KR100281942B1 - 도킹 및 환경 정화 시스템 - Google Patents

도킹 및 환경 정화 시스템 Download PDF

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Publication number
KR100281942B1
KR100281942B1 KR1019980700332A KR19980700332A KR100281942B1 KR 100281942 B1 KR100281942 B1 KR 100281942B1 KR 1019980700332 A KR1019980700332 A KR 1019980700332A KR 19980700332 A KR19980700332 A KR 19980700332A KR 100281942 B1 KR100281942 B1 KR 100281942B1
Authority
KR
South Korea
Prior art keywords
docking
modular isolation
modular
isolation container
door
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019980700332A
Other languages
English (en)
Korean (ko)
Other versions
KR19990029029A (ko
Inventor
글랜 에이 2세 로베르손
로버트 엠 젠코
카일 지 뮨트
Original Assignee
세미페브
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세미페브 filed Critical 세미페브
Publication of KR19990029029A publication Critical patent/KR19990029029A/ko
Application granted granted Critical
Publication of KR100281942B1 publication Critical patent/KR100281942B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
KR1019980700332A 1995-07-18 1996-06-26 도킹 및 환경 정화 시스템 Expired - Fee Related KR100281942B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8/503677 1995-07-18
US08/503,677 US5674123A (en) 1995-07-18 1995-07-18 Docking and environmental purging system for integrated circuit wafer transport assemblies
PCT/US1996/010930 WO1997004479A1 (en) 1995-07-18 1996-06-26 Docking and environmental purging system for integrated circuit wafer transport assemblies

Publications (2)

Publication Number Publication Date
KR19990029029A KR19990029029A (ko) 1999-04-15
KR100281942B1 true KR100281942B1 (ko) 2001-03-02

Family

ID=24003066

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980700332A Expired - Fee Related KR100281942B1 (ko) 1995-07-18 1996-06-26 도킹 및 환경 정화 시스템

Country Status (8)

Country Link
US (3) US5674123A (enExample)
EP (1) EP0839385A1 (enExample)
JP (1) JP4008494B2 (enExample)
KR (1) KR100281942B1 (enExample)
CN (1) CN1191039A (enExample)
AU (1) AU6396296A (enExample)
TW (1) TW304902B (enExample)
WO (1) WO1997004479A1 (enExample)

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US6599075B2 (en) * 1994-04-28 2003-07-29 Semitool, Inc. Semiconductor wafer processing apparatus
US5674123A (en) * 1995-07-18 1997-10-07 Semifab Docking and environmental purging system for integrated circuit wafer transport assemblies
US6942738B1 (en) 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US6723174B2 (en) 1996-03-26 2004-04-20 Semitool, Inc. Automated semiconductor processing system
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
KR100238944B1 (ko) * 1997-01-09 2000-01-15 윤종용 반도체장치 제조용 베이크설비의 공정챔버 도어개폐장치
TW393741B (en) * 1997-08-11 2000-06-11 Ind Tech Res Inst An automated picking and placing method for IC packing processes of magazine covering plate
US5900047A (en) * 1997-11-26 1999-05-04 Sony Corporation Exhaust system for a semiconductor etcher that utilizes corrosive gas
DE19805624A1 (de) * 1998-02-12 1999-09-23 Acr Automation In Cleanroom Schleuse zum Öffnen und Schließen von Reinraumtransport-Boxen
US6106213A (en) 1998-02-27 2000-08-22 Pri Automation, Inc. Automated door assembly for use in semiconductor wafer manufacturing
NL1009327C2 (nl) * 1998-06-05 1999-12-10 Asm Int Werkwijze en inrichting voor het overbrengen van wafers.
US6261044B1 (en) * 1998-08-06 2001-07-17 Asyst Technologies, Inc. Pod to port door retention and evacuation system
US6041817A (en) * 1998-08-21 2000-03-28 Fairchild Semiconductor Corp. Processing system having vacuum manifold isolation
US6249990B1 (en) * 1999-03-23 2001-06-26 Alliedsignal, Inc. Method and apparatus for transporting articles
DE19913886A1 (de) * 1999-03-26 2000-09-28 Siemens Ag Anlage zur Fertigung von Halbleiterprodukten
JP2000286319A (ja) * 1999-03-31 2000-10-13 Canon Inc 基板搬送方法および半導体製造装置
AU2001268656A1 (en) * 2000-07-07 2002-01-21 Semitool, Inc. Automated processing system
US6660055B2 (en) * 2001-10-25 2003-12-09 Asm Technology Singapore Pte Ltd. Compartment for maintaining a clean production environment
US6976340B2 (en) * 2002-12-05 2005-12-20 Venturedyne Ltd. Universal access port
US7578647B2 (en) 2003-01-27 2009-08-25 Applied Materials, Inc. Load port configurations for small lot size substrate carriers
US7611318B2 (en) 2003-01-27 2009-11-03 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
US7203563B2 (en) * 2004-04-08 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic N2 purge system for 300 mm full automation fab
FR2874744B1 (fr) * 2004-08-30 2006-11-24 Cit Alcatel Interface sous vide entre une boite de mini-environnement et un equipement
JP2008546191A (ja) * 2005-06-03 2008-12-18 シーエスジー ソーラー アクチェンゲゼルシャフト 薄膜シリコン・オン・グラスの水素化装置およびその方法
US11024527B2 (en) 2005-06-18 2021-06-01 Frederick A. Flitsch Methods and apparatus for novel fabricators with Cleanspace
US10627809B2 (en) 2005-06-18 2020-04-21 Frederick A. Flitsch Multilevel fabricators
US9339900B2 (en) 2005-08-18 2016-05-17 Futrfab, Inc. Apparatus to support a cleanspace fabricator
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US9059227B2 (en) 2005-06-18 2015-06-16 Futrfab, Inc. Methods and apparatus for vertically orienting substrate processing tools in a clean space
US9159592B2 (en) 2005-06-18 2015-10-13 Futrfab, Inc. Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
US7513822B2 (en) 2005-06-18 2009-04-07 Flitsch Frederick A Method and apparatus for a cleanspace fabricator
US10651063B2 (en) 2005-06-18 2020-05-12 Frederick A. Flitsch Methods of prototyping and manufacturing with cleanspace fabricators
WO2007025199A2 (en) * 2005-08-26 2007-03-01 Flitsch Frederick A Multi-level cleanspace fabricator elevator system
US20070140822A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Methods and apparatus for opening and closing substrate carriers
WO2007078406A2 (en) * 2005-12-16 2007-07-12 Applied Materials, Inc. Methods and apparatus for opening and closing substrate carriers
US8668146B1 (en) 2006-05-25 2014-03-11 Sean I. Mcghie Rewards program with payment artifact permitting conversion/transfer of non-negotiable credits to entity independent funds
US8201734B1 (en) 2006-05-25 2012-06-19 Mcghie Sean I Conversion of non-negotiable credits associated with an entity into entity independent negotiable funds
US8267315B1 (en) 2006-05-25 2012-09-18 Mcghie Sean I Exchange of non-negotiable credits for entity independent funds
US8376224B2 (en) 2006-05-25 2013-02-19 Sean I. Mcghie Self-service stations for utilizing non-negotiable credits earned from a game of chance
US8342399B1 (en) 2006-05-25 2013-01-01 Mcghie Sean I Conversion of credits to funds
US8162209B2 (en) 2006-05-25 2012-04-24 Buchheit Brian K Storefront purchases utilizing non-negotiable credits earned from a game of chance
US7703673B2 (en) 2006-05-25 2010-04-27 Buchheit Brian K Web based conversion of non-negotiable credits associated with an entity to entity independent negotiable funds
IL180875A0 (en) * 2007-01-22 2007-07-04 Ricor Ltd Gas purge method and apparatus
CN101510498B (zh) * 2008-02-15 2010-09-01 北京北方微电子基地设备工艺研究中心有限责任公司 减少半导体基片颗粒污染的方法及系统
JP5564271B2 (ja) * 2010-01-20 2014-07-30 株式会社日立ハイテクノロジーズ 真空処理装置
US20130265720A1 (en) * 2012-04-09 2013-10-10 Tyco Electronics Raychem Bvba Heat dissipation device for telecommunications equipment
US20140096483A1 (en) * 2012-10-04 2014-04-10 Brookhaven Science Associates, Llc Transfer Chamber for Air-Sensitive Sample Processing
CN103943533B (zh) * 2013-01-23 2017-12-29 上海微电子装备（集团）股份有限公司 密封对接装置
US10446428B2 (en) * 2017-03-14 2019-10-15 Applied Materials, Inc. Load port operation in electronic device manufacturing apparatus, systems, and methods
US10854490B2 (en) * 2018-08-14 2020-12-01 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer carrier handling apparatus and method thereof
WO2025097058A1 (en) * 2023-11-03 2025-05-08 Entegris, Inc. Methods and apparatus for purifying substrate containers

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EP0358443A2 (en) * 1988-09-06 1990-03-14 Canon Kabushiki Kaisha Mask cassette loading device

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Also Published As

Publication number Publication date
TW304902B (enExample) 1997-05-11
JPH11509688A (ja) 1999-08-24
EP0839385A1 (en) 1998-05-06
US5674123A (en) 1997-10-07
US5848933A (en) 1998-12-15
WO1997004479A1 (en) 1997-02-06
US6120371A (en) 2000-09-19
CN1191039A (zh) 1998-08-19
KR19990029029A (ko) 1999-04-15
AU6396296A (en) 1997-02-18
JP4008494B2 (ja) 2007-11-14

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