JP3957178B2 - パターン化薄膜形成方法 - Google Patents

パターン化薄膜形成方法 Download PDF

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Publication number
JP3957178B2
JP3957178B2 JP2002222799A JP2002222799A JP3957178B2 JP 3957178 B2 JP3957178 B2 JP 3957178B2 JP 2002222799 A JP2002222799 A JP 2002222799A JP 2002222799 A JP2002222799 A JP 2002222799A JP 3957178 B2 JP3957178 B2 JP 3957178B2
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JP
Japan
Prior art keywords
thin film
layer
frame
patterned thin
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002222799A
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English (en)
Japanese (ja)
Other versions
JP2004063965A5 (enExample
JP2004063965A (ja
Inventor
聡史 上島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2002222799A priority Critical patent/JP3957178B2/ja
Priority to US10/617,169 priority patent/US20040023057A1/en
Publication of JP2004063965A publication Critical patent/JP2004063965A/ja
Publication of JP2004063965A5 publication Critical patent/JP2004063965A5/ja
Priority to US11/699,549 priority patent/US7655282B2/en
Application granted granted Critical
Publication of JP3957178B2 publication Critical patent/JP3957178B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/042—Printed circuit coils by thin film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12333—Helical or with helical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y10T428/12646—Group VIII or IB metal-base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Magnetic Heads (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2002222799A 2002-07-31 2002-07-31 パターン化薄膜形成方法 Expired - Fee Related JP3957178B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002222799A JP3957178B2 (ja) 2002-07-31 2002-07-31 パターン化薄膜形成方法
US10/617,169 US20040023057A1 (en) 2002-07-31 2003-07-11 Patterned thin film and method of forming same
US11/699,549 US7655282B2 (en) 2002-07-31 2007-01-30 Method of forming patterned film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002222799A JP3957178B2 (ja) 2002-07-31 2002-07-31 パターン化薄膜形成方法

Publications (3)

Publication Number Publication Date
JP2004063965A JP2004063965A (ja) 2004-02-26
JP2004063965A5 JP2004063965A5 (enExample) 2005-02-03
JP3957178B2 true JP3957178B2 (ja) 2007-08-15

Family

ID=31184933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002222799A Expired - Fee Related JP3957178B2 (ja) 2002-07-31 2002-07-31 パターン化薄膜形成方法

Country Status (2)

Country Link
US (2) US20040023057A1 (enExample)
JP (1) JP3957178B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005092032A2 (en) 2004-03-22 2005-10-06 Sliccware Corporation Secure virtual data warehousing system and method
US8679860B1 (en) * 2006-08-07 2014-03-25 Sandia Corporation Lateral electrodeposition of compositionally modulated metal layers
US20130002685A1 (en) * 2011-06-30 2013-01-03 Qualcomm Mems Technologies, Inc. Bonded double substrate approach to solve laser drilling problems
US20150348706A1 (en) * 2012-10-30 2015-12-03 Leap Co. Ltd. Coil element production method
CN103600529A (zh) * 2013-10-30 2014-02-26 苏州米达思精密电子有限公司 一种黑色补强钢片结构
JP6716866B2 (ja) * 2015-06-30 2020-07-01 Tdk株式会社 コイル部品
EP4425708A3 (en) * 2017-11-29 2024-11-27 Dai Nippon Printing Co., Ltd. Wiring board and method for manufacturing wiring board
JP7211323B2 (ja) * 2019-10-08 2023-01-24 株式会社村田製作所 インダクタ部品、及びインダクタ部品の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3093502A (en) * 1959-12-30 1963-06-11 Johnson & Johnson Nonwoven fabrics and methods of manufacturing the same
US3853715A (en) * 1973-12-20 1974-12-10 Ibm Elimination of undercut in an anodically active metal during chemical etching
JPS5636706A (en) 1979-09-04 1981-04-10 Fanuc Ltd Sequence program translation system of programmable sequence controller
JP2629293B2 (ja) 1988-08-30 1997-07-09 日本電気株式会社 薄膜磁気ヘッド
JPH02281623A (ja) 1989-04-21 1990-11-19 Nec Corp メッキ配線の形成方法
US5043043A (en) * 1990-06-22 1991-08-27 Massachusetts Institute Of Technology Method for fabricating side drive electrostatic micromotor
JP2973874B2 (ja) 1994-06-23 1999-11-08 信越化学工業株式会社 パターン形成方法
US5773200A (en) * 1994-06-23 1998-06-30 Shin-Etsu Chemical Co., Ltd. Positive resist composition suitable for lift-off technique and pattern forming method
US5622761A (en) * 1995-02-27 1997-04-22 Cole; Roger J. Double-sided releaseable adhesive tape or note
SG60011A1 (en) * 1995-07-26 1999-02-22 Tdk Corp Resist pattern of t-shaped cross section its preparation and magnetoresistance thin film element
JP2922855B2 (ja) 1995-07-26 1999-07-26 ティーディーケイ株式会社 Ｔ形断面のレジストパターンおよびその製造方法ならびに磁気抵抗効果型薄膜素子
JPH09252087A (ja) 1996-03-14 1997-09-22 Sony Corp Ｉｃのリアクタンス形成方法
JPH10116402A (ja) 1996-10-11 1998-05-06 Hitachi Ltd 薄膜磁気ヘッドの製造方法
US5989667A (en) * 1997-02-10 1999-11-23 Tayebi; Amad Opaque sticker for temporary posting applications and subsequent saving without exhibiting inconvenient sticking to other surfaces
JPH10334410A (ja) * 1997-05-29 1998-12-18 Tdk Corp 薄膜磁気ヘッド及びその製造方法
JPH11148861A (ja) * 1997-09-09 1999-06-02 Honda Motor Co Ltd マイクロブリッジ構造
US6201243B1 (en) * 1998-07-20 2001-03-13 Institut National D'optique Microbridge structure and method for forming the microbridge structure
JP3363841B2 (ja) * 1999-06-28 2003-01-08 アルプス電気株式会社 薄膜磁気ヘッド及びその製造方法
JP3522595B2 (ja) * 1999-07-14 2004-04-26 Ｔｄｋ株式会社 薄膜磁気ヘッドおよびその製造方法
US6655207B1 (en) * 2000-02-16 2003-12-02 Honeywell International Inc. Flow rate module and integrated flow restrictor
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US6683387B1 (en) * 2000-06-15 2004-01-27 Advanced Micro Devices, Inc. Flip chip carrier package with adapted landing pads

Also Published As

Publication number Publication date
US20040023057A1 (en) 2004-02-05
JP2004063965A (ja) 2004-02-26
US7655282B2 (en) 2010-02-02
US20070122553A1 (en) 2007-05-31

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