JPH11509688A - 集積回路ウエハ移送アセンブリ用のドッキング・環境パージ装置 - Google Patents
集積回路ウエハ移送アセンブリ用のドッキング・環境パージ装置Info
- Publication number
- JPH11509688A JPH11509688A JP9506684A JP50668497A JPH11509688A JP H11509688 A JPH11509688 A JP H11509688A JP 9506684 A JP9506684 A JP 9506684A JP 50668497 A JP50668497 A JP 50668497A JP H11509688 A JPH11509688 A JP H11509688A
- Authority
- JP
- Japan
- Prior art keywords
- docking
- door
- purging
- modular
- environmental
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning In General (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.集積回路の製造に使用される粒状汚染物を含む基板のためにモジュラー隔離 容器をパージし且つ粒状汚染物の無い処理環境でモジュラー隔離容器をドッキン グするドッキング・環境パージ装置であって、上記モジュラードッキング容器が モジュラードッキング容器の外部環境から上記基板を隔離する内部チャンバを有 し、さらに、上記モジュラードッキング容器が内部チャンバをシールするドアを 有するドッキング・環境パージ装置において、 上記モジュラードッキング容器を受け入れるドッキングチャンバを形成する ハウジングであって、上記ドッキングチャンバが上記処理環境に通じるように接 続されたハウジングと、 このハウジングを上記処理環境に取り付ける取付手段と、 上記モジュラー隔離容器が上記ドッキングチャンバ内に配置されているとき 上記内部チャンバにアクセスできるように上記モジュラー隔離容器のドアを取り 外すための上記ハウジングに取り付けられたドア取外手段と、 上記粒状汚染物を含む内部チャンバの内容物をパージするパージ手段と、 上記ドア取外手段及びパージ手段を制御する制御手段と、 を有することを特徴とするドッキング・環境パージ装置。 2.上記ドア取外手段は、上記モジュラー隔離容器のドアを把持する把持手段を 有する請求項1記載のドッキング・環境パージ装置。 3.上記ドア取外手段は、上記ハウジングに開位置と閉位置との間を枢軸動作可 能にヒンジにより取り付けられて上記ドッキングチャンバをシールするドア部と 、上記モジュラー隔離容器を受け入れるために上記ドア部に取り付けられたシェ ルフとを有する請求項2記載のドッキング・環境パージ装置。 4.更に、真空源を有し、上記ドア部は、上記真空源に接続された真空マニホー ルドを有し、この真空マニホールドは、真空源に通じるように接続され、上記モ ジュラー隔離容器のドアがそれらに近接して位置するときにこのドアを把持する 複数の吸引カップを有する請求項3記載のドッキング・環境パージ装置。 5.上記パージ手段は、周囲の空気を受け入れるように接続された空気ダクトと 、 この周囲の空気を通すフィルターと、上記ドッキングチャンバに接続されこのド ッキングチャンバに流体を流すブロアとを有する請求項1記載のドッキング・環 境パージ装置。 6.上記パージ手段は、不活性ガスを上記ドッキングチャンバに導くように接続 されているダクトを有する請求項1記載のドッキング・環境パージ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/503,677 US5674123A (en) | 1995-07-18 | 1995-07-18 | Docking and environmental purging system for integrated circuit wafer transport assemblies |
US08/503,677 | 1995-07-18 | ||
PCT/US1996/010930 WO1997004479A1 (en) | 1995-07-18 | 1996-06-26 | Docking and environmental purging system for integrated circuit wafer transport assemblies |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11509688A true JPH11509688A (ja) | 1999-08-24 |
JP4008494B2 JP4008494B2 (ja) | 2007-11-14 |
Family
ID=24003066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50668497A Expired - Fee Related JP4008494B2 (ja) | 1995-07-18 | 1996-06-26 | 集積回路ウエハ移送アセンブリ用のドッキング・環境パージ装置 |
Country Status (8)
Country | Link |
---|---|
US (3) | US5674123A (ja) |
EP (1) | EP0839385A1 (ja) |
JP (1) | JP4008494B2 (ja) |
KR (1) | KR100281942B1 (ja) |
CN (1) | CN1191039A (ja) |
AU (1) | AU6396296A (ja) |
TW (1) | TW304902B (ja) |
WO (1) | WO1997004479A1 (ja) |
Families Citing this family (52)
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US6599075B2 (en) * | 1994-04-28 | 2003-07-29 | Semitool, Inc. | Semiconductor wafer processing apparatus |
US5674123A (en) * | 1995-07-18 | 1997-10-07 | Semifab | Docking and environmental purging system for integrated circuit wafer transport assemblies |
US6942738B1 (en) | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
US6723174B2 (en) | 1996-03-26 | 2004-04-20 | Semitool, Inc. | Automated semiconductor processing system |
US5980195A (en) * | 1996-04-24 | 1999-11-09 | Tokyo Electron, Ltd. | Positioning apparatus for substrates to be processed |
KR100238944B1 (ko) | 1997-01-09 | 2000-01-15 | 윤종용 | 반도체장치 제조용 베이크설비의 공정챔버 도어개폐장치 |
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US5900047A (en) * | 1997-11-26 | 1999-05-04 | Sony Corporation | Exhaust system for a semiconductor etcher that utilizes corrosive gas |
DE19805624A1 (de) * | 1998-02-12 | 1999-09-23 | Acr Automation In Cleanroom | Schleuse zum Öffnen und Schließen von Reinraumtransport-Boxen |
US6106213A (en) | 1998-02-27 | 2000-08-22 | Pri Automation, Inc. | Automated door assembly for use in semiconductor wafer manufacturing |
NL1009327C2 (nl) * | 1998-06-05 | 1999-12-10 | Asm Int | Werkwijze en inrichting voor het overbrengen van wafers. |
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JP2000286319A (ja) * | 1999-03-31 | 2000-10-13 | Canon Inc | 基板搬送方法および半導体製造装置 |
EP1332349A4 (en) * | 2000-07-07 | 2008-12-17 | Semitool Inc | AUTOMATED PROCESSING SYSTEM |
US6660055B2 (en) * | 2001-10-25 | 2003-12-09 | Asm Technology Singapore Pte Ltd. | Compartment for maintaining a clean production environment |
US6976340B2 (en) * | 2002-12-05 | 2005-12-20 | Venturedyne Ltd. | Universal access port |
US7611318B2 (en) | 2003-01-27 | 2009-11-03 | Applied Materials, Inc. | Overhead transfer flange and support for suspending a substrate carrier |
US7578647B2 (en) | 2003-01-27 | 2009-08-25 | Applied Materials, Inc. | Load port configurations for small lot size substrate carriers |
US7203563B2 (en) * | 2004-04-08 | 2007-04-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Automatic N2 purge system for 300 mm full automation fab |
FR2874744B1 (fr) * | 2004-08-30 | 2006-11-24 | Cit Alcatel | Interface sous vide entre une boite de mini-environnement et un equipement |
US8039051B2 (en) * | 2005-06-03 | 2011-10-18 | Csg Solar Ag | Method and apparatus for hydrogenation of thin film silicon on glass |
US9457442B2 (en) * | 2005-06-18 | 2016-10-04 | Futrfab, Inc. | Method and apparatus to support process tool modules in a cleanspace fabricator |
US9059227B2 (en) | 2005-06-18 | 2015-06-16 | Futrfab, Inc. | Methods and apparatus for vertically orienting substrate processing tools in a clean space |
US11024527B2 (en) | 2005-06-18 | 2021-06-01 | Frederick A. Flitsch | Methods and apparatus for novel fabricators with Cleanspace |
US9339900B2 (en) | 2005-08-18 | 2016-05-17 | Futrfab, Inc. | Apparatus to support a cleanspace fabricator |
US9159592B2 (en) | 2005-06-18 | 2015-10-13 | Futrfab, Inc. | Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator |
US10651063B2 (en) | 2005-06-18 | 2020-05-12 | Frederick A. Flitsch | Methods of prototyping and manufacturing with cleanspace fabricators |
US7513822B2 (en) | 2005-06-18 | 2009-04-07 | Flitsch Frederick A | Method and apparatus for a cleanspace fabricator |
US10627809B2 (en) | 2005-06-18 | 2020-04-21 | Frederick A. Flitsch | Multilevel fabricators |
US7467024B2 (en) * | 2005-08-26 | 2008-12-16 | Flitsch Frederick A | Method and apparatus for an elevator system for a multilevel cleanspace fabricator |
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US20070140822A1 (en) * | 2005-12-16 | 2007-06-21 | Applied Materials, Inc. | Methods and apparatus for opening and closing substrate carriers |
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US7703673B2 (en) | 2006-05-25 | 2010-04-27 | Buchheit Brian K | Web based conversion of non-negotiable credits associated with an entity to entity independent negotiable funds |
US8162209B2 (en) | 2006-05-25 | 2012-04-24 | Buchheit Brian K | Storefront purchases utilizing non-negotiable credits earned from a game of chance |
US8267315B1 (en) | 2006-05-25 | 2012-09-18 | Mcghie Sean I | Exchange of non-negotiable credits for entity independent funds |
US8376224B2 (en) | 2006-05-25 | 2013-02-19 | Sean I. Mcghie | Self-service stations for utilizing non-negotiable credits earned from a game of chance |
US8201734B1 (en) | 2006-05-25 | 2012-06-19 | Mcghie Sean I | Conversion of non-negotiable credits associated with an entity into entity independent negotiable funds |
US8668146B1 (en) | 2006-05-25 | 2014-03-11 | Sean I. Mcghie | Rewards program with payment artifact permitting conversion/transfer of non-negotiable credits to entity independent funds |
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CN101510498B (zh) * | 2008-02-15 | 2010-09-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 减少半导体基片颗粒污染的方法及系统 |
JP5564271B2 (ja) * | 2010-01-20 | 2014-07-30 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
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US10446428B2 (en) * | 2017-03-14 | 2019-10-15 | Applied Materials, Inc. | Load port operation in electronic device manufacturing apparatus, systems, and methods |
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US4616683A (en) * | 1983-09-28 | 1986-10-14 | Hewlett-Packard Company | Particle-free dockable interface for integrated circuit processing |
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JPH05299312A (ja) * | 1992-04-21 | 1993-11-12 | Sumitomo Electric Ind Ltd | 半導体製造設備 |
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US5674123A (en) * | 1995-07-18 | 1997-10-07 | Semifab | Docking and environmental purging system for integrated circuit wafer transport assemblies |
-
1995
- 1995-07-18 US US08/503,677 patent/US5674123A/en not_active Expired - Lifetime
-
1996
- 1996-06-26 AU AU63962/96A patent/AU6396296A/en not_active Abandoned
- 1996-06-26 JP JP50668497A patent/JP4008494B2/ja not_active Expired - Fee Related
- 1996-06-26 KR KR1019980700332A patent/KR100281942B1/ko not_active IP Right Cessation
- 1996-06-26 EP EP96923456A patent/EP0839385A1/en not_active Withdrawn
- 1996-06-26 WO PCT/US1996/010930 patent/WO1997004479A1/en not_active Application Discontinuation
- 1996-06-26 CN CN96195606A patent/CN1191039A/zh active Pending
- 1996-08-02 TW TW085109466A patent/TW304902B/zh active
-
1997
- 1997-08-21 US US08/916,021 patent/US5848933A/en not_active Expired - Fee Related
-
1998
- 1998-10-21 US US09/176,476 patent/US6120371A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0839385A1 (en) | 1998-05-06 |
AU6396296A (en) | 1997-02-18 |
CN1191039A (zh) | 1998-08-19 |
KR19990029029A (ko) | 1999-04-15 |
WO1997004479A1 (en) | 1997-02-06 |
TW304902B (ja) | 1997-05-11 |
US5674123A (en) | 1997-10-07 |
US5848933A (en) | 1998-12-15 |
US6120371A (en) | 2000-09-19 |
JP4008494B2 (ja) | 2007-11-14 |
KR100281942B1 (ko) | 2001-03-02 |
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Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
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R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |