JP2009520352A - 基板キャリヤを開閉するための方法及び装置 - Google Patents
基板キャリヤを開閉するための方法及び装置 Download PDFInfo
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- JP2009520352A JP2009520352A JP2008545593A JP2008545593A JP2009520352A JP 2009520352 A JP2009520352 A JP 2009520352A JP 2008545593 A JP2008545593 A JP 2008545593A JP 2008545593 A JP2008545593 A JP 2008545593A JP 2009520352 A JP2009520352 A JP 2009520352A
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- door
- substrate carrier
- opening mechanism
- door opening
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【選択図】 図12
Description
Claims (23)
- 基板キャリヤを開放するためのシステムにおいて、
1つ以上の基板を保持するように適応された基板キャリヤと、
基板キャリヤ搬送システムから基板キャリヤを受け取るためのロードポートと、
を備え、
上記ロードポートは、ドア開放機構を含み、上記ドア開放機構は、基板キャリヤドアを上記ドア開放機構に対して保持するために真空圧を使用するように適応される、
システム。 - 上記ドア開放機構は、真空圧を真空源から上記基板キャリヤのドアへ加えるように適応されたポートを含む、請求項1に記載のシステム。
- 上記ドア開放機構は、更に、真空圧を上記真空源から上記基板キャリヤのドアへと向けるように適応された1つ以上のチャネルを含む、請求項2に記載のシステム。
- 上記ドア開放機構は、更に、上記基板キャリヤのドアと結合し、上記ドアを上記ドア開放機構と整列させるように適応された1つ以上のキネマチック(kinematic)特徴部を含む、請求項1に記載のシステム。
- 上記ドアは、上記ドア開放機構が上記ドアに隣接しているときに、上記ドア開放機構と整列するように配設される1つ以上のカップ特徴部を含む、請求項1に記載のシステム。
- 上記1つ以上のカップ特徴部は、上記ドア開放機構に対するシールを生成するよう適応される、請求項5に記載のシステム。
- 上記ロードポートは、更に、上記基板キャリヤが上記ロードポートに隣接して配設されるときに、上記基板キャリヤの周辺にガス流を加えるように適応される、請求項1に記載のシステム。
- ロードポートにて基板キャリヤを受け取るステップと、
上記ロードポートのドアオープナーを上記基板キャリヤのドアと整列させるステップと、
上記ドアを保持するため上記ドアオープナーを介して上記ドアへ真空圧を加えるステップと、
を備えた方法。 - 上記基板キャリヤの周辺にガス流を加えるステップを更に備えた、請求項8に記載の方法。
- 上記基板キャリヤから上記ドアを取り外すステップを更に備えた、請求項8に記載の方法。
- 上記基板キャリヤから基板を取り外すステップを更に備えた、請求項10に記載の方法。
- 上記基板キャリヤへ基板を挿入するステップを更に備えた、請求項10に記載の方法。
- 上記基板キャリヤのあるレベルより下へ上記ドアを下降させるステップを更に備えた、請求項10に記載の方法。
- 上記ドアを上記基板キャリヤと整列させるために上記基板キャリヤの上記ドアを上昇させるステップを更に備えた、請求項13に記載の方法。
- 上記ドアから上記真空圧を取り除き、上記ドアを上記ドアオープナーから解放させるようにするステップを更に備えた、請求項14に記載の方法。
- 上記基板キャリヤの上記ドアから上記ドアオープナーを外すステップを更に備えた、請求項15に記載の方法。
- 基板キャリヤに使用するための装置において、
ドア開放機構を含むロードポートを備え、上記ドア開放機構は、基板キャリヤドアを上記ドア開放機構に対して保持するため真空圧を使用するように適応される、装置。 - 上記ドア開放機構は、真空圧を真空源から上記基板キャリヤの上記ドアへと加えるように適応されたポートを含む、請求項17に記載の装置。
- 上記ドア開放機構は、更に、真空圧を上記真空源から上記基板キャリヤの上記ドアへと向けるように適応された1つ以上のチャネルを含む、請求項18に記載の装置。
- 上記ドア開放機構は、上記基板キャリヤの上記ドアに結合し、上記ドアを上記ドア開放機構と整列させるように適応された1つ以上のキネマチック特徴部を含む、請求項17に記載の装置。
- 上記ドアは、上記ドア開放機構が上記ドアに隣接しているときに、上記ドア開放機構のポートと整列するように配設される1つ以上のカップ特徴部を含む、請求項17に記載の装置。
- 上記1つ以上のカップ特徴部は、上記ドア開放機構に対するシールを生成するよう適応される、請求項21に記載の装置。
- 上記ロードポートは、上記基板キャリヤが上記ロードポートに隣接して配設されるときに、上記基板キャリヤの周辺にガス流を加えるように適応される、請求項17に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75108505P | 2005-12-16 | 2005-12-16 | |
PCT/US2006/042669 WO2007078406A2 (en) | 2005-12-16 | 2006-10-30 | Methods and apparatus for opening and closing substrate carriers |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009520352A true JP2009520352A (ja) | 2009-05-21 |
JP2009520352A5 JP2009520352A5 (ja) | 2009-11-26 |
Family
ID=38228680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008545593A Pending JP2009520352A (ja) | 2005-12-16 | 2006-10-30 | 基板キャリヤを開閉するための方法及び装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2009520352A (ja) |
KR (1) | KR20070064383A (ja) |
CN (1) | CN101000882B (ja) |
TW (1) | TW200730412A (ja) |
WO (1) | WO2007078406A2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4488255B2 (ja) * | 2008-05-27 | 2010-06-23 | Tdk株式会社 | 密閉容器の蓋開閉システム、当該蓋開閉システムを含む収容物挿脱システム、及び当該蓋開閉システムを用いた基板処理方法 |
JP5324231B2 (ja) * | 2009-01-08 | 2013-10-23 | 日東電工株式会社 | 半導体ウエハのアライメント装置 |
US10453726B2 (en) * | 2016-11-10 | 2019-10-22 | Applied Materials, Inc. | Electronic device manufacturing load port apparatus, systems, and methods |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002522896A (ja) * | 1998-08-06 | 2002-07-23 | アシスト テクノロジーズ インコーポレイテッド | ポートドア保持・真空引きシステム |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5674123A (en) * | 1995-07-18 | 1997-10-07 | Semifab | Docking and environmental purging system for integrated circuit wafer transport assemblies |
US5772388A (en) * | 1996-05-28 | 1998-06-30 | Clark; Richard J. | Combination hauler for vehicle and trailered boat |
-
2006
- 2006-10-30 JP JP2008545593A patent/JP2009520352A/ja active Pending
- 2006-10-30 TW TW095140091A patent/TW200730412A/zh unknown
- 2006-10-30 WO PCT/US2006/042669 patent/WO2007078406A2/en active Application Filing
- 2006-10-31 KR KR1020060106187A patent/KR20070064383A/ko not_active Application Discontinuation
- 2006-10-31 CN CN2006101504716A patent/CN101000882B/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002522896A (ja) * | 1998-08-06 | 2002-07-23 | アシスト テクノロジーズ インコーポレイテッド | ポートドア保持・真空引きシステム |
Also Published As
Publication number | Publication date |
---|---|
CN101000882A (zh) | 2007-07-18 |
KR20070064383A (ko) | 2007-06-20 |
TW200730412A (en) | 2007-08-16 |
WO2007078406A3 (en) | 2007-10-25 |
WO2007078406A2 (en) | 2007-07-12 |
CN101000882B (zh) | 2011-04-20 |
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