate
US5900047A (en) * 1997-11-26 1999-05-04 Sony Corporation Exhaust system for a semiconductor etcher that utilizes corrosive gas
DE19805624A1 (de) * 1998-02-12 1999-09-23 Acr Automation In Cleanroom Schleuse zum Öffnen und Schließen von Reinraumtransport-Boxen
US6106213A (en) 1998-02-27 2000-08-22 Pri Automation, Inc. Automated door assembly for use in semiconductor wafer manufacturing
NL1009327C2 (nl) * 1998-06-05 1999-12-10 Asm Int Werkwijze en inrichting voor het overbrengen van wafers.
US6261044B1 (en) * 1998-08-06 2001-07-17 Asyst Technologies, Inc. Pod to port door retention and evacuation system
US6041817A (en) * 1998-08-21 2000-03-28 Fairchild Semiconductor Corp. Processing system having vacuum manifold isolation
US6249990B1 (en) * 1999-03-23 2001-06-26 Alliedsignal, Inc. Method and apparatus for transporting articles
DE19913886A1 (de) * 1999-03-26 2000-09-28 Siemens Ag Anlage zur Fertigung von Halbleiterprodukten
JP2000286319A (ja) * 1999-03-31 2000-10-13 Canon Inc 基板搬送方法および半導体製造装置
AU2001268656A1 (en) * 2000-07-07 2002-01-21 Semitool, Inc. Automated processing system
US6660055B2 (en) * 2001-10-25 2003-12-09 Asm Technology Singapore Pte Ltd. Compartment for maintaining a clean production environment
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US7578647B2 (en) 2003-01-27 2009-08-25 Applied Materials, Inc. Load port configurations for small lot size substrate carriers
US7611318B2 (en) 2003-01-27 2009-11-03 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
US7203563B2 (en) * 2004-04-08 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic N2 purge system for 300 mm full automation fab
FR2874744B1 (fr) * 2004-08-30 2006-11-24 Cit Alcatel Interface sous vide entre une boite de mini-environnement et un equipement
JP2008546191A (ja) * 2005-06-03 2008-12-18 シーエスジー ソーラー アクチェンゲゼルシャフト 薄膜シリコン・オン・グラスの水素化装置およびその方法
US11024527B2 (en) 2005-06-18 2021-06-01 Frederick A. Flitsch Methods and apparatus for novel fabricators with Cleanspace
US10627809B2 (en) 2005-06-18 2020-04-21 Frederick A. Flitsch Multilevel fabricators
US9339900B2 (en) 2005-08-18 2016-05-17 Futrfab, Inc. Apparatus to support a cleanspace fabricator
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US9059227B2 (en) 2005-06-18 2015-06-16 Futrfab, Inc. Methods and apparatus for vertically orienting substrate processing tools in a clean space
US9159592B2 (en) 2005-06-18 2015-10-13 Futrfab, Inc. Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
US7513822B2 (en) 2005-06-18 2009-04-07 Flitsch Frederick A Method and apparatus for a cleanspace fabricator
US10651063B2 (en) 2005-06-18 2020-05-12 Frederick A. Flitsch Methods of prototyping and manufacturing with cleanspace fabricators
WO2007025199A2 (en) * 2005-08-26 2007-03-01 Flitsch Frederick A Multi-level cleanspace fabricator elevator system
US20070140822A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Methods and apparatus for opening and closing substrate carriers
WO2007078406A2 (en) * 2005-12-16 2007-07-12 Applied Materials, Inc. Methods and apparatus for opening and closing substrate carriers
US8668146B1 (en) 2006-05-25 2014-03-11 Sean I. Mcghie Rewards program with payment artifact permitting conversion/transfer of non-negotiable credits to entity independent funds
US8201734B1 (en) 2006-05-25 2012-06-19 Mcghie Sean I Conversion of non-negotiable credits associated with an entity into entity independent negotiable funds
US8267315B1 (en) 2006-05-25 2012-09-18 Mcghie Sean I Exchange of non-negotiable credits for entity independent funds
US8376224B2 (en) 2006-05-25 2013-02-19 Sean I. Mcghie Self-service stations for utilizing non-negotiable credits earned from a game of chance
US8342399B1 (en) 2006-05-25 2013-01-01 Mcghie Sean I Conversion of credits to funds
US8162209B2 (en) 2006-05-25 2012-04-24 Buchheit Brian K Storefront purchases utilizing non-negotiable credits earned from a game of chance
US7703673B2 (en) 2006-05-25 2010-04-27 Buchheit Brian K Web based conversion of non-negotiable credits associated with an entity to entity independent negotiable funds
IL180875A0 (en) * 2007-01-22 2007-07-04 Ricor Ltd Gas purge method and apparatus
CN101510498B (zh) * 2008-02-15 2010-09-01 北京北方微电子基地设备工艺研究中心有限责任公司 减少半导体基片颗粒污染的方法及系统
JP5564271B2 (ja) * 2010-01-20 2014-07-30 株式会社日立ハイテクノロジーズ 真空処理装置
US20130265720A1 (en) * 2012-04-09 2013-10-10 Tyco Electronics Raychem Bvba Heat dissipation device for telecommunications equipment
US20140096483A1 (en) * 2012-10-04 2014-04-10 Brookhaven Science Associates, Llc Transfer Chamber for Air-Sensitive Sample Processing
CN103943533B (zh) * 2013-01-23 2017-12-29 上海微电子装备（集团）股份有限公司 密封对接装置
US10446428B2 (en) * 2017-03-14 2019-10-15 Applied Materials, Inc. Load port operation in electronic device manufacturing apparatus, systems, and methods
US10854490B2 (en) * 2018-08-14 2020-12-01 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer carrier handling apparatus and method thereof
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US5674123A (en) * 1995-07-18 1997-10-07 Semifab Docking and environmental purging system for integrated circuit wafer transport assemblies

Also Published As

Publication number Publication date
TW304902B (enExample) 1997-05-11
JPH11509688A (ja) 1999-08-24
EP0839385A1 (en) 1998-05-06
US5674123A (en) 1997-10-07
US5848933A (en) 1998-12-15
WO1997004479A1 (en) 1997-02-06
US6120371A (en) 2000-09-19
CN1191039A (zh) 1998-08-19
KR19990029029A (ko) 1999-04-15
AU6396296A (en) 1997-02-18
KR100281942B1 (ko) 2001-03-02

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