JP3994989B2 - 半導体装置、回路基板、電気光学装置および電子機器 - Google Patents
半導体装置、回路基板、電気光学装置および電子機器 Download PDFInfo
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- JP3994989B2 JP3994989B2 JP2004175534A JP2004175534A JP3994989B2 JP 3994989 B2 JP3994989 B2 JP 3994989B2 JP 2004175534 A JP2004175534 A JP 2004175534A JP 2004175534 A JP2004175534 A JP 2004175534A JP 3994989 B2 JP3994989 B2 JP 3994989B2
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Description
従来のバンプ電極は、電解Auメッキ等により相当の厚さに形成されている。そのため、検査用プローブとの接触によりバンプ電極の頂部が削り取られても、バンプ電極と相手側基板との導電接続が不可能になることはなかった。ところが、樹脂バンプ電極10では、樹脂突起12の表面の導電膜20が非常に薄く形成されている。そのため、検査用プローブとの接触により樹脂バンプ電極10の導電膜20が削り取られると、樹脂バンプ電極10と相手側基板との導電接続が不可能になるおそれがある。
この構成によれば、樹脂突起とその表面の導電膜とにより相手側基板との導電接続部となる樹脂バンプ電極が形成され、その樹脂バンプ電極を挟んで電極パッドの反対側に検査用電極が形成されているので、この検査用電極に検査用プローブを接触させることにより、樹脂バンプ電極から電極パッドまでの間の導通チェックを簡単に行うことができる。また、検査用プローブとの接触により検査用電極を構成する導電膜の一部が削り取られても、半導体装置の導通性能に影響を与えることがないので、相手側基板との導電接続を確実に行うことができる。
この構成によれば、上記と同様に、樹脂バンプ電極と電極パッドとの間の導通チェックを簡単に行うことが可能であり、相手側基板との導電接続を確実に行うことが可能である。これに加えて、弾性を有する樹脂層の表面に検査用電極が形成されているので、検査用電極と検査用プローブとの接触による衝撃から、半導体装置の能動面を保護することができる。
この構成によれば、樹脂層によって半導体装置の能動面が平坦化されるので、樹脂突起の高さ寸法を精度よく形成することが可能になる。この樹脂突起を用いて樹脂バンプ電極を構成することにより、相手側基板との導電接続を確実に行うことができる。
この構成によれば、樹脂突起と樹脂層とが密着するので、樹脂バンプ電極の信頼性を向上させることが可能になり、相手側基板との導電接続を確実に行うことができる。
この構成によれば、樹脂突起および樹脂層のうちいずれか一方、または双方を精度よく形成することができるので、電極パッドを確実に開口させることができる。
この構成によれば、導電膜を簡単に形成することが可能であり、製造コストを低減することができる。
この構成によれば、補強部材により導電膜を保護することが可能であり、また導電膜の電気抵抗を低減することが可能になる。したがって、相手側基板との導電接続を確実に行うことができる。
この構成によれば、導電接続の信頼性に優れた回路基板を提供することができる。
この構成によれば、導電接続の信頼性に優れた電気光学装置を提供することができる。
この構成によれば、導電接続の信頼性に優れた電子機器を提供することができる。
最初に、本発明の第1実施形態につき、図1ないし図3を用いて説明する。
図1は、第1実施形態に係る半導体装置の説明図である。第1実施形態の半導体装置121は、能動面121aに形成された電極パッド24および樹脂突起12と、電極パッド24の表面から樹脂突起12の表面にかけて配設された導電膜20とを備え、その樹脂突起12および導電膜20により樹脂バンプ電極10が構成されている。そして、その樹脂バンプ電極10を挟んで電極パッド24の反対側に導電膜20が延設されて、検査用電極30が形成されている。
図2は、第1実施形態に係る半導体装置の斜視図である。半導体装置121は、例えば液晶表示装置の画素を駆動するICチップであり、その能動面下には薄膜トランジスタ等の複数の電子素子や各電子素子間を接続する配線などが形成されている(いずれも不図示)。図2に示す第1実施形態の半導体装置121では、その能動面121aの長辺に沿って複数の電極パッド24が整列配置されている。この電極パッド24は、上述した電子素子等から引き出されたものである。また、能動面121aにおける電極パッド列24aの内側には、その電極パッド列24aに沿って直線状に連続する樹脂突起12が形成されている。さらに、各電極パッド24の表面から樹脂突起12の表面にかけて、複数の導電膜20が形成されている。そして、樹脂突起12の表面に配設された各導電膜20により、複数の樹脂バンプ電極10が構成されている。
ところで、図7に示すように、実装された半導体装置121と相手側基板111との間は、熱硬化性樹脂からなる封止樹脂122によって封止される。その際、あらかじめ突条の樹脂突起の一部を除去しておけば、封止樹脂122の流れを確保することができる。これにより、半導体装置121を相手側基板111に対して確実に実装することができる。
次に、上述した半導体装置の検査方法についき、図1を用いて説明する。半導体装置121の検査として、半導体装置121を構成するトランジスタ等の電子素子(不図示)の動作チェックや、相手側基板との接続部から電子素子までの導通チェックを行う必要がある。なお、半導体装置121の電極パッド24は、上述した電子素子等から引き出されたものである。本実施形態では、上述した複数の検査用電極30(または検査用再配置電極)に対して、検査用プローブを接触させることにより、上述した動作チェックおよび導通チェックを行う。
しかしながら、上述した本実施形態の半導体装置では、検査用プローブとの接触により検査用電極を構成する導電膜の一部が削り取られても、半導体装置の導通性能に影響を与えることがないので、相手側基板との導電接続を確実に行うことができる。
次に、本発明の第2実施形態に係る半導体装置つき、図4を用いて説明する。
図4は、第2実施形態に係る半導体装置の説明図であり、図4(a)は樹脂バンプ電極10の周辺の平面拡大図であり、図4(b)は図4(a)のB−B線における側面断面図である。図4に示すように、第2実施形態の半導体装置121は、能動面121aにおける電極パッド列24aの内側に樹脂層32が形成され、樹脂層32の表面に樹脂突起12が形成され、電極パッド24から樹脂突起12を挟んで反対側まで導電膜20が延設され、その導電膜20が樹脂層32の表面に配設されて検査用電極30が形成されているものである。なお、第1実施形態と同様の構成となる部分については、その詳細な説明を省略する。
これに対して、本実施形態の半導体装置では、パッシベーション膜26の表面に樹脂層32を介して導電膜20が形成されている。この樹脂層は弾性材料であるため、検査用電極に対するプローブの接触の緩衝材として機能する。したがって、パッシベーション膜26の破壊を防止することが可能になり、半導体装置の信頼性を向上させることができる。
次に、本発明の第3実施形態に係る半導体装置つき、図5を用いて説明する。
図5は、第3実施形態に係る半導体装置の説明図であり、図5(a)は樹脂バンプ電極10の周辺の平面拡大図であり、図5(b)は図5(a)のC−C線における側面断面図である。図5に示すように、第3実施形態の半導体装置121は、能動面121aにおける電極パッド列24aの内側に樹脂突起12が形成され、能動面121aにおける樹脂突起12の内側に樹脂層32が形成され、電極パッド24から樹脂突起12を挟んで反対側まで導電膜20が延設され、その導電膜20が樹脂層32の表面に配設されて検査用電極30が形成されているものである。なお、第1実施形態および第2実施形態と同様の構成となる部分については、その詳細な説明を省略する。
次に、上記各実施形態の半導体装置を備えた電気光学装置について説明する。
図6は、電気光学装置の一実施形態である液晶表示装置を示す模式図である。図示の液晶表示装置100は、液晶パネル110と、液晶駆動用ICチップである半導体装置121とを有する。また、必要に応じて、図示しない偏光板、反射シート、バックライト等の付帯部材が適宜に設けられる。
図8は、本発明に係る電子機器の一例を示す斜視図である。この図に示す携帯電話1300は、上述した電気光学装置を小サイズの表示部1301として備え、複数の操作ボタン1302、受話口1303、及び送話口1304を備えて構成されている。
上述した電気光学装置は、上記携帯電話に限らず、電子ブック、パーソナルコンピュータ、ディジタルスチルカメラ、液晶テレビ、ビューファインダ型あるいはモニタ直視型のビデオテープレコーダ、カーナビゲーション装置、ページャ、電子手帳、電卓、ワードプロセッサ、ワークステーション、テレビ電話、POS端末、タッチパネルを備えた機器等々の画像表示手段として好適に用いることができ、いずれの場合にも電気的接続の信頼性に優れた電子機器を提供することができる。
Claims (10)
- 能動面に形成された電極パッドおよび樹脂突起と、前記電極パッドの表面から前記樹脂突起の表面にかけて配設された導電膜とを備え、前記樹脂突起の表面に配設された前記導電膜を介して相手側基板に導電接続される半導体装置であって、
前記導電膜は、前記電極パッドから、前記樹脂突起の表面における前記相手側基板との導電接続部のみを通り、前記樹脂突起を挟んで反対側まで延設され、
前記樹脂突起を挟んで前記電極パッドと反対側の前記導電膜に、検査用電極が形成されていることを特徴とする半導体装置。 - 能動面に形成された電極パッドおよび樹脂突起と、前記電極パッドの表面から前記樹脂突起の表面にかけて配設された導電膜とを備え、前記樹脂突起の表面に配設された前記導電膜を介して相手側基板に導電接続される半導体装置であって、
前記能動面には、樹脂層が形成され、
前記導電膜が、前記電極パッドから、前記樹脂突起の表面における前記相手側基板との導電接続部のみを通り、前記樹脂突起を挟んで反対側まで延設され、
前記樹脂突起を挟んで前記電極パッドと反対側の前記樹脂層の表面に配設された前記導電膜に、検査用電極が形成されていることを特徴とする半導体装置。 - 前記樹脂突起は、前記樹脂層の表面に形成されていることを特徴とする請求項2に記載の半導体装置。
- 前記樹脂突起と前記樹脂層とは、同じ樹脂材料により構成されていることを特徴とする請求項2または請求項3に記載の半導体装置。
- 前記樹脂突起および前記樹脂層のうち少なくとも一方は、感光性樹脂により構成されていることを特徴とする請求項2ないし請求項4のいずれか1項に記載の半導体装置。
- 前記導電膜はスパッタ法により形成され、エッチング法によりパターニングされてなることを特徴とする請求項1ないし請求項5のいずれか1項に記載の半導体装置。
- 前記導電膜の表面に、前記導電膜の補強部材が導電材料により形成されていることを特徴とする請求項1ないし請求項6のいずれか1項に記載の半導体装置。
- 請求項1ないし請求項7のいずれか1項に記載の半導体装置が実装されてなることを特徴とする回路基板。
- 請求項1ないし請求項7のいずれか1項に記載の半導体装置、または請求項8に記載の回路基板を備えたことを特徴とする電気光学装置。
- 請求項8に記載の回路基板、または請求項9に記載の電気光学装置を備えたことを特徴とする電子機器。
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2004
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2005
- 2005-05-13 US US11/128,848 patent/US7276792B2/en not_active Expired - Fee Related
- 2005-06-07 CN CNB2005100758072A patent/CN100444370C/zh not_active Expired - Fee Related
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- 2005-06-13 KR KR1020050050250A patent/KR100729885B1/ko not_active IP Right Cessation
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007042733A (ja) * | 2005-08-01 | 2007-02-15 | Seiko Epson Corp | 半導体装置及び電子デバイス |
JP2007042734A (ja) * | 2005-08-01 | 2007-02-15 | Seiko Epson Corp | 半導体装置及び電子デバイス |
JP4654820B2 (ja) * | 2005-08-01 | 2011-03-23 | セイコーエプソン株式会社 | 半導体装置及び電子デバイス |
JP4654821B2 (ja) * | 2005-08-01 | 2011-03-23 | セイコーエプソン株式会社 | 半導体装置及び電子デバイス |
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US7888799B2 (en) | 2011-02-15 |
TWI272686B (en) | 2007-02-01 |
KR100729885B1 (ko) | 2007-06-18 |
US20080012130A1 (en) | 2008-01-17 |
US7276792B2 (en) | 2007-10-02 |
US20050275115A1 (en) | 2005-12-15 |
KR20060046431A (ko) | 2006-05-17 |
CN100444370C (zh) | 2008-12-17 |
US7741712B2 (en) | 2010-06-22 |
JP2005353983A (ja) | 2005-12-22 |
CN1716586A (zh) | 2006-01-04 |
TW200603308A (en) | 2006-01-16 |
US20100252829A1 (en) | 2010-10-07 |
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