JP2004063965A5 - - Google Patents

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Publication number
JP2004063965A5
JP2004063965A5 JP2002222799A JP2002222799A JP2004063965A5 JP 2004063965 A5 JP2004063965 A5 JP 2004063965A5 JP 2002222799 A JP2002222799 A JP 2002222799A JP 2002222799 A JP2002222799 A JP 2002222799A JP 2004063965 A5 JP2004063965 A5 JP 2004063965A5
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Japan
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upper side
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JP2002222799A
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English (en)
Japanese (ja)
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JP2004063965A (ja
JP3957178B2 (ja
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Priority to JP2002222799A priority Critical patent/JP3957178B2/ja
Priority claimed from JP2002222799A external-priority patent/JP3957178B2/ja
Priority to US10/617,169 priority patent/US20040023057A1/en
Publication of JP2004063965A publication Critical patent/JP2004063965A/ja
Publication of JP2004063965A5 publication Critical patent/JP2004063965A5/ja
Priority to US11/699,549 priority patent/US7655282B2/en
Application granted granted Critical
Publication of JP3957178B2 publication Critical patent/JP3957178B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002222799A 2002-07-31 2002-07-31 パターン化薄膜形成方法 Expired - Fee Related JP3957178B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002222799A JP3957178B2 (ja) 2002-07-31 2002-07-31 パターン化薄膜形成方法
US10/617,169 US20040023057A1 (en) 2002-07-31 2003-07-11 Patterned thin film and method of forming same
US11/699,549 US7655282B2 (en) 2002-07-31 2007-01-30 Method of forming patterned film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002222799A JP3957178B2 (ja) 2002-07-31 2002-07-31 パターン化薄膜形成方法

Publications (3)

Publication Number Publication Date
JP2004063965A JP2004063965A (ja) 2004-02-26
JP2004063965A5 true JP2004063965A5 (enExample) 2005-02-03
JP3957178B2 JP3957178B2 (ja) 2007-08-15

Family

ID=31184933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002222799A Expired - Fee Related JP3957178B2 (ja) 2002-07-31 2002-07-31 パターン化薄膜形成方法

Country Status (2)

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US (2) US20040023057A1 (enExample)
JP (1) JP3957178B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005092032A2 (en) 2004-03-22 2005-10-06 Sliccware Corporation Secure virtual data warehousing system and method
US8679860B1 (en) * 2006-08-07 2014-03-25 Sandia Corporation Lateral electrodeposition of compositionally modulated metal layers
US20130002685A1 (en) * 2011-06-30 2013-01-03 Qualcomm Mems Technologies, Inc. Bonded double substrate approach to solve laser drilling problems
US20150348706A1 (en) * 2012-10-30 2015-12-03 Leap Co. Ltd. Coil element production method
CN103600529A (zh) * 2013-10-30 2014-02-26 苏州米达思精密电子有限公司 一种黑色补强钢片结构
JP6716866B2 (ja) * 2015-06-30 2020-07-01 Tdk株式会社 コイル部品
KR102743308B1 (ko) * 2017-11-29 2024-12-17 다이니폰 인사츠 가부시키가이샤 배선 기판 및 배선 기판의 제조 방법
JP7211323B2 (ja) * 2019-10-08 2023-01-24 株式会社村田製作所 インダクタ部品、及びインダクタ部品の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3093502A (en) * 1959-12-30 1963-06-11 Johnson & Johnson Nonwoven fabrics and methods of manufacturing the same
US3853715A (en) * 1973-12-20 1974-12-10 Ibm Elimination of undercut in an anodically active metal during chemical etching
JPS5636706A (en) 1979-09-04 1981-04-10 Fanuc Ltd Sequence program translation system of programmable sequence controller
JP2629293B2 (ja) 1988-08-30 1997-07-09 日本電気株式会社 薄膜磁気ヘッド
JPH02281623A (ja) 1989-04-21 1990-11-19 Nec Corp メッキ配線の形成方法
US5043043A (en) * 1990-06-22 1991-08-27 Massachusetts Institute Of Technology Method for fabricating side drive electrostatic micromotor
US5773200A (en) * 1994-06-23 1998-06-30 Shin-Etsu Chemical Co., Ltd. Positive resist composition suitable for lift-off technique and pattern forming method
JP2973874B2 (ja) 1994-06-23 1999-11-08 信越化学工業株式会社 パターン形成方法
US5622761A (en) * 1995-02-27 1997-04-22 Cole; Roger J. Double-sided releaseable adhesive tape or note
SG60011A1 (en) * 1995-07-26 1999-02-22 Tdk Corp Resist pattern of t-shaped cross section its preparation and magnetoresistance thin film element
JP2922855B2 (ja) 1995-07-26 1999-07-26 ティーディーケイ株式会社 Ｔ形断面のレジストパターンおよびその製造方法ならびに磁気抵抗効果型薄膜素子
JPH09252087A (ja) 1996-03-14 1997-09-22 Sony Corp Ｉｃのリアクタンス形成方法
JPH10116402A (ja) 1996-10-11 1998-05-06 Hitachi Ltd 薄膜磁気ヘッドの製造方法
US5989667A (en) * 1997-02-10 1999-11-23 Tayebi; Amad Opaque sticker for temporary posting applications and subsequent saving without exhibiting inconvenient sticking to other surfaces
JPH10334410A (ja) * 1997-05-29 1998-12-18 Tdk Corp 薄膜磁気ヘッド及びその製造方法
JPH11148861A (ja) * 1997-09-09 1999-06-02 Honda Motor Co Ltd マイクロブリッジ構造
US6201243B1 (en) * 1998-07-20 2001-03-13 Institut National D'optique Microbridge structure and method for forming the microbridge structure
JP3363841B2 (ja) * 1999-06-28 2003-01-08 アルプス電気株式会社 薄膜磁気ヘッド及びその製造方法
JP3522595B2 (ja) * 1999-07-14 2004-04-26 Ｔｄｋ株式会社 薄膜磁気ヘッドおよびその製造方法
US6655207B1 (en) * 2000-02-16 2003-12-02 Honeywell International Inc. Flow rate module and integrated flow restrictor
US6586841B1 (en) * 2000-02-23 2003-07-01 Onix Microsystems, Inc. Mechanical landing pad formed on the underside of a MEMS device
US6683387B1 (en) * 2000-06-15 2004-01-27 Advanced Micro Devices, Inc. Flip chip carrier package with adapted landing pads

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