JP4004139B2 - 多層積層板とその製造方法および多層実装回路基板 - Google Patents

多層積層板とその製造方法および多層実装回路基板 Download PDF

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Publication number
JP4004139B2
JP4004139B2 JP11698798A JP11698798A JP4004139B2 JP 4004139 B2 JP4004139 B2 JP 4004139B2 JP 11698798 A JP11698798 A JP 11698798A JP 11698798 A JP11698798 A JP 11698798A JP 4004139 B2 JP4004139 B2 JP 4004139B2
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Japan
Prior art keywords
film
laminate
multilayer
films
metal
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Expired - Lifetime
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JP11698798A
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English (en)
Japanese (ja)
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JPH11309803A (ja
JPH11309803A5 (enExample
Inventor
稔 小野寺
敏昭 佐藤
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Kuraray Co Ltd
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Kuraray Co Ltd
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Priority to JP11698798A priority Critical patent/JP4004139B2/ja
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Publication of JPH11309803A5 publication Critical patent/JPH11309803A5/ja
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Publication of JP4004139B2 publication Critical patent/JP4004139B2/ja
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Expired - Lifetime legal-status Critical Current

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  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP11698798A 1998-04-27 1998-04-27 多層積層板とその製造方法および多層実装回路基板 Expired - Lifetime JP4004139B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11698798A JP4004139B2 (ja) 1998-04-27 1998-04-27 多層積層板とその製造方法および多層実装回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11698798A JP4004139B2 (ja) 1998-04-27 1998-04-27 多層積層板とその製造方法および多層実装回路基板

Publications (3)

Publication Number Publication Date
JPH11309803A JPH11309803A (ja) 1999-11-09
JPH11309803A5 JPH11309803A5 (enExample) 2005-03-17
JP4004139B2 true JP4004139B2 (ja) 2007-11-07

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JP11698798A Expired - Lifetime JP4004139B2 (ja) 1998-04-27 1998-04-27 多層積層板とその製造方法および多層実装回路基板

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JP (1) JP4004139B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244630A (ja) * 2000-02-25 2001-09-07 Kuraray Co Ltd 多層配線回路基板およびその製造方法
US20040040651A1 (en) * 2002-08-28 2004-03-04 Kuraray Co., Ltd. Multi-layer circuit board and method of making the same
AU2003267221A1 (en) 2002-09-16 2004-04-30 World Properties, Inc. Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom
US7227179B2 (en) 2002-09-30 2007-06-05 World Properties, Inc. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
US7549220B2 (en) 2003-12-17 2009-06-23 World Properties, Inc. Method for making a multilayer circuit
KR102161929B1 (ko) 2011-10-31 2020-10-05 주식회사 쿠라레 열가소성 액정 폴리머 필름 그리고 이것을 사용한 적층체 및 회로 기판
KR102082536B1 (ko) 2012-09-20 2020-02-27 주식회사 쿠라레 회로 기판 및 그 제조 방법
CN105683266B (zh) * 2013-11-01 2020-04-03 株式会社可乐丽 热塑性液晶聚合物薄膜的制造方法、以及电路基板及其制造方法
CN107079594B (zh) 2014-11-07 2019-08-23 株式会社可乐丽 电路基板及其制造方法

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JPH11309803A (ja) 1999-11-09

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